半導体または固体装置の封緘、被覆の形成技術 (JP Patent Analysis Report)
The Theme Code "半導体または固体装置の封緘、被覆の形成技術" had 40 patent application filings in the most recent period (2023-01-01 to 2023-04-30). This is a weakly transition of -4 filings (-9.1%) over 44 they had in the same period of the previous year (2022-01-01 to 2022-04-30).
The highest number of filings in 2016 with 279 cases, and their lowest number in 2023 with 56 cases.
The mean of the number of filings over the last 5 years (2019 to 2024, 672 cases in total) is 112, and the median is 117. The coefficient of variation (standard deviation/mean) is 0.6, and there have been relatively large fluctuations in the number of filings from year to year.
| Index | Value |
|---|---|
| Average | 112 patents |
| Std Dev | 68.2 |
| COV | 0.6 |
| Year | Cases | YOY |
|---|---|---|
| 2023 year | 56 cases | -46.2 % |
| 2022 year | 104 cases | -20.00 % |
| 2021 year | 130 cases | -28.96 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 半導体または固体装置の封緘、被覆の形成技術[5F061] for the period of the last 10 years (2015-01-01 to 2024-12-31). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 半導体または固体装置の封緘、被覆の形成技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
- Table of Contents
- Foreign Patent Analysis Report
- Patent Filing Summary for 半導体または固体装置の封緘、被覆の形成技術
- Search Set (Search Formula/Analysis Patents)
- Related Patent Analysis Report
- Competitors Information
- Top company Information
- • Information on Important Patents
- Provision of patent information to the media
- About this Site
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
半導体または固体装置の封緘、被覆の形成技術, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 半導体または固体装置の封緘、被覆の形成技術 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Patent Landscape ({{ld.d.db_name | country_map: 'en'}})
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 半導体または固体装置の封緘、被覆の形成技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
In addition, by visually representing the patent data in this manner, you can convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
In Patent Integration, you can check the specifics of a patent filing by clicking anywhere on the patent landscape screen. You can also quickly check the position of each applicant for each technical field by cross-referencing with other keywords and patent classifications. You can use it as a guide when considering hypotheses about each company's IP strategy on the IP Landscape. You can also use it for higher-grade intellectual property activities. It has reasonable pricing and a simple user interface that is easy for beginners to handle.
Characteristic Terms (Importance)
The following is a list of words (characteristic terms) often used in 半導体または固体装置の封緘、被覆の形成技術 patent applications. Characteristic terms with a higher importance are used in more patents/patent applications.
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 1,643 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
半導体または固体装置の封緘、被覆の形成技術[5F061]
Same industry / competition company information (JP)
The patent information of the higher applicant in the technical theme 半導体または固体装置の封緘、被覆の形成技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
Comparing the number of applications of each company, アピックヤマダ株式会社 has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 9 cases, followed by TOWA株式会社 with 4 cases.
Trends in filing of joint patent applications for the target period (2015 to 2025).
Comparing the number of applications of each company, TOWA株式会社 has the highest number of joint applications in the last for the target period (2015 to 2025) with 112 cases, followed by アピックヤマダ株式会社 with 107 cases.
| Name | Cases |
|---|---|
| TOWA株式会社 | 112 cases |
| アピックヤマダ株式会社 | 107 cases |
| 三菱電機株式会社 | 84 cases |
| 株式会社デンソー | 53 cases |
| 日東電工株式会社 | 51 cases |
| 株式会社東芝 | 14 cases |
| 富士通株式会社 | 7 cases |
| 日本電気株式会社 | 4 cases |
| ソニーグループ株式会社 | 3 cases |
| 株式会社日立製作所 | 2 cases |
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
Top company information (JP)
The patent information of the higher applicant in the technical theme 半導体または固体装置の封緘、被覆の形成技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
among the top coapplicants, アピックヤマダ株式会社 has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 9 cases, followed by TOWA株式会社 with 4 cases.
| Name | Cases |
|---|---|
| アピックヤマダ株式会社 | 9 cases |
| TOWA株式会社 | 4 cases |
| 三菱電機株式会社 | 1 cases |
| 株式会社東芝 | 1 cases |
| 日本電気株式会社 | 1 cases |
Trends in filing of joint patent applications for the target period (2015 to 2025).
among the top coapplicants, TOWA株式会社 has the highest number of joint applications in the last for the target period (2015 to 2025) with 112 cases, followed by アピックヤマダ株式会社 with 107 cases.
