The Technical Field "ウェハ" had 304 patent application filings in the most recent period (2023-01-01 to 2023-03-31). This is a with an decreasing trend transition of -58 filings (-16.0%) over 362 they had in the same period of the previous year (2022-01-01 to 2022-03-31). This report also includes technical terms related to " ウェハー ", " ウェファー ", " ウェーハ ", " ウェーハー ", " ウエハ ", " ウエハー ", " ウエーハ ", " ウエーハー ", " ウエーファ ", " 素子ウエハ ", " 素子ウエハー " in the search set.
The highest number of filings in 2016 with 2,022 cases, and their lowest number in 2022 with 1,404 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 8,775 cases in total) is 1,462, and the median is 1,462. The coefficient of variation (standard deviation/mean) is 0.3, and there have been big fluctuations in the number of filings from year to year.
Index | Value |
---|---|
Average | 1,462 patents |
Std Dev | 441 |
COV | 0.3 |
Year | Cases | YOY |
---|---|---|
2022 year | 1,404 cases | -2.09 % |
2021 year | 1,434 cases | -3.82 % |
2020 year | 1,491 cases | -20.73 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for ウェハ for the period of the last 10 years (2014-01-01 to 2024-11-30). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of ウェハ, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
The changes in the number of patent filings of ウェハ over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
This patent analysis report was created for a patent search set of 16,858 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as ウェハ are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Comparing the number of applications of each company, 株式会社ディスコ has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 398 cases, followed by 三菱電機株式会社 with 40 cases.
Comparing the number of applications of each company, 株式会社ディスコ has the highest number of joint applications in the last for the target period (2014 to 2024) with 2,904 cases, followed by 東京エレクトロン株式会社 with 805 cases.
Name | Cases |
---|---|
株式会社ディスコ | 2,904 cases |
東京エレクトロン株式会社 | 805 cases |
三菱電機株式会社 | 260 cases |
株式会社ニコン | 141 cases |
キヤノン株式会社 | 104 cases |
株式会社東芝 | 97 cases |
ソニーグループ株式会社 | 27 cases |
株式会社日立製作所 | 18 cases |
富士通株式会社 | 13 cases |
パナソニックホールディングス株式会社 | 5 cases |
日本電気株式会社 | 4 cases |
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as ウェハ are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Among the top coapplicants, 株式会社ディスコ has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 398 cases, followed by 三菱電機株式会社 with 40 cases.
Among the top coapplicants, 株式会社ディスコ has the highest number of joint applications in the last for the target period (2014 to 2024) with 2,904 cases, followed by 東京エレクトロン株式会社 with 805 cases.
Below is a ranking of the number of JP patent applications by ウェハ’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by ウェハ’s top 7 coapplicants over the last 20 years.
ウェハ filed 805 joint applications with 東京エレクトロン株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 230 cases in total) is 38.3, and the median is 32.5. The coefficient of variation (standard deviation/mean) is 0.6, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2014 with 158 cases, and their lowest number in 2021 with 23 cases.
Index | Value |
---|---|
Average | 38.3 patents |
Std Dev | 23.9 |
COV | 0.6 |
Year | Cases | YOY |
---|---|---|
2022 year | 26 cases | +13.04 % |
2021 year | 23 cases | -41.0 % |
2020 year | 39 cases | -31.6 % |
ウェハ filed 2,904 joint applications with 株式会社ディスコ for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 1,707 cases in total) is 284, and the median is 273. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2019 with 430 cases, and their lowest number in 2021 with 213 cases.
Index | Value |
---|---|
Average | 284 patents |
Std Dev | 103 |
COV | 0.4 |
Year | Cases | YOY |
---|---|---|
2022 year | 272 cases | +27.70 % |
2021 year | 213 cases | -22.26 % |
2020 year | 274 cases | -36.3 % |
ウェハ filed 18 joint applications with 株式会社日立製作所 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 4 cases in total) is 0.7, and the median is 1.0. The coefficient of variation (standard deviation/mean) is 0.7, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2016 with 6 cases, and their lowest number in 2019 with 0 cases.
Index | Value |
---|---|
Average | 0.7 patents |
Std Dev | 0.5 |
COV | 0.7 |
Year | Cases | YOY |
---|---|---|
2022 year | 1 cases | 0 |
2021 year | 1 cases | 0 |
2020 year | 1 cases | - |
ウェハ filed 97 joint applications with 株式会社東芝 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 44 cases in total) is 7.3, and the median is 8.0. The coefficient of variation (standard deviation/mean) is 0.5, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2014 with 28 cases, and their lowest number in 2018 with 3 cases.
