はんだ (JP Patent Analysis Report)
The Technical Field "はんだ" had 493 patent application filings in the most recent period (2022-01-01 to 2022-08-31). This is a with an decreasing trend transition of -110 filings (-18.2%) over 603 they had in the same period of the previous year (2021-01-01 to 2021-08-31). This report also includes technical terms related to " ソルダ ", " ソルダー ", " ハンダ ", " 半田 ", " 軟ろう ", " 軟ロウ ", " 軟鑞 " in the search set.
The highest number of filings in 2014 with 1,813 cases, and their lowest number in 2022 with 609 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 5,389 cases in total) is 898, and the median is 962. The coefficient of variation (standard deviation/mean) is 0.5, and there have been big fluctuations in the number of filings from year to year.
| Index | Value |
|---|---|
| Average | 898 patents |
| Std Dev | 450 |
| COV | 0.5 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 609 cases | -33.2 % |
| 2021 year | 912 cases | -9.97 % |
| 2020 year | 1,013 cases | -24.06 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for はんだ for the period of the last 10 years (2014-01-01 to 2024-04-30). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of はんだ, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
はんだ, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of はんだ over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 12,061 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
はんだ
Same industry / competition company information (JP)
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as はんだ are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
Comparing the number of applications of each company, 三菱電機株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 22 cases, followed by 株式会社デンソー with 19 cases.
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 22 cases |
| 株式会社デンソー | 19 cases |
| 株式会社東芝 | 10 cases |
| 株式会社村田製作所 | 3 cases |
| パナソニックホールディングス株式会社 | 1 cases |
| 株式会社日立製作所 | 1 cases |
| 日本電気株式会社 | 1 cases |
| ソニーグループ株式会社 | 1 cases |
| 住友ベークライト株式会社 | 1 cases |
Trends in filing of joint patent applications for the target period (2014 to 2024).
Comparing the number of applications of each company, 三菱電機株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 532 cases, followed by 株式会社デンソー with 339 cases.
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 532 cases |
| 株式会社デンソー | 339 cases |
| 株式会社村田製作所 | 189 cases |
| 富士通株式会社 | 99 cases |
| 株式会社東芝 | 91 cases |
| 日本電気株式会社 | 65 cases |
| ソニーグループ株式会社 | 40 cases |
| 住友ベークライト株式会社 | 37 cases |
| 株式会社日立製作所 | 31 cases |
| パナソニックホールディングス株式会社 | 13 cases |
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
Top company information (JP)
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as はんだ are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
Among the top coapplicants, 三菱電機株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 22 cases, followed by 株式会社東芝 with 10 cases.
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 22 cases |
| 株式会社東芝 | 10 cases |
| パナソニックホールディングス株式会社 | 1 cases |
| 株式会社日立製作所 | 1 cases |
| 日本電気株式会社 | 1 cases |
Trends in filing of joint patent applications for the target period (2014 to 2024).
Among the top coapplicants, 三菱電機株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 532 cases, followed by 富士通株式会社 with 99 cases.
Top company, Change in the Number of JP Patents
Below is a ranking of the number of JP patent applications by はんだ’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by はんだ’s top 7 coapplicants over the last 20 years.
Top company Details (JP)
Trends in filing of joint patent applications with パナソニックホールディングス株式会社
はんだ filed 13 joint applications with パナソニックホールディングス株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 9 cases in total) is 1.5, and the median is 1.5. The coefficient of variation (standard deviation/mean) is 0.8, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2019 with 3 cases, and their lowest number in 2021 with 0 cases.
| Index | Value |
|---|---|
| Average | 1.5 patents |
| Std Dev | 1.3 |
| COV | 0.8 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 1 cases | - |
| 2021 year | 0 cases | -100 % |
| 2020 year | 3 cases | 0 |
Trends in filing of joint patent applications with 株式会社日立製作所
はんだ filed 31 joint applications with 株式会社日立製作所 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 5 cases in total) is 0.8, and the median is 0.5. The coefficient of variation (standard deviation/mean) is 1.3, and there have been very big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2014 with 13 cases, and their lowest number in 2019 with 0 cases.
| Index | Value |
|---|---|
| Average | 0.8 patents |
| Std Dev | 1.1 |
| COV | 1.3 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 1 cases | 0 |
| 2021 year | 1 cases | -66.7 % |
| 2020 year | 3 cases | - |
Trends in filing of joint patent applications with 三菱電機株式会社
はんだ filed 532 joint applications with 三菱電機株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 231 cases in total) is 38.5, and the median is 38.5. The coefficient of variation (standard deviation/mean) is 0.6, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2014 with 83 cases, and their lowest number in 2022 with 21 cases.
