電子部品 (JP Patent Analysis Report)
The Technical Field "電子部品" had 940 patent application filings in the most recent period (2022-01-01 to 2022-07-31). This is a steady transition of +62 filings (7.1%) over 878 they had in the same period of the previous year (2021-01-01 to 2021-07-31).
The highest number of filings in 2017 with 2,869 cases, and their lowest number in 2022 with 1,275 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 10,096 cases in total) is 1,683, and the median is 1,707. The coefficient of variation (standard deviation/mean) is 0.5, and there have been big fluctuations in the number of filings from year to year.
| Index | Value |
|---|---|
| Average | 1,683 patents |
| Std Dev | 879 |
| COV | 0.5 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 1,275 cases | -15.28 % |
| 2021 year | 1,505 cases | -21.16 % |
| 2020 year | 1,909 cases | -21.89 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 電子部品 for the period of the last 10 years (2014-01-01 to 2024-03-31). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 電子部品, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
電子部品, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 電子部品 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 20,968 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
電子部品
Related Patent Analysis Report
A patent aanlysis report on the following synonyms was found in the technical term "電子部品".
- 電子部品 (Main page / Including the following synonyms)
Same industry / competition company information (JP)
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as 電子部品 are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
Comparing the number of applications of each company, TDK株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 87 cases, followed by 株式会社村田製作所 with 57 cases.
Trends in filing of joint patent applications for the target period (2014 to 2024).
Comparing the number of applications of each company, 株式会社村田製作所 has the highest number of joint applications in the last for the target period (2014 to 2024) with 1,228 cases, followed by TDK株式会社 with 773 cases.
| Name | Cases |
|---|---|
| 株式会社村田製作所 | 1,228 cases |
| TDK株式会社 | 773 cases |
| 京セラ株式会社 | 552 cases |
| 株式会社デンソー | 516 cases |
| セイコーエプソン株式会社 | 413 cases |
| 三菱電機株式会社 | 405 cases |
| 富士通株式会社 | 281 cases |
| 株式会社東芝 | 90 cases |
| 株式会社日立製作所 | 27 cases |
| パナソニックホールディングス株式会社 | 8 cases |
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
Top company information (JP)
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as 電子部品 are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
Among the top coapplicants, TDK株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 87 cases, followed by 株式会社村田製作所 with 57 cases.
Trends in filing of joint patent applications for the target period (2014 to 2024).
Among the top coapplicants, 株式会社村田製作所 has the highest number of joint applications in the last for the target period (2014 to 2024) with 1,228 cases, followed by TDK株式会社 with 773 cases.
Top company, Change in the Number of JP Patents
Below is a ranking of the number of JP patent applications by 電子部品’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 電子部品’s top 7 coapplicants over the last 20 years.
Top company Details (JP)
Trends in filing of joint patent applications with パナソニックホールディングス株式会社
電子部品 filed 8 joint applications with パナソニックホールディングス株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 10 years (2013 to 2023, 37 cases in total) is 3.4, and the median is 0. The coefficient of variation (standard deviation/mean) is 2.4, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2015 with 3 cases, and their lowest number in 2022 with 0 cases.
| Index | Value |
|---|---|
| Average | 3.4 patents |
| Std Dev | 8.2 |
| COV | 2.4 |
| Year | Cases | YOY |
|---|---|---|
| 2020 year | 1 cases | - |
| 2019 year | 0 cases | - |
| 2018 year | 0 cases | -100 % |
Trends in filing of joint patent applications with 株式会社村田製作所
電子部品 filed 1,228 joint applications with 株式会社村田製作所 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 503 cases in total) is 83.8, and the median is 96.5. The coefficient of variation (standard deviation/mean) is 0.5, and there have been big fluctuations in the number of filings from year to year.
