5F004 半導体のドライエッチング技術 Patent Trends
The Theme Code "半導体のドライエッチング技術" had 616 patent application filings in the publication-lag-adjusted comparison period (2024-01-01 to 2024-10-31). This is a weakly transition of -36 filings (-5.5%) over 652 they had in the same period of the previous year (2023-01-01 to 2023-10-31).
The highest number of filings in 2021 with 1,044 cases, and their lowest number in 2024 with 683 cases (years covered: 2021, 2022, 2023, 2024).
The mean of the number of filings over the last 4 years (2021 to 2024, 3,439 cases in total) is 860, and the median is 856. The coefficient of variation (standard deviation/mean) is 0.17, and filings have been moderate fluctuations.
| Index | Value |
|---|---|
| Average | 860 patents |
| Std Dev | 144 |
| COV | 0.17 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 181 cases | -73.5% |
| 2024 year | 683 cases | -10.37% |
| 2023 year | 762 cases | -19.79% |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 半導体のドライエッチング技術[5F004] for the period of the last 6 years (2020 to 2025). You can compare the information in this report with the trends in your competitors’ patent filings and technologies.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 半導体のドライエッチング技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, and their top coapplicants (joint research partners, alliance partners). It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
半導体のドライエッチング技術, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 半導体のドライエッチング技術 over the last 6 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
半導体のドライエッチング技術 JP patent filing trend (unit: cases)
| Year | Cases |
|---|---|
| 2021 | 1,044 |
| 2022 | 950 |
| 2023 | 762 |
| 2024 | 683 |
| 2025 | 181 |
Patent Landscape
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 半導体のドライエッチング技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
Keywords (importance)
Top keywords frequently used in patent filings for 半導体のドライエッチング技術 are shown below.
Top keywords for 半導体のドライエッチング技術
| Keyword | Score |
|---|---|
| プラズマ | 100.0 |
| 基板 | 67.35 |
| 供給 | 35.56 |
| エッチング | 35.2 |
| 膜 | 29.31 |
| 電極 | 29.08 |
| 表面 | 28.31 |
| ガス | 27.35 |
| 配置 | 27.01 |
| 間 | 24.13 |
| 修正 | 22.9 |
| チャンバ | 19.2 |
| 半導体 | 18.75 |
| マスク | 17.32 |
| 酸化 | 16.87 |
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 3,620 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
半導体のドライエッチング技術[5F004]
Recent publications
| Publication No. | Title | Bibliographic info | Theme |
|---|---|---|---|
| 1. JPP7788577 | 保持装置, 保持装置 | ・Applicant 日本特殊陶業株式会社 ・Filing date 2025-03-07 ・Publication date 2026-09-17 | 5F004, 5F131 |
| 2. JPA-HYO2026-531558 | ガス送給システムにおける大気曝露の防止 | ・Applicant ラムリサーチコーポレーション ・Filing date 2024-08-26 ・Publication date 2026-09-17 | 5F004, 5F045 |
| 3. JPA-HYO2026-531600 | 再堆積されたヘルメットマスクを用いた高アスペクト比ＩＮ－ＳＩＴＵエッチング | ・Applicant ラムリサーチコーポレーション ・Filing date 2024-09-04 ・Publication date 2026-09-17 | 5F004 |
| 4. JPA2026-148462 | ハードマスク薄膜、スパッタリングターゲット材、および成膜方法 | ・Applicant 株式会社コベルコ科研 ・Filing date 2026-02-02 ・Publication date 2026-09-17 | 4K029, 5F004 |
| 5. JPA-HYO2026-531554 | ガス分配システムにおける不具合を検出するためのシステム及び方法 | ・Applicant アプライドマテリアルズインコーポレイテッド ・Filing date 2024-08-28 ・Publication date 2026-09-17 | 4K030, 5F004 |
