5F136 半導体または固体装置の冷却等技術 Patent Trends
The Theme Code "半導体または固体装置の冷却等技術" had 481 patent application filings in the publication-lag-adjusted comparison period (2024-01-01 to 2024-10-31). This is a weakly transition of -53 filings (-9.9%) over 534 they had in the same period of the previous year (2023-01-01 to 2023-10-31).
The highest number of filings in 2021 with 772 cases, and their lowest number in 2024 with 554 cases (years covered: 2021, 2022, 2023, 2024).
The mean of the number of filings over the last 4 years (2021 to 2024, 2,698 cases in total) is 674, and the median is 686. The coefficient of variation (standard deviation/mean) is 0.13, and filings have been moderate fluctuations.
| Index | Value |
|---|---|
| Average | 674 patents |
| Std Dev | 89.1 |
| COV | 0.13 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 211 cases | -61.9% |
| 2024 year | 554 cases | -11.36% |
| 2023 year | 625 cases | -16.33% |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 半導体または固体装置の冷却等技術[5F136] for the period of the last 6 years (2020 to 2025). You can compare the information in this report with the trends in your competitors’ patent filings and technologies.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 半導体または固体装置の冷却等技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, and their top coapplicants (joint research partners, alliance partners). It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
半導体または固体装置の冷却等技術, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 半導体または固体装置の冷却等技術 over the last 6 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
半導体または固体装置の冷却等技術 JP patent filing trend (unit: cases)
| Year | Cases |
|---|---|
| 2021 | 772 |
| 2022 | 747 |
| 2023 | 625 |
| 2024 | 554 |
| 2025 | 211 |
Patent Landscape
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 半導体または固体装置の冷却等技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
Keywords (importance)
Top keywords frequently used in patent filings for 半導体または固体装置の冷却等技術 are shown below.
Top keywords for 半導体または固体装置の冷却等技術
| Keyword | Score |
|---|---|
| 熱 | 100.0 |
| 基板 | 57.74 |
| 放熱 | 45.2 |
| 素子 | 44.77 |
| 伝導 | 43.62 |
| 半導体 | 42.13 |
| 配置 | 39.89 |
| 間 | 37.02 |
| 方向 | 31.26 |
| 樹脂 | 31.16 |
| 部材 | 30.9 |
| モジュール | 30.45 |
| 部品 | 28.89 |
| 冷却 | 25.61 |
| 絶縁 | 24.67 |
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 2,909 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
半導体または固体装置の冷却等技術[5F136]
Recent publications
| Publication No. | Title | Bibliographic info | Theme |
|---|---|---|---|
| 1. JPA-HYO2026-534347 | 発熱電気部品と放熱器との間の接続要素、およびそのような接続要素を備えた電気回路基板 | ・Applicant ブルサエレクトロニックアーゲー ・Filing date 2024-09-26 ・Publication date 2026-10-15 | 5E322, 5F136 |
| 2. JPA2026-165504 | 冷却器、冷却ユニット、冷却器の製造方法及び冷却ユニットの製造方法 | ・Applicant 日本軽金属株式会社, 日軽金ALMO株式会社 ・Filing date 2025-03-31 ・Publication date 2026-10-14 | 4F211, 5F136 |
| 3. JPA2026-166671 | 熱伝導シートおよびその製造方法 | ・Applicant 日本ゼオン株式会社 ・Filing date 2025-03-31 ・Publication date 2026-10-14 | 4F071, 4F213, 5E322, 5F136 |
| 4. JPA2026-166813 | 樹脂シート製造方法及び樹脂シート | ・Applicant 日本ゼオン株式会社 ・Filing date 2025-03-31 ・Publication date 2026-10-14 | 3C027, 4F071, 5F136 |