The highest number of filings in 2016 with 213 cases, and their lowest number in 2022 with 55 cases.
| Index | Value |
|---|---|
| Average | 83.8 patents |
| Std Dev | 44.6 |
| COV | 0.5 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 55 cases | -36.8 % |
| 2021 year | 87 cases | -17.92 % |
| 2020 year | 106 cases | -23.19 % |
Trends in filing of joint patent applications with TDK株式会社
電子部品 filed 773 joint applications with TDK株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 452 cases in total) is 75.3, and the median is 89.0. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
The highest number of filings in 2017 with 117 cases, and their lowest number in 2014 with 43 cases.
| Index | Value |
|---|---|
| Average | 75.3 patents |
| Std Dev | 32.1 |
| COV | 0.4 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 83 cases | -5.68 % |
| 2021 year | 88 cases | -2.22 % |
| 2020 year | 90 cases | -6.25 % |
Trends in filing of joint patent applications with 京セラ株式会社
電子部品 filed 552 joint applications with 京セラ株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 223 cases in total) is 37.2, and the median is 29.0. The coefficient of variation (standard deviation/mean) is 0.9, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2015 with 96 cases, and their lowest number in 2022 with 10 cases.
| Index | Value |
|---|---|
| Average | 37.2 patents |
| Std Dev | 32.7 |
| COV | 0.9 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 10 cases | 0 |
| 2021 year | 10 cases | -79.2 % |
| 2020 year | 48 cases | -29.41 % |
Trends in filing of joint patent applications with 株式会社東芝
電子部品 filed 90 joint applications with 株式会社東芝 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 36 cases in total) is 6.0, and the median is 8.0. The coefficient of variation (standard deviation/mean) is 0.7, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2014 with 18 cases, and their lowest number in 2021 with 1 cases.
| Index | Value |
|---|---|
| Average | 6.0 patents |
| Std Dev | 4.0 |
| COV | 0.7 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 7 cases | +600 % |
| 2021 year | 1 cases | -88.9 % |
| 2020 year | 9 cases | 0 |
Information on important patents (JP)
The following shows JP patents held by 電子部品 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 電子部品’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 電子部品 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
Glossary
- Cited
- Indicates that the patent/patent application has been cited (by Examiners) in notices of reasons for rejection in the examination process of other (Japanese, U.S., or European) patent applications. The higher the number of citations, the more important the patent/patent application is considered to be.
- Request for invalidation trial
- Indicates that a third party has requested a procedure to invalidate the patent. It is likely to affect the business of third parties and is considered to be of high importance.
- Opposition
- Indicates that a third party has filed a petition with the Patent Office to hear the validity of the patent again. Like the trial for invalidation, it is considered to be of high importance.
- Information provision
- Indicates that a third party has provided the Patent Office with useful information for examination for the patent filed. It is usually considered to be of high importance because it is done to prevent the patent from being granted.
- Browsing request
- Indicates that a third party has requested the Patent Office to view the patent bag (a set of documents exchanged between the Patent Office and the applicant). The bag is often checked prior to trial for invalidation, opposition, and provision of information, and is considered to be a highly important patent.
Invalidationed Trial cases
List of latest Invalidationed Trial patents
In the last 3 years (2021-04-01 ~ 2024-03-31), there were 3 patents Invalidation Trial from third parties. The average number of Invalidation Trial is 1.0 times. The most recently Invalidation Trial patent is 特許6924959 "配線器具" (Invalidation Trial day 2022-06-29) , next is 特許6709958 "配線器具" (Invalidation Trial day 2022-06-29) .
| - | No. | Title | Invalidation Trial days |
|---|---|---|---|
| 1 | 特許6924959 | 配線器具 | 2022-06-29 |
| 2 | 特許6709958 | 配線器具 | 2022-06-29 |
| 3 | 特許6924960 | 配線器具 | 2022-06-29 |
Top Patents/Patent Applications with the Highest Number of Invalidationed Trial
Of the patent applications filed in the last 10 years (2014-04-01 to 2024-03-31), 4 patents/patent applications were invalidation trial more than once in the examination process of other patent applications. The mean of the number of invalidation trial is 1.0. The most invalidation trial patent is 特許6138324 "半田付け装置、半田付け方法、プリント基板の製造方法、および製品の製造方法" (1 times) , and the next most invalidation trial patent is 特許6924959 "配線器具" (1 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6138324 | 半田付け装置、半田付け方法、プリント基板の製造方法、および製品の製造方法 | 1 times |
| 2 | 特許6924959 | 配線器具 | 1 times |
| 3 | 特許6709958 | 配線器具 | 1 times |
| 4 | 特許6924960 | 配線器具 | 1 times |
Oppositioned cases
List of latest Oppositioned patents
In the last 3 years (2021-04-01 ~ 2024-03-31), there were 42 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7289816 "カバーテープおよび電子部品包装体" (Opposition day 2023-12-08) , next is 特許7288339 "配線基板および配線基板の製造方法" (Opposition day 2023-12-06) .
