The Technical Field "膨張係数" had 69 patent application filings in the most recent period (2023-01-01 to 2023-02-28). This is a significantly decreased of -41 filings (-37.3%) over 110 they had in the same period of the previous year (2022-01-01 to 2022-02-28). This report also includes technical terms related to " 膨ちょう係数 ", " 膨ちょう度 ", " 膨ちょう率 ", " 膨張度 ", " 膨張率 " in the search set.
The highest number of filings in 2015 with 1,443 cases, and their lowest number in 2022 with 704 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 5,078 cases in total) is 846, and the median is 866. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
Index | Value |
---|---|
Average | 846 patents |
Std Dev | 314 |
COV | 0.4 |
Year | Cases | YOY |
---|---|---|
2022 year | 704 cases | -14.87 % |
2021 year | 827 cases | -8.72 % |
2020 year | 906 cases | -21.76 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 膨張係数 for the period of the last 10 years (2014-01-01 to 2024-10-31). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 膨張係数, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
The changes in the number of patent filings of 膨張係数 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
This patent analysis report was created for a patent search set of 10,679 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as 膨張係数 are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Comparing the number of applications of each company, キヤノン株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 35 cases, followed by AGC株式会社 with 16 cases.
Name | Cases |
---|---|
キヤノン株式会社 | 35 cases |
AGC株式会社 | 16 cases |
株式会社デンソー | 15 cases |
トヨタ自動車株式会社 | 14 cases |
三菱電機株式会社 | 12 cases |
日本電気硝子株式会社 | 12 cases |
株式会社東芝 | 6 cases |
住友電気工業株式会社 | 4 cases |
株式会社日立製作所 | 3 cases |
京セラ株式会社 | 3 cases |
パナソニックホールディングス株式会社 | 1 cases |
Comparing the number of applications of each company, 日本電気硝子株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 247 cases, followed by 株式会社デンソー with 247 cases.
Name | Cases |
---|---|
日本電気硝子株式会社 | 247 cases |
株式会社デンソー | 247 cases |
AGC株式会社 | 241 cases |
トヨタ自動車株式会社 | 229 cases |
キヤノン株式会社 | 224 cases |
三菱電機株式会社 | 221 cases |
京セラ株式会社 | 145 cases |
住友電気工業株式会社 | 120 cases |
株式会社東芝 | 105 cases |
株式会社日立製作所 | 32 cases |
パナソニックホールディングス株式会社 | 13 cases |
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as 膨張係数 are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Among the top coapplicants, キヤノン株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 35 cases, followed by トヨタ自動車株式会社 with 14 cases.
Name | Cases |
---|---|
キヤノン株式会社 | 35 cases |
トヨタ自動車株式会社 | 14 cases |
三菱電機株式会社 | 12 cases |
株式会社東芝 | 6 cases |
株式会社日立製作所 | 3 cases |
京セラ株式会社 | 3 cases |
パナソニックホールディングス株式会社 | 1 cases |
Among the top coapplicants, トヨタ自動車株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 229 cases, followed by キヤノン株式会社 with 224 cases.
Name | Cases |
---|---|
トヨタ自動車株式会社 | 229 cases |
キヤノン株式会社 | 224 cases |
三菱電機株式会社 | 221 cases |
京セラ株式会社 | 145 cases |
株式会社東芝 | 105 cases |
株式会社日立製作所 | 32 cases |
パナソニックホールディングス株式会社 | 13 cases |
Below is a ranking of the number of JP patent applications by 膨張係数’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 膨張係数’s top 7 coapplicants over the last 20 years.
膨張係数 filed 32 joint applications with 株式会社日立製作所 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 11 cases in total) is 1.8, and the median is 2.0. The coefficient of variation (standard deviation/mean) is 0.6, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been increasing for the last 3 years (2020 to 2023). The highest number of filings in 2014 with 8 cases, and their lowest number in 2020 with 1 cases.
Index | Value |
---|---|
Average | 1.8 patents |
Std Dev | 1.1 |
COV | 0.6 |
Year | Cases | YOY |
---|---|---|
2022 year | 3 cases | +50.0 % |
2021 year | 2 cases | +100 % |
2020 year | 1 cases | -66.7 % |
膨張係数 filed 13 joint applications with パナソニックホールディングス株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 8 cases in total) is 1.3, and the median is 1.0. The coefficient of variation (standard deviation/mean) is 0.9, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2014 with 4 cases, and their lowest number in 2022 with 0 cases.
Index | Value |
---|---|
Average | 1.3 patents |
Std Dev | 1.2 |
COV | 0.9 |
Year | Cases | YOY |
---|---|---|
2022 year | 0 cases | -100 % |
2021 year | 1 cases | - |
2020 year | 0 cases | -100 % |
膨張係数 filed 145 joint applications with 京セラ株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 58 cases in total) is 9.7, and the median is 8.5. The coefficient of variation (standard deviation/mean) is 0.8, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2015 with 25 cases, and their lowest number in 2022 with 3 cases.
