The Technical Field "プリント配線" had 41 patent application filings in the most recent period (2023-01-01 to 2023-02-28). This is a with an decreasing trend transition of -9 filings (-18.0%) over 50 they had in the same period of the previous year (2022-01-01 to 2022-02-28). This report also includes technical terms related to " 印刷配線 " in the search set.
The highest number of filings in 2014 with 882 cases, and their lowest number in 2021 with 372 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 2,610 cases in total) is 435, and the median is 420. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
Index | Value |
---|---|
Average | 435 patents |
Std Dev | 164 |
COV | 0.4 |
The number of filings has been decreasing for the last 3 years (2020 to 2023).
Year | Cases | YOY |
---|---|---|
2022 year | 387 cases | +4.03 % |
2021 year | 372 cases | -18.06 % |
2020 year | 454 cases | -23.70 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for プリント配線 for the period of the last 10 years (2014-01-01 to 2024-10-31). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of プリント配線, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
The changes in the number of patent filings of プリント配線 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
This patent analysis report was created for a patent search set of 5,818 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as プリント配線 are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Comparing the number of applications of each company, イビデン株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 67 cases, followed by 株式会社レゾナック with 30 cases.
Comparing the number of applications of each company, イビデン株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 557 cases, followed by 株式会社レゾナック with 449 cases.
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as プリント配線 are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Among the top coapplicants, イビデン株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 67 cases, followed by 株式会社レゾナック with 30 cases.
Among the top coapplicants, イビデン株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 557 cases, followed by 株式会社レゾナック with 449 cases.
Below is a ranking of the number of JP patent applications by プリント配線’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by プリント配線’s top 7 coapplicants over the last 20 years.
プリント配線 filed 557 joint applications with イビデン株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 239 cases in total) is 39.8, and the median is 46.5. The coefficient of variation (standard deviation/mean) is 0.3, and there have been big fluctuations in the number of filings from year to year.
The highest number of filings in 2014 with 104 cases, and their lowest number in 2020 with 28 cases.
Index | Value |
---|---|
Average | 39.8 patents |
Std Dev | 12.4 |
COV | 0.3 |
Year | Cases | YOY |
---|---|---|
2022 year | 49 cases | 0 |
2021 year | 49 cases | +75.0 % |
2020 year | 28 cases | -36.4 % |
プリント配線 filed 449 joint applications with 株式会社レゾナック for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 163 cases in total) is 27.2, and the median is 22.0. The coefficient of variation (standard deviation/mean) is 0.5, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2016 with 79 cases, and their lowest number in 2020 with 20 cases.
Index | Value |
---|---|
Average | 27.2 patents |
Std Dev | 13.7 |
COV | 0.5 |
Year | Cases | YOY |
---|---|---|
2022 year | 21 cases | -8.70 % |
2021 year | 23 cases | +15.00 % |
2020 year | 20 cases | -60.0 % |
プリント配線 filed 20 joint applications with 日本電気株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 3 cases in total) is 0.5, and the median is 0. The coefficient of variation (standard deviation/mean) is 1.5, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2014 with 10 cases, and their lowest number in 2022 with 0 cases.
Index | Value |
---|---|
Average | 0.5 patents |
Std Dev | 0.8 |
COV | 1.5 |
Year | Cases | YOY |
---|---|---|
2020 year | 1 cases | -50.0 % |
2019 year | 2 cases | - |
2018 year | 0 cases | -100 % |
プリント配線 filed 42 joint applications with 株式会社東芝 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 28 cases in total) is 4.7, and the median is 4.0. The coefficient of variation (standard deviation/mean) is 0.7, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2018 with 11 cases, and their lowest number in 2016 with 0 cases.
Index | Value |
---|---|
Average | 4.7 patents |
Std Dev | 3.3 |
COV | 0.7 |
Year | Cases | YOY |
---|---|---|
2022 year | 4 cases | +33.3 % |
2021 year | 3 cases | -25.00 % |
2020 year | 4 cases | -33.3 % |
プリント配線 filed 6 joint applications with 富士通株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 10 years (2013 to 2023, 13 cases in total) is 1.2, and the median is 0. The coefficient of variation (standard deviation/mean) is 1.7, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2015 with 2 cases, and their lowest number in 2022 with 0 cases.