| - | No. | Title | Opposition days |
|---|---|---|---|
| 1 | 特許7289816 | カバーテープおよび電子部品包装体 | 2023-12-08 |
| 2 | 特許7288339 | 配線基板および配線基板の製造方法 | 2023-12-06 |
| 3 | 特許7248090 | 有機溶媒の不純物除去方法 | 2023-09-28 |
| 4 | 特許7227675 | ポリウレタン樹脂組成物 | 2023-08-18 |
| 5 | 特許7210401 | フィルム及び積層体 | 2023-07-20 |
| 6 | 特許7207904 | パワーモジュール用基板およびパワーモジュール | 2023-07-18 |
| 7 | 特許7201860 | 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法 | 2023-07-05 |
| 8 | 特許7201859 | 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法 | 2023-06-26 |
| 9 | 特許7194313 | 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法 | 2023-06-12 |
| 10 | 特許7168157 | 高耐熱樹脂硬化物用組成物、それを用いた電子部品及び半導体装置 | 2023-04-20 |
Protested cases
List of latest Protested patents
In the last 3 years (2021-04-01 ~ 2024-03-31), there were 119 patents Protest from third parties. The average number of Protest is 1.4 times. The most recently Protest patent is 特開2021-197496 "封止用樹脂シート" (Protest day 2024-03-21) , next is 特開2023-016887 "封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法" (Protest day 2024-03-19) .
| - | No. | Title | Protest days |
|---|---|---|---|
| 1 | 特開2021-197496 | 封止用樹脂シート | 2024-03-21 |
| 2 | 特開2023-016887 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-03-19 |
| 3 | 特開2023-036779 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-03-13 |
| 4 | 特開2021-127404 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-03-01 |
| 5 | 特開2022-165108 | 熱伝導性複合シート及び発熱性電子部品の実装方法 | 2024-02-29 |
| 6 | 特開2023-171548 | 中空パッケージおよびその製造方法 | 2024-02-28 |
| 7 | 特開2022-048206 | 感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品 | 2024-02-19 |
| 8 | 特開2022-067317 | 複合粒子、導電性ペーストおよび電子部品 | 2024-02-15 |
| 9 | 特開2023-080347 | 遊技機 | 2024-02-14 |
| 10 | 特許7450318 | はんだ組成物およびフレキシブル回路基板の製造方法 | 2024-02-13 |
| 11 | 特開2023-036536 | はんだ組成物および電子基板の製造方法 | 2024-02-08 |
| 12 | 特表2023-548433 | ＭｏＯ２ Ｃｌ２の製造 | 2024-01-31 |
| 13 | 特開2022-171710 | 活性エネルギー線硬化性剥離剤組成物、キャリア用剥離剤及びそれを用いた塗膜形成方法、剥離ライナー形成方法 | 2024-01-19 |
| 14 | 特開2021-064607 | 導電性ペースト、電子部品、及び、積層セラミックコンデンサ | 2024-01-10 |
| 15 | 特開2021-009936 | アンダーフィル用樹脂組成物並びに電子部品装置及びその製造方法 | 2023-12-28 |
| 16 | 再公表2020/158851 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2023-11-10 |
| 17 | 特開2023-105016 | ボールグリッドアレイパッケージ封止用エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置 | 2023-11-10 |
| 18 | 特許7428636 | 導電性ペースト、電子部品、及び積層セラミックコンデンサ | 2023-11-06 |
| 19 | 特開2023-001288 | 封止用樹脂組成物およびこれを用いた電子装置 | 2023-11-02 |
| 20 | 特開2020-088353 | 積層セラミック電子部品の端子電極用導電性ペースト | 2023-10-23 |
Top Patents/Patent Applications with the Highest Number of Protested
Of the patent applications filed in the last 10 years (2014-04-01 to 2024-03-31), 239 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.3. The most protest patent is 特許7404620 "液状樹脂組成物並びに電子部品装置及びその製造方法" (5 times) , and the next most protest patent is 特許7067470 "感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品" (5 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許7404620 | 液状樹脂組成物並びに電子部品装置及びその製造方法 | 5 times |
| 2 | 特許7067470 | 感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品 | 5 times |
| 3 | 特許6718232 | ポリアリーレンスルフィド樹脂組成物及びその成形品、並びに表面実装電子部品 | 5 times |
| 4 | 特開2021-180313 | 放熱構造 | 4 times |
| 5 | 特許6913064 | はんだ組成物および電子基板の製造方法 | 4 times |
Inspectioned cases
List of latest Inspectioned patents
In the last 3 years (2021-04-01 ~ 2024-03-31), there were 128 patents Inspection from third parties. The average number of Inspection is 1.5 times. The most recently Inspection patent is 特開2023-171548 "中空パッケージおよびその製造方法" (Inspection day 2024-03-26) , next is 特許7441904 "導線" (Inspection day 2024-03-24) .