Index | Value |
---|---|
Average | 9.7 patents |
Std Dev | 8.1 |
COV | 0.8 |
Year | Cases | YOY |
---|---|---|
2022 year | 3 cases | 0 |
2021 year | 3 cases | -78.6 % |
2020 year | 14 cases | -36.4 % |
膨張係数 filed 105 joint applications with 株式会社東芝 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 31 cases in total) is 5.2, and the median is 4.0. The coefficient of variation (standard deviation/mean) is 0.6, and there have been big fluctuations in the number of filings from year to year.
The highest number of filings in 2015 with 27 cases, and their lowest number in 2022 with 4 cases.
Index | Value |
---|---|
Average | 5.2 patents |
Std Dev | 2.9 |
COV | 0.6 |
Year | Cases | YOY |
---|---|---|
2022 year | 4 cases | 0 |
2021 year | 4 cases | 0 |
2020 year | 4 cases | -33.3 % |
膨張係数 filed 221 joint applications with 三菱電機株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 94 cases in total) is 15.7, and the median is 17.0. The coefficient of variation (standard deviation/mean) is 0.5, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2016 with 37 cases, and their lowest number in 2022 with 6 cases.
Index | Value |
---|---|
Average | 15.7 patents |
Std Dev | 8.0 |
COV | 0.5 |
Year | Cases | YOY |
---|---|---|
2022 year | 6 cases | -50.0 % |
2021 year | 12 cases | -45.5 % |
2020 year | 22 cases | -12.00 % |
The following shows JP patents held by 膨張係数 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 膨張係数’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 膨張係数 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
In the last 3 years (2021-11-01 ~ 2024-10-31), there were 35 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7421315 "耐火性モルタル、コークス炉の築炉方法及び耐火性モルタルの選定方法" (Opposition day 2024-07-10) , next is 特許7406854 "球状シリカ粉末充填剤の調製方法、これによって得られた粉末充填剤およびその使用" (Opposition day 2024-06-26) .
- | No. | Title | Opposition days |
---|---|---|---|
1 | 特許7421315 | 耐火性モルタル、コークス炉の築炉方法及び耐火性モルタルの選定方法 | 2024-07-10 |
2 | 特許7406854 | 球状シリカ粉末充填剤の調製方法、これによって得られた粉末充填剤およびその使用 | 2024-06-26 |
3 | 特許7401943 | 球状シリカ粉末充填剤の調製方法、これによって得られた粉末充填剤およびその使用 | 2024-06-18 |
4 | 特許7394178 | 保持装置 | 2024-06-03 |
5 | 特許7455017 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-05-20 |
6 | 特許7454906 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-05-20 |
7 | 特許7309642 | 高温水蒸気電解水素製造用セル及び高温水蒸気電解水素製造用セルの製造方法 | 2024-01-17 |
8 | 特許7294715 | ポリアミド樹脂組成物およびポリアミド樹脂組成物の製造方法 | 2023-12-20 |
9 | 特許7276812 | 耐熱粘土原料および耐熱陶磁器 | 2023-11-16 |
10 | 特許7276044 | ブロック耐火物 | 2023-11-13 |
In the last 3 years (2021-11-01 ~ 2024-10-31), there were 78 patents Protest from third parties. The average number of Protest is 1.6 times. The most recently Protest patent is 特開2024-047383 "樹脂組成物" (Protest day 2024-09-24) , next is 特開2024-046200 "樹脂成形品のボイドを予測する方法、樹脂成形品のボイドを低減する方法、樹脂成形品のボイドを予測するためのプログラム及び樹脂成形品のボイドを低減するためのプログラム" (Protest day 2024-09-19) .
- | No. | Title | Protest days |
---|---|---|---|
1 | 特開2024-047383 | 樹脂組成物 | 2024-09-24 |
2 | 特開2024-046200 | 樹脂成形品のボイドを予測する方法、樹脂成形品のボイドを低減する方法、樹脂成形品のボイドを予測するためのプログラム及び樹脂成形品のボイドを低減するためのプログラム | 2024-09-19 |
3 | 特開2021-055077 | 二軸配向ポリエステルフィルム | 2024-09-06 |
4 | 特開2023-083776 | 電気化学装置 | 2024-08-30 |
5 | 特開2024-046684 | 保持装置 | 2024-07-23 |
6 | 特開2021-125415 | 蓄電装置用外装材及びこれを用いた蓄電装置 | 2024-06-28 |
7 | 特開2024-022613 | 保持装置 | 2024-06-21 |
8 | 特開2023-023598 | アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-06-14 |
9 | 特開2022-070657 | 樹脂組成物 | 2024-06-12 |
10 | 特許7538212 | ポリマーフィルムおよび通信用基板 | 2024-05-28 |
11 | 特許7549276 | 積層接合材料、半導体パッケージおよびパワーモジュール | 2024-05-17 |
12 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 2024-05-13 |
13 | 特開2021-182621 | 積層体、組成物及び積層体の製造方法 | 2024-04-16 |
14 | 特開2022-087332 | 有機EL表示素子用封止剤 | 2024-04-15 |
15 | 特許7515298 | 建築物用構造体 | 2024-04-10 |
16 | 特開2023-011293 | 光硬化性マレイミド樹脂組成物 | 2024-03-26 |
17 | 特許7528985 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-03-18 |
18 | 特許7065746 | 有機EL表示素子用封止剤 | 2024-03-06 |
19 | 特表2023-548020 | SMDタイプTCOデバイス | 2024-02-08 |
20 | 特開2022-072979 | 繊維強化複合材料成形品及びその製造方法 | 2024-02-07 |
Of the patent applications filed in the last 10 years (2014-11-01 to 2024-10-31), 182 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.5. The most protest patent is 特許6902510 "高靭性ポリアミド−セルロース樹脂組成物" (8 times) , and the next most protest patent is 特許7394178 "保持装置" (6 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許6902510 | 高靭性ポリアミド−セルロース樹脂組成物 | 8 times |
2 | 特許7394178 | 保持装置 | 6 times |
3 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 5 times |
4 | 特許7101141 | 排水用配管材、配管構造体及び排水用配管材の製造方法 | 5 times |
5 | 特許7149176 | CVDを用いたTaCコーティング層の製造方法及びそれを用いて製造したTaCの物性 | 4 times |
In the last 3 years (2021-11-01 ~ 2024-10-31), there were 91 patents Inspection from third parties. The average number of Inspection is 2.4 times. The most recently Inspection patent is 特開2024-046684 "保持装置" (Inspection day 2024-08-21) , next is 特許7538212 "ポリマーフィルムおよび通信用基板" (Inspection day 2024-08-09) .