Top company, Change in the Number of JP Patents
Below is a ranking of the number of JP patent applications by 半導体または固体装置の封緘、被覆の形成技術’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 半導体または固体装置の封緘、被覆の形成技術’s top 7 coapplicants over the last 20 years.
Top company Details (JP)
Trends in filing of joint patent applications with 三菱電機株式会社
半導体または固体装置の封緘、被覆の形成技術 filed 84 joint applications with 三菱電機株式会社 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 44 cases in total) is 7.3, and the median is 8.0. The coefficient of variation (standard deviation/mean) is 0.8, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2020 with 15 cases, and their lowest number in 2023 with 1 cases.
| Index | Value |
|---|---|
| Average | 7.3 patents |
| Std Dev | 5.7 |
| COV | 0.8 |
| Year | Cases | YOY |
|---|---|---|
| 2023 year | 1 cases | -80.0 % |
| 2022 year | 5 cases | -58.3 % |
| 2021 year | 12 cases | -20.00 % |
Trends in filing of joint patent applications with 株式会社東芝
半導体または固体装置の封緘、被覆の形成技術 filed 14 joint applications with 株式会社東芝 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 5 cases in total) is 0.8, and the median is 0.5. The coefficient of variation (standard deviation/mean) is 1.3, and there have been very big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2021 to 2024). The highest number of filings in 2017 with 3 cases, and their lowest number in 2020 with 0 cases.
| Index | Value |
|---|---|
| Average | 0.8 patents |
| Std Dev | 1.1 |
| COV | 1.3 |
| Year | Cases | YOY |
|---|---|---|
| 2023 year | 1 cases | -66.7 % |
| 2022 year | 3 cases | +200 % |
| 2021 year | 1 cases | - |
Trends in filing of joint patent applications with 日本電気株式会社
半導体または固体装置の封緘、被覆の形成技術 filed 4 joint applications with 日本電気株式会社 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 2 cases in total) is 0.3, and the median is 0. The coefficient of variation (standard deviation/mean) is 1.4, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2016 with 2 cases, and their lowest number in 2022 with 0 cases.
| Index | Value |
|---|---|
| Average | 0.3 patents |
| Std Dev | 0.5 |
| COV | 1.4 |
| Year | Cases | YOY |
|---|---|---|
| 2023 year | 1 cases | - |
| 2022 year | 0 cases | - |
| 2021 year | 0 cases | -100 % |
Trends in filing of joint patent applications with アピックヤマダ株式会社
半導体または固体装置の封緘、被覆の形成技術 filed 107 joint applications with アピックヤマダ株式会社 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 66 cases in total) is 11.0, and the median is 11.5. The coefficient of variation (standard deviation/mean) is 0.8, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2021 to 2024). The highest number of filings in 2022 with 22 cases, and their lowest number in 2019 with 1 cases.
| Index | Value |
|---|---|
| Average | 11.0 patents |
| Std Dev | 8.5 |
| COV | 0.8 |
| Year | Cases | YOY |
|---|---|---|
| 2023 year | 9 cases | -59.1 % |
| 2022 year | 22 cases | +57.1 % |
| 2021 year | 14 cases | -30.0 % |
Trends in filing of joint patent applications with TOWA株式会社
半導体または固体装置の封緘、被覆の形成技術 filed 112 joint applications with TOWA株式会社 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 53 cases in total) is 8.8, and the median is 8.5. The coefficient of variation (standard deviation/mean) is 0.7, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2016 with 22 cases, and their lowest number in 2023 with 4 cases.
| Index | Value |
|---|---|
| Average | 8.8 patents |
| Std Dev | 5.9 |
| COV | 0.7 |
| Year | Cases | YOY |
|---|---|---|
| 2023 year | 4 cases | -60.0 % |
| 2022 year | 10 cases | -41.2 % |
| 2021 year | 17 cases | +13.33 % |
Information on important patents (JP)
The following shows JP patents held by 半導体または固体装置の封緘、被覆の形成技術 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 半導体または固体装置の封緘、被覆の形成技術’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 半導体または固体装置の封緘、被覆の形成技術 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
Glossary
- Cited
- Indicates that the patent/patent application has been cited (by Examiners) in notices of reasons for rejection in the examination process of other (Japanese, U.S., or European) patent applications. The higher the number of citations, the more important the patent/patent application is considered to be.