Index | Value |
---|---|
Average | 7.3 patents |
Std Dev | 3.5 |
COV | 0.5 |
Year | Cases | YOY |
---|---|---|
2022 year | 7 cases | -22.22 % |
2021 year | 9 cases | 0 |
2020 year | 9 cases | -30.8 % |
ウェハ filed 141 joint applications with 株式会社ニコン for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 24 cases in total) is 4.0, and the median is 1.0. The coefficient of variation (standard deviation/mean) is 1.9, and there have been very big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2014 with 37 cases, and their lowest number in 2021 with 0 cases.
Index | Value |
---|---|
Average | 4.0 patents |
Std Dev | 7.6 |
COV | 1.9 |
Year | Cases | YOY |
---|---|---|
2022 year | 1 cases | - |
2021 year | 0 cases | -100 % |
2020 year | 1 cases | 0 |
The following shows JP patents held by ウェハ that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and ウェハ’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which ウェハ is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 2 patents/patent applications were invalidation trial more than once in the examination process of other patent applications. The mean of the number of invalidation trial is 1.0. The most invalidation trial patent is 特許6145808 "流体ヒータ" (1 times) , and the next most invalidation trial patent is 特許6642841 "こけら葺き状太陽電池モジュール" (1 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許6145808 | 流体ヒータ | 1 times |
2 | 特許6642841 | こけら葺き状太陽電池モジュール | 1 times |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 15 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7436251 "ダイボンディング装置および半導体装置の製造方法" (Opposition day 2024-08-19) , next is 特許7328807 "ダイシングテープ、及び、ダイシングダイボンドフィルム" (Opposition day 2024-02-14) .
- | No. | Title | Opposition days |
---|---|---|---|
1 | 特許7436251 | ダイボンディング装置および半導体装置の製造方法 | 2024-08-19 |
2 | 特許7328807 | ダイシングテープ、及び、ダイシングダイボンドフィルム | 2024-02-14 |
3 | 特許7307299 | 静電チャック | 2024-01-11 |
4 | 特許7301472 | ウェーハの加工方法 | 2023-12-22 |
5 | 特許7211147 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2023-07-21 |
6 | 特許7212321 | レーザーマーク周辺の隆起を解消するための研磨用組成物 | 2023-07-14 |
7 | 特許7203260 | 静電チャック部材、静電チャック装置及び静電チャック部材の製造方法 | 2023-07-05 |
8 | 特許7146145 | ワークハンドリングシートおよびデバイス製造方法 | 2023-03-31 |
9 | 特許7063334 | 半導体基板加熱用基板載置台および半導体基板加熱ヒータ | 2022-11-02 |
10 | 特許7048395 | 均一性が改善されたケミカルメカニカルポリッシング層の作製方法 | 2022-10-05 |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 74 patents Protest from third parties. The average number of Protest is 1.3 times. The most recently Protest patent is 特開2022-187432 "マッサージ装置、及び、メンテナンス方法" (Protest day 2024-11-06) , next is 特開2023-014749 "シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法" (Protest day 2024-10-24) .
- | No. | Title | Protest days |
---|---|---|---|
1 | 特開2022-187432 | マッサージ装置、及び、メンテナンス方法 | 2024-11-06 |
2 | 特開2023-014749 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-24 |
3 | 特開2022-024328 | 保持装置 | 2024-10-23 |
4 | 特開2021-116225 | シリカ粒子の製造方法、シリカゾルの製造方法、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-16 |
5 | 特開2023-149660 | ウエハ載置台 | 2024-10-16 |
6 | 特開2022-060063 | エポキシ樹脂組成物及び電子部品装置 | 2024-10-09 |
7 | 特開2022-049640 | 半導体用接着剤、並びに、半導体装置及びその製造方法 | 2024-10-09 |
8 | 特開2023-007711 | シリカゾルの製造方法、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-09-27 |
9 | 特許7582200 | 半導体用接着剤、半導体用接着剤シート、及び半導体装置の製造方法 | 2024-09-26 |
10 | 特開2023-013587 | 保持装置 | 2024-09-13 |
11 | 特許7589435 | 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-09-04 |
12 | 特開2024-040302 | 試料保持具 | 2024-08-06 |
13 | 特開2023-040595 | セラミックスヒータ | 2024-07-03 |
14 | 特開2023-040596 | セラミックスヒータ | 2024-07-03 |
15 | 特開2021-190428 | 有機発光素子封止用組成物およびこれにより製造された有機層を含む有機発光表示装置 | 2024-07-02 |
16 | 特表2023-533326 | 高品質の炭化ケイ素種結晶、炭化ケイ素結晶、炭化ケイ素基板およびそれらの製造方法 | 2024-06-12 |
17 | 特開2021-197529 | 保持装置 | 2024-05-28 |