| - | No. | Title | Inspection days |
|---|---|---|---|
| 1 | 特開2023-171548 | 中空パッケージおよびその製造方法 | 2024-03-26 |
| 2 | 特許7441904 | 導線 | 2024-03-24 |
| 3 | 特開2023-137985 | メモリシステム | 2024-03-18 |
| 4 | 特開2023-140028 | 電子機器 | 2024-03-18 |
| 5 | 特開2022-048206 | 感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品 | 2024-03-15 |
| 6 | 特開2022-067317 | 複合粒子、導電性ペーストおよび電子部品 | 2024-03-14 |
| 7 | 特開2022-165108 | 熱伝導性複合シート及び発熱性電子部品の実装方法 | 2024-03-13 |
| 8 | 特表2023-548433 | ＭｏＯ２ Ｃｌ２の製造 | 2024-03-07 |
| 9 | 特許7450318 | はんだ組成物およびフレキシブル回路基板の製造方法 | 2024-03-06 |
| 10 | 特開2022-133735 | プリフォーム層付きの接合用シート及び接合体の製造方法並びにプリフォーム層付きの被接合部材 | 2024-02-20 |
| 11 | 特開2023-069822 | 酸性電解銅めっき液、プリフォーム層の形成方法、接合用シートの製造方法、接合用基板の製造方法及び接合体の製造方法 | 2024-02-20 |
| 12 | 特開2021-009936 | アンダーフィル用樹脂組成物並びに電子部品装置及びその製造方法 | 2024-02-19 |
| 13 | 特開2021-064607 | 導電性ペースト、電子部品、及び、積層セラミックコンデンサ | 2024-02-07 |
| 14 | 特開2022-171710 | 活性エネルギー線硬化性剥離剤組成物、キャリア用剥離剤及びそれを用いた塗膜形成方法、剥離ライナー形成方法 | 2024-01-31 |
| 15 | 特許7444323 | 純銅材、絶縁基板、電子デバイス | 2024-01-23 |
| 16 | 特許7444324 | 純銅材、絶縁基板、電子デバイス | 2024-01-23 |
| 17 | 再公表2020/158851 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2023-12-21 |
| 18 | 特開2023-105016 | ボールグリッドアレイパッケージ封止用エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置 | 2023-12-21 |
| 19 | 特許7416116 | エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置 | 2023-12-18 |
| 20 | 特許5223943 | 電子機器 | 2023-12-05 |
Top Patents/Patent Applications with the Highest Number of Inspectioned
Of the patent applications filed in the last 10 years (2014-04-01 to 2024-03-31), 293 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.4. The most inspection patent is 特許7067470 "感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品" (11 times) , and the next most inspection patent is 特許7257855 "ポリアリーレンスルフィド樹脂組成物及びその成形品、並びに表面実装電子部品" (7 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許7067470 | 感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品 | 11 times |
| 2 | 特許7257855 | ポリアリーレンスルフィド樹脂組成物及びその成形品、並びに表面実装電子部品 | 7 times |
| 3 | 特許6718232 | ポリアリーレンスルフィド樹脂組成物及びその成形品、並びに表面実装電子部品 | 7 times |
| 4 | 特許7231821 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 6 times |
| 5 | 特開2015-156490 | 熱伝導シート、その製造方法及び熱伝導シートを用いた放熱装置 | 5 times |
Cited cases
Top Patents/Patent Applications with the Highest Number of Cited
Of the patent applications filed in the last 10 years (2014-04-01 to 2024-03-31), 5,388 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.8. The most cited patent is 特許6824589 "遊技機" (69 times) , and the next most cited patent is 特許6717559 "半田合金及び半田粉" (68 times) .