- | No. | Title | Inspection days |
---|---|---|---|
1 | 特開2024-046684 | 保持装置 | 2024-08-21 |
2 | 特許7538212 | ポリマーフィルムおよび通信用基板 | 2024-08-09 |
3 | 特開2023-093151 | 金属-FRP複合体の製造方法および金属-FRP複合体 | 2024-08-01 |
4 | 特開2021-125415 | 蓄電装置用外装材及びこれを用いた蓄電装置 | 2024-07-29 |
5 | 特開2023-023598 | アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-07-18 |
6 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 2024-06-26 |
7 | 特開2024-022613 | 保持装置 | 2024-06-26 |
8 | 特開2022-070657 | 樹脂組成物 | 2024-06-24 |
9 | 特開2023-162905 | 樹脂剛直高分子複合体の製造方法及び樹脂剛直高分子複合体 | 2024-06-19 |
10 | 特表2017-504615 | パロノセトロンを含有する薬学組成物 | 2024-05-30 |
11 | 特許5186582 | 転がり軸受 | 2024-05-21 |
12 | 特許7515298 | 建築物用構造体 | 2024-04-30 |
13 | 特許7528985 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-04-30 |
14 | 特開2022-087332 | 有機EL表示素子用封止剤 | 2024-04-23 |
15 | 特開2023-011293 | 光硬化性マレイミド樹脂組成物 | 2024-04-03 |
16 | 特許7065746 | 有機EL表示素子用封止剤 | 2024-03-26 |
17 | 特表2023-548020 | SMDタイプTCOデバイス | 2024-03-22 |
18 | 特開2022-072979 | 繊維強化複合材料成形品及びその製造方法 | 2024-03-07 |
19 | 特開2022-069001 | 繊維強化複合材料の製造方法 | 2024-03-05 |
20 | 特許7535880 | 薄板モールドプレス成形用フツリン酸光学ガラス、マルチプレス用フツリン酸光学ガラス、光学素子、プリフォーム及びレンズ | 2024-02-28 |
Of the patent applications filed in the last 10 years (2014-11-01 to 2024-10-31), 214 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.7. The most inspection patent is 特許6902510 "高靭性ポリアミド−セルロース樹脂組成物" (19 times) , and the next most inspection patent is 特表2017-504615 "パロノセトロンを含有する薬学組成物" (16 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許6902510 | 高靭性ポリアミド−セルロース樹脂組成物 | 19 times |
2 | 特表2017-504615 | パロノセトロンを含有する薬学組成物 | 16 times |
3 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 9 times |
4 | 特許7005121 | 無加圧接合用銅ペースト、接合体、及び半導体装置 | 8 times |
5 | 特開2016-130325 | ポリイミド及びポリイミド前駆体 | 7 times |
Of the patent applications filed in the last 10 years (2014-11-01 to 2024-10-31), 2,385 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.8. The most cited patent is 特許7308011 "プロピレン系樹脂組成物およびその製造方法、ならびに該プロピレン系樹脂組成物を用いた成形体" (47 times) , and the next most cited patent is 特許5910763 "弾性波装置" (35 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許7308011 | プロピレン系樹脂組成物およびその製造方法、ならびに該プロピレン系樹脂組成物を用いた成形体 | 47 times |
2 | 特許5910763 | 弾性波装置 | 35 times |
3 | 特許6672616 | 樹脂組成物、接着フィルム、プリント配線板及び半導体装置 | 34 times |
4 | 特許6550872 | プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置 | 30 times |
5 | 特許6294417 | 光半導体装置および光半導体装置の製造方法 | 28 times |
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