| Index | Value |
|---|---|
| Average | 38.5 patents |
| Std Dev | 23.5 |
| COV | 0.6 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 21 cases | -34.4 % |
| 2021 year | 32 cases | -28.89 % |
| 2020 year | 45 cases | -28.57 % |
Trends in filing of joint patent applications with 日本電気株式会社
はんだ filed 65 joint applications with 日本電気株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 15 cases in total) is 2.5, and the median is 1.5. The coefficient of variation (standard deviation/mean) is 0.9, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2016 with 16 cases, and their lowest number in 2022 with 1 cases.
| Index | Value |
|---|---|
| Average | 2.5 patents |
| Std Dev | 2.4 |
| COV | 0.9 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 1 cases | 0 |
| 2021 year | 1 cases | -50.0 % |
| 2020 year | 2 cases | -50.0 % |
Trends in filing of joint patent applications with 株式会社東芝
はんだ filed 91 joint applications with 株式会社東芝 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 47 cases in total) is 7.8, and the median is 8.5. The coefficient of variation (standard deviation/mean) is 0.3, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2014 with 17 cases, and their lowest number in 2015 with 6 cases.
| Index | Value |
|---|---|
| Average | 7.8 patents |
| Std Dev | 2.7 |
| COV | 0.3 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 8 cases | -20.00 % |
| 2021 year | 10 cases | +11.11 % |
| 2020 year | 9 cases | +12.50 % |
Information on important patents (JP)
The following shows JP patents held by はんだ that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and はんだ’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which はんだ is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
Glossary
- Cited
- Indicates that the patent/patent application has been cited (by Examiners) in notices of reasons for rejection in the examination process of other (Japanese, U.S., or European) patent applications. The higher the number of citations, the more important the patent/patent application is considered to be.
- Request for invalidation trial
- Indicates that a third party has requested a procedure to invalidate the patent. It is likely to affect the business of third parties and is considered to be of high importance.
- Opposition
- Indicates that a third party has filed a petition with the Patent Office to hear the validity of the patent again. Like the trial for invalidation, it is considered to be of high importance.
- Information provision
- Indicates that a third party has provided the Patent Office with useful information for examination for the patent filed. It is usually considered to be of high importance because it is done to prevent the patent from being granted.
- Browsing request
- Indicates that a third party has requested the Patent Office to view the patent bag (a set of documents exchanged between the Patent Office and the applicant). The bag is often checked prior to trial for invalidation, opposition, and provision of information, and is considered to be a highly important patent.
Invalidationed Trial cases
List of latest Invalidationed Trial patents
In the last 3 years (2021-05-01 ~ 2024-04-30), there were 2 patents Invalidation Trial from third parties. The average number of Invalidation Trial is 2.0 times. The most recently Invalidation Trial patent is 特許6709968 "配線器具" (Invalidation Trial day 2022-06-29) , next is 特許4192197 "メタルマスク及びその製造方法" (Invalidation Trial day 2022-02-14) .
| - | No. | Title | Invalidation Trial days |
|---|---|---|---|
| 1 | 特許6709968 | 配線器具 | 2022-06-29 |
| 2 | 特許4192197 | メタルマスク及びその製造方法 | 2022-02-14 |
Top Patents/Patent Applications with the Highest Number of Invalidationed Trial
Of the patent applications filed in the last 10 years (2014-05-01 to 2024-04-30), 3 patents/patent applications were invalidation trial more than once in the examination process of other patent applications. The mean of the number of invalidation trial is 1.0. The most invalidation trial patent is 特許6138324 "半田付け装置、半田付け方法、プリント基板の製造方法、および製品の製造方法" (1 times) , and the next most invalidation trial patent is 特許5723056 "はんだ合金、ソルダペーストおよび電子回路基板" (1 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6138324 | 半田付け装置、半田付け方法、プリント基板の製造方法、および製品の製造方法 | 1 times |
| 2 | 特許5723056 | はんだ合金、ソルダペーストおよび電子回路基板 | 1 times |
| 3 | 特許6709968 | 配線器具 | 1 times |
Oppositioned cases
List of latest Oppositioned patents
In the last 3 years (2021-05-01 ~ 2024-04-30), there were 21 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7293528 "接着剤樹脂組成物" (Opposition day 2023-12-05) , next is 特許7284923 "エンコーダ、サーボモータ、サーボシステム" (Opposition day 2023-11-27) .