18 | 特許7558886 | 保持装置 | 2024-05-20 |
19 | 特開2022-175820 | 保持装置 | 2024-05-13 |
20 | 特開2023-094576 | 炭化ケイ素粉末、及びこれを用いて炭化ケイ素インゴットを製造する方法 | 2024-05-13 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 130 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.2. The most protest patent is 特許7018168 "感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法" (4 times) , and the next most protest patent is 特許7237828 "エポキシ樹脂組成物、電子部品実装構造体およびその製造方法" (3 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許7018168 | 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法 | 4 times |
2 | 特許7237828 | エポキシ樹脂組成物、電子部品実装構造体およびその製造方法 | 3 times |
3 | 特開2022-024328 | 保持装置 | 3 times |
4 | 特許6636696 | 半導体ウエハのマウント方法および半導体ウエハのマウント装置 | 3 times |
5 | 特許7070010 | キャリアの製造方法および半導体ウェーハの研磨方法 | 3 times |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 122 patents Inspection from third parties. The average number of Inspection is 1.4 times. The most recently Inspection patent is 特開2022-060063 "エポキシ樹脂組成物及び電子部品装置" (Inspection day 2024-11-20) , next is 特開2022-049640 "半導体用接着剤、並びに、半導体装置及びその製造方法" (Inspection day 2024-11-20) .
- | No. | Title | Inspection days |
---|---|---|---|
1 | 特開2022-060063 | エポキシ樹脂組成物及び電子部品装置 | 2024-11-20 |
2 | 特開2022-049640 | 半導体用接着剤、並びに、半導体装置及びその製造方法 | 2024-11-20 |
3 | 特開2022-024328 | 保持装置 | 2024-10-29 |
4 | 特許7271993 | セリウム化合物除去用洗浄液、洗浄方法及び半導体ウェハの製造方法 | 2024-10-29 |
5 | 特開2023-014749 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-29 |
6 | 特許7211147 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-28 |
7 | 特許7331436 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-28 |
8 | 特許7331437 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-28 |
9 | 特許7331435 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-28 |
10 | 特許5688453 | フェムト秒レーザ及びプラズマエッチングを用いたウェハダイシング | 2024-10-25 |
11 | 特開2023-007711 | シリカゾルの製造方法、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-24 |
12 | 特開2021-116225 | シリカ粒子の製造方法、シリカゾルの製造方法、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-24 |
13 | 特開2023-149660 | ウエハ載置台 | 2024-10-22 |
14 | 特許7582200 | 半導体用接着剤、半導体用接着剤シート、及び半導体装置の製造方法 | 2024-10-10 |
15 | 特許7589435 | 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-10-09 |
16 | 特許7572464 | 結合研磨物品及びそれを作製する方法 | 2024-10-03 |
17 | 特開2023-013587 | 保持装置 | 2024-09-26 |
18 | 特開2024-040302 | 試料保持具 | 2024-08-23 |
19 | 特表2023-531622 | 線路損失の低い光起電力アレイ構造体 | 2024-08-08 |
20 | 特許7228517 | 改善された周波数特性を有する試験ヘッド | 2024-08-07 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 253 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.3. The most inspection patent is 特許7018168 "感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法" (9 times) , and the next most inspection patent is 特許7582200 "半導体用接着剤、半導体用接着剤シート、及び半導体装置の製造方法" (6 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許7018168 | 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法 | 9 times |
2 | 特許7582200 | 半導体用接着剤、半導体用接着剤シート、及び半導体装置の製造方法 | 6 times |
3 | 特許7190841 | SiCインゴットの製造方法及びSiCウェハの製造方法 | 5 times |
4 | 特許7237828 | エポキシ樹脂組成物、電子部品実装構造体およびその製造方法 | 4 times |
5 | 特許6904899 | 昇華による大径シリコンカーバイド結晶の製造方法及び関連する半導体SICウェハ | 4 times |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 3,916 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 3.0. The most cited patent is 特許6640780 "半導体装置の製造方法および半導体装置" (146 times) , and the next most cited patent is 特許5802323 "エッチング処理方法" (111 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許6640780 | 半導体装置の製造方法および半導体装置 | 146 times |
2 | 特許5802323 | エッチング処理方法 | 111 times |
3 | 特許6554703 | システム | 43 times |
4 | 特許7047046 | マスクブランク用基板、多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法 | 41 times |
5 | 特許6399913 | ウエーハの生成方法 | 37 times |
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