- Request for invalidation trial
- Indicates that a third party has requested a procedure to invalidate the patent. It is likely to affect the business of third parties and is considered to be of high importance.
- Opposition
- Indicates that a third party has filed a petition with the Patent Office to hear the validity of the patent again. Like the trial for invalidation, it is considered to be of high importance.
- Information provision
- Indicates that a third party has provided the Patent Office with useful information for examination for the patent filed. It is usually considered to be of high importance because it is done to prevent the patent from being granted.
- Browsing request
- Indicates that a third party has requested the Patent Office to view the patent bag (a set of documents exchanged between the Patent Office and the applicant). The bag is often checked prior to trial for invalidation, opposition, and provision of information, and is considered to be a highly important patent.
Oppositioned cases
List of latest Oppositioned patents
In the last 3 years (2022-01-01 ~ 2024-12-31), there were 2 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7433687 "樹脂封止装置" (Opposition day 2024-08-16) , next is 特許6928924 "プロセス用離型フィルム、その用途、及びそれを用いた樹脂封止半導体の製造方法" (Opposition day 2022-02-24) .
| - | No. | Title | Opposition days |
|---|---|---|---|
| 1 | 特許7433687 | 樹脂封止装置 | 2024-08-16 |
| 2 | 特許6928924 | プロセス用離型フィルム、その用途、及びそれを用いた樹脂封止半導体の製造方法 | 2022-02-24 |
Protested cases
List of latest Protested patents
In the last 3 years (2022-01-01 ~ 2024-12-31), there were 14 patents Protest from third parties. The average number of Protest is 1.5 times. The most recently Protest patent is 特開2022-182520 "離型フィルム" (Protest day 2024-11-25) , next is 特開2024-025255 "樹脂材料供給機構、樹脂成形装置および樹脂成形品の製造方法" (Protest day 2024-11-08) .
| - | No. | Title | Protest days |
|---|---|---|---|
| 1 | 特開2022-182520 | 離型フィルム | 2024-11-25 |
| 2 | 特開2024-025255 | 樹脂材料供給機構、樹脂成形装置および樹脂成形品の製造方法 | 2024-11-08 |
| 3 | 特開2023-036633 | 封止用樹脂組成物、半導体装置及び半導体装置の製造方法 | 2024-10-18 |
| 4 | 特許7589435 | 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-09-04 |
| 5 | 特開2023-089883 | 樹脂成形装置、及び、樹脂成形品の製造方法 | 2024-08-23 |
| 6 | 特許7540347 | 樹脂組成物及び樹脂組成物充填済みシリンジ | 2023-10-04 |
| 7 | 特許7395654 | 半導体装置、及びその製造方法、並びに、層間絶縁膜 | 2023-07-12 |
| 8 | 特開2022-123006 | 半導体装置、及びその製造方法、並びに、層間絶縁膜 | 2023-04-19 |
| 9 | 特開2022-123007 | 半導体装置、及びその製造方法、並びに、層間絶縁膜 | 2023-04-19 |
| 10 | 特許7287273 | 離型フィルム | 2023-04-07 |
| 11 | 特開2022-103215 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 2023-03-08 |
| 12 | 特許7346804 | 封止用樹脂組成物、再配置ウエハ、半導体パッケージ、及び半導体パッケージの製造方法 | 2023-02-27 |
| 13 | 特許7231833 | 封止用樹脂組成物、半導体パッケージ及び半導体パッケージの製造方法 | 2023-01-17 |
| 14 | 特許7177623 | 樹脂モールド成形品の製造方法、樹脂モールド成形品、及びその用途。 | 2022-09-27 |
Top Patents/Patent Applications with the Highest Number of Protested
Of the patent applications filed in the last 10 years (2015-01-01 to 2024-12-31), 25 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.3. The most protest patent is 特許7287273 "離型フィルム" (4 times) , and the next most protest patent is 特許6416706 "電子素子の樹脂封止方法" (2 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許7287273 | 離型フィルム | 4 times |
| 2 | 特許6416706 | 電子素子の樹脂封止方法 | 2 times |
| 3 | 特許7346804 | 封止用樹脂組成物、再配置ウエハ、半導体パッケージ、及び半導体パッケージの製造方法 | 2 times |
| 4 | 特許7177623 | 樹脂モールド成形品の製造方法、樹脂モールド成形品、及びその用途。 | 2 times |
| 5 | 特許7540347 | 樹脂組成物及び樹脂組成物充填済みシリンジ | 2 times |
Inspectioned cases
List of latest Inspectioned patents
In the last 3 years (2022-01-01 ~ 2024-12-31), there were 18 patents Inspection from third parties. The average number of Inspection is 1.7 times. The most recently Inspection patent is 特開2024-025255 "樹脂材料供給機構、樹脂成形装置および樹脂成形品の製造方法" (Inspection day 2024-12-04) , next is 特開2022-182520 "離型フィルム" (Inspection day 2024-12-03) .