| - | No. | Title | Opposition days |
|---|---|---|---|
| 1 | 特許7293528 | 接着剤樹脂組成物 | 2023-12-05 |
| 2 | 特許7284923 | エンコーダ、サーボモータ、サーボシステム | 2023-11-27 |
| 3 | 特許7231527 | 保護素子用ヒューズ素子およびそれを利用した保護素子 | 2023-08-31 |
| 4 | 特許7204485 | ＵＶ－ＬＥＤフォトリアクタのための放熱装置および方法 | 2023-07-14 |
| 5 | 特許7143659 | 金属ベース基板 | 2023-03-27 |
| 6 | 特許7147313 | 金属ベース基板 | 2023-03-24 |
| 7 | 特許7114940 | 樹脂組成物膜の製造方法、樹脂シートの製造方法、Ｂステージシートの製造方法、Ｃステージシートの製造方法、樹脂付金属箔の製造方法及び金属基板の製造方法 | 2023-02-09 |
| 8 | 特許7091519 | 配列用マスク | 2022-12-20 |
| 9 | 特許7089491 | フラックス組成物、ソルダペースト及び電子回路基板 | 2022-12-19 |
| 10 | 特許7050019 | 保護素子 | 2022-10-04 |
Protested cases
List of latest Protested patents
In the last 3 years (2021-05-01 ~ 2024-04-30), there were 44 patents Protest from third parties. The average number of Protest is 1.3 times. The most recently Protest patent is 特開2022-102442 "導電性樹脂組成物、並びに、それを用いた回路基板および回路基板の製造方法" (Protest day 2024-02-15) , next is 特許7450318 "はんだ組成物およびフレキシブル回路基板の製造方法" (Protest day 2024-02-13) .
| - | No. | Title | Protest days |
|---|---|---|---|
| 1 | 特開2022-102442 | 導電性樹脂組成物、並びに、それを用いた回路基板および回路基板の製造方法 | 2024-02-15 |
| 2 | 特許7450318 | はんだ組成物およびフレキシブル回路基板の製造方法 | 2024-02-13 |
| 3 | 特開2023-036536 | はんだ組成物および電子基板の製造方法 | 2024-02-08 |
| 4 | 特開2021-150495 | 生産システム | 2024-02-01 |
| 5 | 特許7478173 | フラックス組成物、およびはんだ組成物 | 2023-12-25 |
| 6 | 特表2022-549450 | 電子アセンブリのための工学材料 | 2023-11-06 |
| 7 | 特許7377719 | 光射出装置、及び、光射出装置の製造方法 | 2023-10-26 |
| 8 | 特開2023-127903 | はんだ組成物および電子基板 | 2023-10-25 |
| 9 | 特許7381644 | 銅合金の製造方法 | 2023-06-15 |
| 10 | 特許7383388 | 硬化性組成物、ドライフィルム、硬化物および電子部品 | 2023-06-12 |
| 11 | 特開2020-202012 | 端子及びコネクタ | 2023-04-12 |
| 12 | 特許7473216 | レーザ半田付け装置 | 2023-03-29 |
| 13 | 特許7361481 | はんだ組成物および電子基板の製造方法 | 2023-03-13 |
| 14 | 特表2022-528805 | 光音響ガスセンサデバイス | 2023-03-09 |
| 15 | 特許7331579 | 鉛フリーはんだフラックス、鉛フリーソルダペースト | 2023-02-22 |
| 16 | 特許7415443 | 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及び、プリント配線板の製造方法 | 2023-02-03 |
| 17 | 特許7349514 | 電子膨張弁 | 2023-02-01 |
| 18 | 特開2021-003730 | フラックス及びソルダペースト | 2023-01-27 |
| 19 | 特許7324180 | 超音波内視鏡 | 2022-12-12 |
| 20 | 特表2022-546078 | 高温超高信頼性合金 | 2022-12-09 |
Top Patents/Patent Applications with the Highest Number of Protested
Of the patent applications filed in the last 10 years (2014-05-01 to 2024-04-30), 125 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.4. The most protest patent is 特許6718232 "ポリアリーレンスルフィド樹脂組成物及びその成形品、並びに表面実装電子部品" (5 times) , and the next most protest patent is 特許6913064 "はんだ組成物および電子基板の製造方法" (4 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6718232 | ポリアリーレンスルフィド樹脂組成物及びその成形品、並びに表面実装電子部品 | 5 times |
| 2 | 特許6913064 | はんだ組成物および電子基板の製造方法 | 4 times |
| 3 | 特許7257855 | ポリアリーレンスルフィド樹脂組成物及びその成形品、並びに表面実装電子部品 | 4 times |
| 4 | 特開2016-090413 | 熱式空気流量計 | 4 times |
| 5 | 特許6585572 | フラックス組成物及びソルダペースト | 3 times |
Inspectioned cases
List of latest Inspectioned patents
In the last 3 years (2021-05-01 ~ 2024-04-30), there were 52 patents Inspection from third parties. The average number of Inspection is 1.3 times. The most recently Inspection patent is 特開2023-137985 "メモリシステム" (Inspection day 2024-03-18) , next is 特許7450318 "はんだ組成物およびフレキシブル回路基板の製造方法" (Inspection day 2024-03-06) .