| 5. JPA2026-166984 | プリント基板実装部品の放熱構造 | ・Applicant 住友電気工業株式会社 ・Filing date 2025-04-01 ・Publication date 2026-10-14 | 5E322, 5F136 |
| 6. JPA2026-167287 | 配線基板、母材基板および配線基板の製造方法 | ・Applicant TOPPANホールディングス株式会社 ・Filing date 2025-04-01 ・Publication date 2026-10-14 | 5E316, 5E338, 5F136 |
| 7. JPP7934561 | 電子制御装置 | ・Applicant 株式会社デンソー ・Filing date 2023-03-27 ・Publication date 2026-10-14 | 5E322, 5F136 |
| 8. JPA2026-166486 | 窒化アルミニウムを主原料とする放熱基板材料 | ・Applicant ノリタケ株式会社 ・Filing date 2025-03-31 ・Publication date 2026-10-14 | 5F136 |
| 9. JPA2026-167092 | ヒートパイプと放熱器との接合構造および冷却モジュール | ・Applicant 東芝ホームテクノ株式会社 ・Filing date 2025-04-01 ・Publication date 2026-10-14 | 5E322, 5F136 |
| 10. JPA-HYO2026-533923 | 銅アルミニウムのダイカストにより一体成形するレーザチップ用複合放熱器の調製方法および放熱器 | ・Applicant 広州衆山精密科技有限公司 ・Filing date 2024-08-07 ・Publication date 2026-10-14 | 5E322, 5F136, 5F173 |
| 11. JPA2026-165502 | 冷却器及び冷却器の製造方法 | ・Applicant 日本軽金属株式会社, 日軽金ALMO株式会社 ・Filing date 2025-03-31 ・Publication date 2026-10-14 | 4F211, 5E322, 5F136 |
| 12. JPA2026-167220 | 冷却システム | ・Applicant 株式会社デンソー ・Filing date 2025-04-01 ・Publication date 2026-10-14 | 5E322, 5F136 |
| 13. JPA2026-167359 | 熱伝導シート | ・Applicant ノリタケ株式会社 ・Filing date 2025-06-30 ・Publication date 2026-10-14 | 5F136 |
| 14. JPA2026-167461 | 基板載置台及び基板処理装置 | ・Applicant 東京エレクトロン株式会社 ・Filing date 2026-01-29 ・Publication date 2026-10-14 | 5F045, 5F131, 5F136 |
| 15. JPP7934390 | 接続構造、半導体装置および絶縁内蔵基板 | ・Applicant トヨタ自動車株式会社, 株式会社デンソー, 株式会社ミライズテクノロジーズ ・Filing date 2022-10-31 ・Publication date 2026-10-14 | 5E338, 5E343, 5F136 |
Same industry / competition company information (JP)
{'ja': '技術テーマ「半導体または固体装置の冷却等技術」における上位出願人の特許情報を以下に示します。各企業の特許件数を比較することで、過去および現在の各社の技術テーマにおける研究開発状況や、技術テーマにおける各社の位置付けを確認できます。なお、特許は出願から公開までに一年半のタイムラグがあるため、一年半より直近の状況については分析できない点に注意する必要があります。', 'en': "The patent information of the higher applicant in the technical theme 半導体または固体装置の冷却等技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme. Patents have a time lag of about 18 months from filing to publication."}
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
Comparing the number of applications of each company, 三菱電機株式会社 has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 88 cases, followed by 株式会社デンソー with 73 cases.
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 88 cases |
| 株式会社デンソー | 73 cases |
| 富士電機株式会社 | 50 cases |
| 株式会社レゾナック | 34 cases |
| ASTEMO株式会社 | 33 cases |
| デンカ株式会社 | 29 cases |
Trends in filing of joint patent applications for the target period (2020 to 2025).
Comparing the number of applications of each company, 三菱電機株式会社 has the highest number of joint applications in the last for the target period (2020 to 2025) with 259 cases, followed by 株式会社デンソー with 190 cases.
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 259 cases |
| 株式会社デンソー | 190 cases |
| 富士電機株式会社 | 165 cases |
| ASTEMO株式会社 | 105 cases |
| 株式会社レゾナック | 105 cases |
| デンカ株式会社 | 81 cases |
Same industry / competition company JP patent filing ranking
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業の長期推移をどう読むか
同業や競合企業の長期的な特許出願件数の推移から、長期トレンドと出願件数の山や谷を確認することができます。
解説の続きを読む
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 6 companies in the same industry over the past 6 years.