| - | No. | Title | Inspection days |
|---|---|---|---|
| 1 | 特開2024-025255 | 樹脂材料供給機構、樹脂成形装置および樹脂成形品の製造方法 | 2024-12-04 |
| 2 | 特開2022-182520 | 離型フィルム | 2024-12-03 |
| 3 | 特開2023-036633 | 封止用樹脂組成物、半導体装置及び半導体装置の製造方法 | 2024-11-27 |
| 4 | 特許7589435 | 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-10-09 |
| 5 | 特開2023-089883 | 樹脂成形装置、及び、樹脂成形品の製造方法 | 2024-09-17 |
| 6 | 特許7540347 | 樹脂組成物及び樹脂組成物充填済みシリンジ | 2023-11-06 |
| 7 | 特許7395654 | 半導体装置、及びその製造方法、並びに、層間絶縁膜 | 2023-07-19 |
| 8 | 特許7451880 | 半導体パッケージおよび製造方法 | 2023-05-01 |
| 9 | 特開2022-123006 | 半導体装置、及びその製造方法、並びに、層間絶縁膜 | 2023-04-26 |
| 10 | 特開2022-123007 | 半導体装置、及びその製造方法、並びに、層間絶縁膜 | 2023-04-26 |
| 11 | 特開2022-103215 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 2023-04-21 |
| 12 | 特許7287273 | 離型フィルム | 2023-04-11 |
| 13 | 特許7346804 | 封止用樹脂組成物、再配置ウエハ、半導体パッケージ、及び半導体パッケージの製造方法 | 2023-03-23 |
| 14 | 特許7231833 | 封止用樹脂組成物、半導体パッケージ及び半導体パッケージの製造方法 | 2023-02-27 |
| 15 | 特許7313180 | 感光性樹脂組成物、硬化レリーフパターンの製造方法 | 2023-02-21 |
| 16 | 特許6420259 | 半導体ダイ封入又は実装方法及び対応する半導体ダイ封入又は実装装置 | 2022-12-20 |
| 17 | 特許7364255 | 圧着装置の制御方法及び該制御方法の実行に用いられる圧着装置 | 2022-02-28 |
| 18 | 特許7088636 | 半導体装置、及びその製造方法 | 2022-01-20 |
Top Patents/Patent Applications with the Highest Number of Inspectioned
Of the patent applications filed in the last 10 years (2015-01-01 to 2024-12-31), 32 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.4. The most inspection patent is 特許7287273 "離型フィルム" (6 times) , and the next most inspection patent is 特許7540347 "樹脂組成物及び樹脂組成物充填済みシリンジ" (4 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許7287273 | 離型フィルム | 6 times |
| 2 | 特許7540347 | 樹脂組成物及び樹脂組成物充填済みシリンジ | 4 times |
| 3 | 特許6858148 | 離型フィルム | 2 times |
| 4 | 特許7346804 | 封止用樹脂組成物、再配置ウエハ、半導体パッケージ、及び半導体パッケージの製造方法 | 2 times |
| 5 | 特許7088636 | 半導体装置、及びその製造方法 | 2 times |
Cited cases
Top Patents/Patent Applications with the Highest Number of Cited
Of the patent applications filed in the last 10 years (2015-01-01 to 2024-12-31), 460 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.6. The most cited patent is 特許6728917 "電子回路モジュールの製造方法" (16 times) , and the next most cited patent is 特許6632324 "粘着シート及び半導体装置製造方法" (15 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6728917 | 電子回路モジュールの製造方法 | 16 times |
| 2 | 特許6632324 | 粘着シート及び半導体装置製造方法 | 15 times |
| 3 | 特開2017-143210 | 電子部品封止体の製造方法、電子装置の製造方法 | 13 times |
| 4 | 特許6820774 | 粘着性フィルムおよび電子装置の製造方法 | 11 times |
| 5 | 特許6566016 | 発光装置の製造方法 | 11 times |
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