Providing patent information to the media (newspapers, magazines, etc.)
"Patent Integration Report" is a web service provided by "Patent Integration Co., Ltd." operated by patent attorneys who are experts in intellectual property rights. Based on the latest patent data, this is one of the largest patent report services in Japan that provides information on technology trends in various companies and technology fields.
The purpose of this web service is to make intellectual property information familiar to many people, regardless of whether they have an interest in intellectual property rights, and to make use of it.
We actively provide various types of patent information that can be used in various media articles such as newspapers, magazines, and web media. Please feel free to contact us from "Inquiry form for details on the content of patent information that can be provided, conditions for provision, etc. Please contact us.
About this Site
All rights related to the data, documents and charts belong to "an integrated patent search/analysis service provider, Patent Integration". Please specify the source “Patent Integration Report, URL: https://patent-i.com/report/en/" when inserting them into in-house materials, external report materials, etc., regardless of whether they are paid or free of charge.
Patent data is obtained by aggregating and analyzing the latest patent data issued by the Patent Offices of respective countries and jurisdictions and by WIPO. Although we take great care in publishing and analyzing the results, we do not guarantee the correctness of the data. We appreciate your understanding.
If you have any concerns about this service, please feel free to contact us.
All rights to the data, documents, figures and tables are reserved by e-Patent. When publishing internal documents, external reports, etc. (whether paid or free of charge), please use the following URL: https://e-patent.co.jp/.
Please note the following points for use.
e-Patent will not be liable for any damages or losses arising from the use of the global patent application status, ranking information, or population search formula in the "SDGs Global Company Ranking from a Patent Perspective". Items with ● in front of the target are not supported at this time (judged to be difficult to approach from the patent information analysis).
Citation of patent application status and ranking information
There is no problem to cite patent application status and ranking information, but please clearly indicate "Source: e-Patent Co.
Graphs are image data.
Please note that the various graphs are image data, but we cannot provide them in text data.Scope of coverage for each goal/target
- Based on the description of each goal and target of the SDGs, we have set the scope of technologies to be covered based on our and e-Patent's past experience, etc. (in some cases, the search is based on social issues themselves). Therefore, please note that there is a possibility that this "SDGs Global Company Ranking from Patent Perspective" may not cover 100%.
- A population search formula is clearly indicated for each goal/target (database: Patent Integration). You may use the population search formula as it is, or you may improve it by yourself.
- This search covers patents and utility models, including both published and registered patents (design and design patents are excluded). The unit of count is the number of applications, not the number of patent families.
About the name collation and name control of applicants and right holders
- Company rankings are based on the results calculated by "Patent Integration", with Japanese organizations in Japanese and other companies in English (some are in Japanese).
- Company names may be the names of the companies at the time of application, but the results calculated by Patent Integration are used as is. Company names are used as they were at the time of application.
- Because of the fluctuation in the names of companies (i.e., applicant/right holder names in the patent information), there are cases where the same company appears more than once in the top 10. The number of applications filed by the same company in the top 10 is the total number of applications filed by the company.
Credit notation
・MeCab user dictionary for science technology term © National Bioscience Database Center licensed under CC Attribution-Share Alike 4.0 International
Our Commitment to Safety and Security
Patent Integration Co., Ltd. is committed to providing high-quality patent information based on the latest patent data on more than 45 million cases collected from the Patent Offices in Japan, the U.S., Europe, and Taiwan and from PCT publication. 
Patent Integration Co., Ltd. collects the patent data from the Patent Offices in Japan, the U.S., Europe, and Taiwan and from PCT publications to provide it widely in the form of reports so that anyone can check patent information and patent trends with confidence. 
Patent Integration Co., Ltd. is committed to various efforts to enhance the reliability of the information and to allow users to search patent information with confidence.