Index | Value |
---|---|
Average | 1.2 patents |
Std Dev | 2.0 |
COV | 1.7 |
Year | Cases | YOY |
---|---|---|
2021 year | 1 cases | - |
2020 year | 0 cases | - |
2019 year | 0 cases | - |
The following shows JP patents held by プリント配線 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and プリント配線’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which プリント配線 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
In the last 3 years (2021-11-01 ~ 2024-10-31), there were 1 patents Invalidation Trial from third parties. The average number of Invalidation Trial is 3.0 times. The most recently Invalidation Trial patent is 特許4192197 "メタルマスク及びその製造方法" (Invalidation Trial day 2022-02-14) .
- | No. | Title | Invalidation Trial days |
---|---|---|---|
1 | 特許4192197 | メタルマスク及びその製造方法 | 2022-02-14 |
In the last 3 years (2021-11-01 ~ 2024-10-31), there were 34 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7409369 "樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板" (Opposition day 2024-07-08) , next is 特許7404665 "フリップチップパッケージ、フリップチップパッケージ基板およびフリップチップパッケージの製造方法" (Opposition day 2024-06-25) .
- | No. | Title | Opposition days |
---|---|---|---|
1 | 特許7409369 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板 | 2024-07-08 |
2 | 特許7404665 | フリップチップパッケージ、フリップチップパッケージ基板およびフリップチップパッケージの製造方法 | 2024-06-25 |
3 | 特許7375658 | 樹脂組成物 | 2024-05-08 |
4 | 特許7367891 | 樹脂シート | 2024-04-18 |
5 | 特許7348673 | 樹脂組成物、及び、これを用いたカバーレイフィルム、接着剤シート、樹脂付き金属箔、金属張積層板またはプリント配線板 | 2024-03-11 |
6 | 特許7332479 | 樹脂材料、積層構造体及び多層プリント配線板 | 2024-02-20 |
7 | 特許7342917 | 接着性樹脂シート、プリント配線板および、電子機器。 | 2024-02-19 |
8 | 特許7321879 | プリプレグ、及びプリント配線基板 | 2024-02-07 |
9 | 特許7322266 | プリプレグ用シリカガラスクロス | 2024-02-07 |
10 | 特許7290034 | ドライフィルムレジスト基材用ポリエステルフィルム | 2023-12-05 |
In the last 3 years (2021-11-01 ~ 2024-10-31), there were 44 patents Protest from third parties. The average number of Protest is 1.5 times. The most recently Protest patent is 特開2024-047383 "樹脂組成物" (Protest day 2024-09-24) , next is 特開2022-138239 "圧着端子を備えるフレキシブルプリント配線板及びその製造方法" (Protest day 2024-07-31) .
- | No. | Title | Protest days |
---|---|---|---|
1 | 特開2024-047383 | 樹脂組成物 | 2024-09-24 |
2 | 特開2022-138239 | 圧着端子を備えるフレキシブルプリント配線板及びその製造方法 | 2024-07-31 |
3 | 特開2024-000020 | 銅張積層板およびフレキシブルプリント配線板 | 2024-07-18 |
4 | 特開2021-088328 | 鞍乗型車両用のブレーキ力制御ユニット | 2024-06-28 |
5 | 特開2022-094922 | 熱硬化性樹脂組成物、およびその利用 | 2024-04-16 |
6 | 特開2022-166670 | 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ | 2024-04-11 |
7 | 特開2022-146808 | 樹脂シート | 2024-03-25 |
8 | 特開2022-021599 | ガラスクロス、プリプレグ、及びプリント配線板 | 2024-01-29 |
9 | 特許7533102 | 電子材料 | 2024-01-26 |
10 | 特許7478173 | フラックス組成物、およびはんだ組成物 | 2023-12-25 |
11 | 特許7424167 | 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 | 2023-11-10 |
12 | 特許7424168 | 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 | 2023-11-10 |
13 | 特開2021-177505 | 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板 | 2023-10-17 |
14 | 特許7452560 | プリント配線板の製造方法 | 2023-09-15 |
15 | 特許7427455 | 接着フィルム、プリント配線板及び半導体装置 | 2023-07-11 |
16 | 特許7342917 | 接着性樹脂シート、プリント配線板および、電子機器。 | 2023-06-26 |
17 | 特許7321879 | プリプレグ、及びプリント配線基板 | 2023-06-02 |
18 | 特許7322266 | プリプレグ用シリカガラスクロス | 2023-06-02 |
19 | 特許7317519 | ロール状長尺ガラスクロス、プリプレグ、及びプリント配線板 | 2023-05-31 |
20 | 特許7476690 | 樹脂組成物 | 2023-04-18 |
Of the patent applications filed in the last 10 years (2014-11-01 to 2024-10-31), 104 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.5. The most protest patent is 特許7169053 "ガラスクロス、プリプレグ、及びプリント配線板" (5 times) , and the next most protest patent is 特許6655611 "ガラスクロス" (5 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許7169053 | ガラスクロス、プリプレグ、及びプリント配線板 | 5 times |
2 | 特許6655611 | ガラスクロス | 5 times |
3 | 特許7321879 | プリプレグ、及びプリント配線基板 | 4 times |
4 | 特開2016-040837 | シールドフィルム、シールドプリント配線板、及び、シールドフィルムの製造方法 | 4 times |
5 | 特許7018168 | 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法 | 4 times |
In the last 3 years (2021-11-01 ~ 2024-10-31), there were 56 patents Inspection from third parties. The average number of Inspection is 2.0 times. The most recently Inspection patent is 特開2022-138239 "圧着端子を備えるフレキシブルプリント配線板及びその製造方法" (Inspection day 2024-09-02) , next is 特開2024-000020 "銅張積層板およびフレキシブルプリント配線板" (Inspection day 2024-08-19) .