| 6. JPA2026-148431 | 分析装置、分析方法、分析プログラム及びプラズマ処理方法 | ・Applicant 株式会社堀場エステック ・Filing date 2025-12-11 ・Publication date 2026-09-17 | 2G043, 5F004 |
| 7. JPA-HYO2026-531550 | 揮発可能な末端官能基の除去による選択的エッチング | ・Applicant ラムリサーチコーポレーション ・Filing date 2024-09-05 ・Publication date 2026-09-17 | 5F004 |
| 8. JPA-HYO2026-531602 | 熱均一性を向上させた基板支持アセンブリ | ・Applicant アプライドマテリアルズインコーポレイテッド ・Filing date 2024-08-29 ・Publication date 2026-09-17 | 5F004, 5F131 |
| 9. JPA2026-146883 | セラミック基板、静電チャック、基板固定装置及び導電性ペースト | ・Applicant 新光電気工業株式会社 ・Filing date 2025-03-05 ・Publication date 2026-09-17 | 5F004, 5F131 |
| 10. JPA2026-147451 | 保持装置 | ・Applicant 日本特殊陶業株式会社 ・Filing date 2025-03-06 ・Publication date 2026-09-17 | 5F004, 5F131 |
| 11. JPA2026-147802 | プラズマ電子密度計測方法およびプラズマ電子密度計測装置 | ・Applicant アズビル株式会社 ・Filing date 2025-03-07 ・Publication date 2026-09-17 | 2G084, 5F004 |
| 12. JPA2026-146366 | 静電チャックおよび静電チャックの製造方法 | ・Applicant 日本特殊陶業株式会社 ・Filing date 2025-03-04 ・Publication date 2026-09-16 | 4K029, 4K030, 5F004, 5F045, 5F131 |
| 13. JPA2026-145575 | 静電チャック | ・Applicant TOTO株式会社 ・Filing date 2025-03-03 ・Publication date 2026-09-15 | 5F004, 5F045, 5F131 |
| 14. JPA2026-145657 | プラズマ処理装置 | ・Applicant 東京エレクトロン株式会社 ・Filing date 2025-03-03 ・Publication date 2026-09-15 | 2G084, 5F004, 5F045 |
| 15. JPA2026-146048 | 対称プラズマ処理チャンバ | ・Applicant アプライドマテリアルズインコーポレイテッド ・Filing date 2025-01-20 ・Publication date 2026-09-15 | 2G084, 4G075, 4K030, 5F004, 5F045 |
Same industry / competition company information (JP)
{'ja': '技術テーマ「半導体のドライエッチング技術」における上位出願人の特許情報を以下に示します。各企業の特許件数を比較することで、過去および現在の各社の技術テーマにおける研究開発状況や、技術テーマにおける各社の位置付けを確認できます。なお、特許は出願から公開までに一年半のタイムラグがあるため、一年半より直近の状況については分析できない点に注意する必要があります。', 'en': "The patent information of the higher applicant in the technical theme 半導体のドライエッチング技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme. Patents have a time lag of about 18 months from filing to publication."}
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
Comparing the number of applications of each company, 東京エレクトロン株式会社 has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 414 cases, followed by アプライドマテリアルズインコーポレイテッド with 167 cases.
| Name | Cases |
|---|---|
| 東京エレクトロン株式会社 | 414 cases |
| アプライドマテリアルズインコーポレイテッド | 167 cases |
| ラムリサーチコーポレーション | 128 cases |
| TOTO株式会社 | 119 cases |
| 日本特殊陶業株式会社 | 80 cases |
| 株式会社日立ハイテク | 56 cases |
Trends in filing of joint patent applications for the target period (2020 to 2025).
Comparing the number of applications of each company, 東京エレクトロン株式会社 has the highest number of joint applications in the last for the target period (2020 to 2025) with 1,325 cases, followed by アプライドマテリアルズインコーポレイテッド with 549 cases.
| Name | Cases |
|---|---|
| 東京エレクトロン株式会社 | 1,325 cases |
| アプライドマテリアルズインコーポレイテッド | 549 cases |
| ラムリサーチコーポレーション | 504 cases |
| 株式会社日立ハイテク | 176 cases |
| TOTO株式会社 | 171 cases |
| 日本特殊陶業株式会社 | 127 cases |
Same industry / competition company JP patent filing ranking
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業の長期推移をどう読むか
同業や競合企業の長期的な特許出願件数の推移から、長期トレンドと出願件数の山や谷を確認することができます。
解説の続きを読む
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 6 companies in the same industry over the past 6 years.