Competitor filing ranking
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 259 |
| 株式会社デンソー | 190 |
| 富士電機株式会社 | 165 |
| ASTEMO株式会社 | 105 |
| 株式会社レゾナック | 105 |
| デンカ株式会社 | 81 |
Top company information (JP)
{'ja': '技術テーマ「半導体または固体装置の冷却等技術」における上位出願人の特許情報を以下に示します。各企業の特許件数を比較することで、過去および現在の各社の技術テーマにおける研究開発状況や、技術テーマにおける各社の位置付けを確認できます。なお、特許は出願から公開までに一年半のタイムラグがあるため、一年半より直近の状況については分析できない点に注意する必要があります。', 'en': "The patent information of the higher applicant in the technical theme 半導体または固体装置の冷却等技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme. Patents have a time lag of about 18 months from filing to publication."}
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業との比較のポイント
同業や競合企業が特許に注力している分野を知ることで、自社の戦略や製品開発の方向性を把握することができます。
解説の続きを読む
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
among the top coapplicants, 三菱電機株式会社 has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 88 cases, followed by 株式会社デンソー with 73 cases.
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 88 cases |
| 株式会社デンソー | 73 cases |
| 富士電機株式会社 | 50 cases |
Trends in filing of joint patent applications for the target period (2020 to 2025).
among the top coapplicants, 三菱電機株式会社 has the highest number of joint applications in the last for the target period (2020 to 2025) with 259 cases, followed by 株式会社デンソー with 190 cases.
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 259 cases |
| 株式会社デンソー | 190 cases |
| 富士電機株式会社 | 165 cases |
Top company JP patent filing ranking
Below is a ranking of the number of JP patent applications by 半導体または固体装置の冷却等技術’s top 3 coapplicants over the last 6 years.
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業の長期推移をどう読むか
同業や競合企業の長期的な特許出願件数の推移から、長期トレンドと出願件数の山や谷を確認することができます。
解説の続きを読む
Top co-applicant filing ranking
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 259 |
| 株式会社デンソー | 190 |
| 富士電機株式会社 | 165 |
Top company, Change in the Number of JP Patents
Below is a patent map showing the changes in the numbers of JP patent filings by 半導体または固体装置の冷却等技術’s top 3 coapplicants over the last 6 years.
Top co-applicant filing ranking
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 259 |
| 株式会社デンソー | 190 |
| 富士電機株式会社 | 165 |
Top company details
Trends in filing of joint patent applications with 三菱電機株式会社
半導体または固体装置の冷却等技術 filed 259 joint applications with 三菱電機株式会社 for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 254 cases in total) is 50.8, and the median is 52.0. The coefficient of variation (standard deviation/mean) is 0.18, and filings have been moderate fluctuations.
The highest number of filings in 2022 with 63 cases, and their lowest number in 2024 with 35 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 50.8 patents |
| Std Dev | 9.3 |
| COV | 0.18 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 5 cases | -85.7% |
| 2024 year | 35 cases | -27.08% |
| 2023 year | 48 cases | -23.81% |
Trends in filing of joint patent applications with 株式会社デンソー
半導体または固体装置の冷却等技術 filed 190 joint applications with 株式会社デンソー for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 178 cases in total) is 35.6, and the median is 33.0. The coefficient of variation (standard deviation/mean) is 0.3, and filings have been large fluctuations.
The number of filings has been increasing for the publication-lag-adjusted last 3 years (2023 to 2025). The highest number of filings in 2020 with 51 cases, and their lowest number in 2022 with 21 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 35.6 patents |
| Std Dev | 11.0 |
| COV | 0.3 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 12 cases | -63.6% |
| 2024 year | 33 cases | +17.86% |
| 2023 year | 28 cases | +33.3% |
Trends in filing of joint patent applications with 富士電機株式会社
半導体または固体装置の冷却等技術 filed 165 joint applications with 富士電機株式会社 for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 160 cases in total) is 32.0, and the median is 34.0. The coefficient of variation (standard deviation/mean) is 0.26, and filings have been large fluctuations.
The number of filings has been decreasing for the publication-lag-adjusted last 3 years (2023 to 2025). The highest number of filings in 2021 with 42 cases, and their lowest number in 2023 with 22 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 32.0 patents |
| Std Dev | 8.2 |
| COV | 0.26 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 5 cases | -78.3% |
| 2024 year | 23 cases | +4.55% |
| 2023 year | 22 cases | -43.6% |
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佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業との比較のポイント
同業や競合企業が特許に注力している分野を知ることで、自社の戦略や製品開発の方向性を把握することができます。
解説の続きを読む