| - | No. | Title | Inspection days |
|---|---|---|---|
| 1 | 特開2023-137985 | メモリシステム | 2024-03-18 |
| 2 | 特許7450318 | はんだ組成物およびフレキシブル回路基板の製造方法 | 2024-03-06 |
| 3 | 特開2022-102442 | 導電性樹脂組成物、並びに、それを用いた回路基板および回路基板の製造方法 | 2024-02-26 |
| 4 | 特許7455564 | 太陽電池の製造方法 | 2024-02-21 |
| 5 | 特開2022-148224 | ハンダペースト用水溶性フラックス及びハンダペースト | 2024-02-20 |
| 6 | 特開2021-150495 | 生産システム | 2024-02-07 |
| 7 | 特許7478173 | フラックス組成物、およびはんだ組成物 | 2024-01-25 |
| 8 | 特許5085853 | 積層構造における電気的な交差を提供する方法 | 2024-01-09 |
| 9 | 特表2022-549450 | 電子アセンブリのための工学材料 | 2023-12-01 |
| 10 | 特許7377719 | 光射出装置、及び、光射出装置の製造方法 | 2023-11-21 |
| 11 | 特開2022-138840 | 気密端子の接続具および気密端子 | 2023-10-10 |
| 12 | 特許6374977 | ＳＳＤ部品及びＳＳＤ | 2023-09-07 |
| 13 | 特表2022-536902 | 導電性水性媒体中で機能停止する電池及びその製造方法 | 2023-08-31 |
| 14 | 特開2023-036536 | はんだ組成物および電子基板の製造方法 | 2023-08-29 |
| 15 | 特開2024-019148 | エヌエフシーの機能を有する無線充電装置 | 2023-08-28 |
| 16 | 特許7357186 | 電極接続素子、これを備える発光装置及び発光装置の製造方法 | 2023-08-02 |
| 17 | 特許7383388 | 硬化性組成物、ドライフィルム、硬化物および電子部品 | 2023-07-06 |
| 18 | 特開2022-007121 | 鉛フリーはんだ合金とその接合体 | 2023-06-29 |
| 19 | 特開2020-202012 | 端子及びコネクタ | 2023-06-01 |
| 20 | 特許7473216 | レーザ半田付け装置 | 2023-03-31 |
Top Patents/Patent Applications with the Highest Number of Inspectioned
Of the patent applications filed in the last 10 years (2014-05-01 to 2024-04-30), 179 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.3. The most inspection patent is 特許6444953 "フラックス組成物およびソルダペースト" (8 times) , and the next most inspection patent is 特許7257855 "ポリアリーレンスルフィド樹脂組成物及びその成形品、並びに表面実装電子部品" (7 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6444953 | フラックス組成物およびソルダペースト | 8 times |
| 2 | 特許7257855 | ポリアリーレンスルフィド樹脂組成物及びその成形品、並びに表面実装電子部品 | 7 times |
| 3 | 特許6718232 | ポリアリーレンスルフィド樹脂組成物及びその成形品、並びに表面実装電子部品 | 7 times |
| 4 | 特開2016-090413 | 熱式空気流量計 | 4 times |
| 5 | 特許6585572 | フラックス組成物及びソルダペースト | 3 times |
Cited cases
Top Patents/Patent Applications with the Highest Number of Cited
Of the patent applications filed in the last 10 years (2014-05-01 to 2024-04-30), 2,874 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.6. The most cited patent is 特許6293095 "ヒューズ付き気密端子" (83 times) , and the next most cited patent is 特許6717559 "半田合金及び半田粉" (68 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6293095 | ヒューズ付き気密端子 | 83 times |
| 2 | 特許6717559 | 半田合金及び半田粉 | 68 times |
| 3 | 特開2017-070140 | 折り曲げにより形成された円筒形状のコイル体、該コイル体の製造方法、及び該コイル体を用いた回転電機 | 57 times |
| 4 | 特許6290389 | 波長変換層を有するＬＥＤディスプレイ | 30 times |
| 5 | 特開2017-192987 | 半田組成物及び半田付け製品の製造方法 | 29 times |
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