Competitor filing ranking
| Name | Cases |
|---|---|
| 東京エレクトロン株式会社 | 1,325 |
| アプライドマテリアルズインコーポレイテッド | 549 |
| ラムリサーチコーポレーション | 504 |
| 株式会社日立ハイテク | 176 |
| TOTO株式会社 | 171 |
| 日本特殊陶業株式会社 | 127 |
Top company information (JP)
{'ja': '技術テーマ「半導体のドライエッチング技術」における上位出願人の特許情報を以下に示します。各企業の特許件数を比較することで、過去および現在の各社の技術テーマにおける研究開発状況や、技術テーマにおける各社の位置付けを確認できます。なお、特許は出願から公開までに一年半のタイムラグがあるため、一年半より直近の状況については分析できない点に注意する必要があります。', 'en': "The patent information of the higher applicant in the technical theme 半導体のドライエッチング技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme. Patents have a time lag of about 18 months from filing to publication."}
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業との比較のポイント
同業や競合企業が特許に注力している分野を知ることで、自社の戦略や製品開発の方向性を把握することができます。
解説の続きを読む
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
among the top coapplicants, 東京エレクトロン株式会社 has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 414 cases, followed by アプライドマテリアルズインコーポレイテッド with 167 cases.
| Name | Cases |
|---|---|
| 東京エレクトロン株式会社 | 414 cases |
| アプライドマテリアルズインコーポレイテッド | 167 cases |
| ラムリサーチコーポレーション | 128 cases |
Trends in filing of joint patent applications for the target period (2020 to 2025).
among the top coapplicants, 東京エレクトロン株式会社 has the highest number of joint applications in the last for the target period (2020 to 2025) with 1,325 cases, followed by アプライドマテリアルズインコーポレイテッド with 549 cases.
| Name | Cases |
|---|---|
| 東京エレクトロン株式会社 | 1,325 cases |
| アプライドマテリアルズインコーポレイテッド | 549 cases |
| ラムリサーチコーポレーション | 504 cases |
Top company JP patent filing ranking
Below is a ranking of the number of JP patent applications by 半導体のドライエッチング技術’s top 3 coapplicants over the last 6 years.
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業の長期推移をどう読むか
同業や競合企業の長期的な特許出願件数の推移から、長期トレンドと出願件数の山や谷を確認することができます。
解説の続きを読む
Top co-applicant filing ranking
| Name | Cases |
|---|---|
| 東京エレクトロン株式会社 | 1,325 |
| アプライドマテリアルズインコーポレイテッド | 549 |
| ラムリサーチコーポレーション | 504 |
Top company, Change in the Number of JP Patents
Below is a patent map showing the changes in the numbers of JP patent filings by 半導体のドライエッチング技術’s top 3 coapplicants over the last 6 years.
Top co-applicant filing ranking
| Name | Cases |
|---|---|
| 東京エレクトロン株式会社 | 1,325 |
| アプライドマテリアルズインコーポレイテッド | 549 |
| ラムリサーチコーポレーション | 504 |
Top company details
Trends in filing of joint patent applications with 東京エレクトロン株式会社
半導体のドライエッチング技術 filed 1,325 joint applications with 東京エレクトロン株式会社 for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 1,298 cases in total) is 260, and the median is 269. The coefficient of variation (standard deviation/mean) is 0.22, and filings have been moderate fluctuations.
The highest number of filings in 2020 with 329 cases, and their lowest number in 2024 with 192 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 260 patents |
| Std Dev | 57.4 |
| COV | 0.22 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 27 cases | -85.9% |
| 2024 year | 192 cases | -1.54% |
| 2023 year | 195 cases | -27.51% |
Trends in filing of joint patent applications with アプライドマテリアルズインコーポレイテッド
半導体のドライエッチング技術 filed 549 joint applications with アプライドマテリアルズインコーポレイテッド for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 548 cases in total) is 110, and the median is 101. The coefficient of variation (standard deviation/mean) is 0.24, and filings have been moderate fluctuations.
The highest number of filings in 2022 with 144 cases, and their lowest number in 2024 with 82 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 110 patents |
| Std Dev | 26.2 |
| COV | 0.24 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 1 cases | -98.8% |
| 2024 year | 82 cases | -2.38% |
| 2023 year | 84 cases | -41.7% |
Trends in filing of joint patent applications with ラムリサーチコーポレーション
半導体のドライエッチング技術 filed 504 joint applications with ラムリサーチコーポレーション for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 504 cases in total) is 101, and the median is 87.0. The coefficient of variation (standard deviation/mean) is 0.4, and filings have been large fluctuations.
Because some years show zero filings in the collected data, strong trend claims are avoided; see the yearly table. The highest number of filings in 2021 with 163 cases, and their lowest number in 2024 with 41 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 101 patents |
| Std Dev | 42.0 |
| COV | 0.4 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 0 cases | -100% |
| 2024 year | 41 cases | -52.9% |
| 2023 year | 87 cases | +4.82% |
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佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業との比較のポイント
同業や競合企業が特許に注力している分野を知ることで、自社の戦略や製品開発の方向性を把握することができます。
解説の続きを読む