- | No. | Title | Inspection days |
---|---|---|---|
1 | 特開2022-138239 | 圧着端子を備えるフレキシブルプリント配線板及びその製造方法 | 2024-09-02 |
2 | 特開2024-000020 | 銅張積層板およびフレキシブルプリント配線板 | 2024-08-19 |
3 | 特許5594148 | 熱可塑性ポリイミド、積層体及びプリント配線板用基板 | 2024-05-17 |
4 | 特開2022-094922 | 熱硬化性樹脂組成物、およびその利用 | 2024-05-09 |
5 | 特開2022-166670 | 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ | 2024-04-30 |
6 | 特開2022-146808 | 樹脂シート | 2024-04-10 |
7 | 特許7332479 | 樹脂材料、積層構造体及び多層プリント配線板 | 2024-03-25 |
8 | 特許7533102 | 電子材料 | 2024-02-07 |
9 | 特開2022-021599 | ガラスクロス、プリプレグ、及びプリント配線板 | 2024-02-01 |
10 | 特許7478173 | フラックス組成物、およびはんだ組成物 | 2024-01-25 |
11 | 特許7342917 | 接着性樹脂シート、プリント配線板および、電子機器。 | 2024-01-11 |
12 | 特許7424167 | 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 | 2023-11-16 |
13 | 特許7424168 | 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 | 2023-11-16 |
14 | 特開2021-177505 | 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板 | 2023-10-25 |
15 | 特許7452560 | プリント配線板の製造方法 | 2023-10-02 |
16 | 特許7367891 | 樹脂シート | 2023-09-19 |
17 | 特許7018168 | 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法 | 2023-08-25 |
18 | 特許7326417 | ポリエステル、フィルムおよび接着剤組成物、ならびに接着シート、積層体およびプリント配線板 | 2023-07-28 |
19 | 特許7427455 | 接着フィルム、プリント配線板及び半導体装置 | 2023-07-21 |
20 | 特許5021216 | プリント配線板およびその製造方法 | 2023-06-23 |
Of the patent applications filed in the last 10 years (2014-11-01 to 2024-10-31), 132 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.7. The most inspection patent is 特許7018168 "感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法" (9 times) , and the next most inspection patent is 特許6655611 "ガラスクロス" (7 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許7018168 | 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法 | 9 times |
2 | 特許6655611 | ガラスクロス | 7 times |
3 | 特開2016-040837 | シールドフィルム、シールドプリント配線板、及び、シールドフィルムの製造方法 | 6 times |
4 | 特許6753669 | 埋設回路を備えるプリント配線板の製造方法及びその製造方法で得られるプリント配線板 | 6 times |
5 | 特許7169053 | ガラスクロス、プリプレグ、及びプリント配線板 | 5 times |
Of the patent applications filed in the last 10 years (2014-11-01 to 2024-10-31), 1,521 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 3.0. The most cited patent is 特許6672616 "樹脂組成物、接着フィルム、プリント配線板及び半導体装置" (34 times) , and the next most cited patent is 特開2016-197624 "インダクタ部品、インダクタ部品の製造方法、インダクタ部品を内蔵するプリント配線板" (34 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許6672616 | 樹脂組成物、接着フィルム、プリント配線板及び半導体装置 | 34 times |
2 | 特開2016-197624 | インダクタ部品、インダクタ部品の製造方法、インダクタ部品を内蔵するプリント配線板 | 34 times |
3 | 特許6550872 | プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置 | 30 times |
4 | 特許6922157 | 樹脂組成物、積層板及び多層プリント配線板 | 24 times |
5 | 特許6154942 | 液状ソルダーレジスト組成物及びプリント配線板 | 23 times |
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