半導体または固体装置の冷却等技術 (JP Patent Analysis Report)
The Theme Code "半導体または固体装置の冷却等技術" had 151 patent application filings in the most recent period (2023-01-01 to 2023-03-31). This is a significantly decreased of -46 filings (-23.4%) over 197 they had in the same period of the previous year (2022-01-01 to 2022-03-31).
The highest number of filings in 2015 with 1,049 cases, and their lowest number in 2022 with 640 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 4,307 cases in total) is 718, and the median is 730. The coefficient of variation (standard deviation/mean) is 0.3, and there have been big fluctuations in the number of filings from year to year.
| Index | Value |
|---|---|
| Average | 718 patents |
| Std Dev | 236 |
| COV | 0.3 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 640 cases | -8.70 % |
| 2021 year | 701 cases | -7.76 % |
| 2020 year | 760 cases | -15.08 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 半導体または固体装置の冷却等技術[5F136] for the period of the last 10 years (2014-01-01 to 2024-11-30). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 半導体または固体装置の冷却等技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
- Table of Contents
- Foreign Patent Analysis Report
- Patent Filing Summary for 半導体または固体装置の冷却等技術
- Search Set (Search Formula/Analysis Patents)
- Related Patent Analysis Report
- Competitors Information
- Top company Information
- • Information on Important Patents
- Provision of patent information to the media
- About this Site
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
半導体または固体装置の冷却等技術, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 半導体または固体装置の冷却等技術 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Patent Landscape ({{ld.d.db_name | country_map: 'en'}})
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 半導体または固体装置の冷却等技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
In addition, by visually representing the patent data in this manner, you can convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
In Patent Integration, you can check the specifics of a patent filing by clicking anywhere on the patent landscape screen. You can also quickly check the position of each applicant for each technical field by cross-referencing with other keywords and patent classifications. You can use it as a guide when considering hypotheses about each company's IP strategy on the IP Landscape. You can also use it for higher-grade intellectual property activities. It has reasonable pricing and a simple user interface that is easy for beginners to handle.
Characteristic Terms (Importance)
The following is a list of words (characteristic terms) often used in 半導体または固体装置の冷却等技術 patent applications. Characteristic terms with a higher importance are used in more patents/patent applications.
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 8,338 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
半導体または固体装置の冷却等技術[5F136]
Same industry / competition company information (JP)
The patent information of the higher applicant in the technical theme 半導体または固体装置の冷却等技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
Comparing the number of applications of each company, 三菱電機株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 75 cases, followed by 富士電機株式会社 with 50 cases.
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 75 cases |
| 富士電機株式会社 | 50 cases |
| 株式会社デンソー | 37 cases |
| トヨタ自動車株式会社 | 21 cases |
| 富士通株式会社 | 11 cases |
| 三菱マテリアル株式会社 | 10 cases |
| 株式会社日立製作所 | 5 cases |
| 株式会社東芝 | 5 cases |
| 日本電気株式会社 | 5 cases |
| 京セラ株式会社 | 1 cases |
Trends in filing of joint patent applications for the target period (2014 to 2024).
Comparing the number of applications of each company, 三菱電機株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 629 cases, followed by 株式会社デンソー with 553 cases.
| Name | Cases |
|---|---|
| 三菱電機株式会社 | 629 cases |
| 株式会社デンソー | 553 cases |
| トヨタ自動車株式会社 | 349 cases |
| 富士電機株式会社 | 311 cases |
| 富士通株式会社 | 240 cases |
| 三菱マテリアル株式会社 | 235 cases |
| 京セラ株式会社 | 156 cases |
| 株式会社東芝 | 143 cases |
| 日本電気株式会社 | 103 cases |
| 株式会社日立製作所 | 79 cases |
| パナソニックホールディングス株式会社 | 6 cases |
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
Top company information (JP)
The patent information of the higher applicant in the technical theme 半導体または固体装置の冷却等技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
among the top coapplicants, 三菱電機株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 75 cases, followed by 株式会社デンソー with 37 cases.
Trends in filing of joint patent applications for the target period (2014 to 2024).
among the top coapplicants, 三菱電機株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 629 cases, followed by 株式会社デンソー with 553 cases.
Top company, Change in the Number of JP Patents
Below is a ranking of the number of JP patent applications by 半導体または固体装置の冷却等技術’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 半導体または固体装置の冷却等技術’s top 7 coapplicants over the last 20 years.
Top company Details (JP)
Trends in filing of joint patent applications with 三菱電機株式会社
半導体または固体装置の冷却等技術 filed 629 joint applications with 三菱電機株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 333 cases in total) is 55.5, and the median is 55.0. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2019 with 87 cases, and their lowest number in 2021 with 48 cases.
| Index | Value |
|---|---|
| Average | 55.5 patents |
| Std Dev | 19.9 |
| COV | 0.4 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 54 cases | +12.50 % |
| 2021 year | 48 cases | -14.29 % |
| 2020 year | 56 cases | -35.6 % |
Trends in filing of joint patent applications with 株式会社日立製作所
半導体または固体装置の冷却等技術 filed 79 joint applications with 株式会社日立製作所 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 39 cases in total) is 6.5, and the median is 5.0. The coefficient of variation (standard deviation/mean) is 0.9, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2020 with 19 cases, and their lowest number in 2021 with 4 cases.
| Index | Value |
|---|---|
| Average | 6.5 patents |
| Std Dev | 5.9 |
| COV | 0.9 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 5 cases | +25.00 % |
| 2021 year | 4 cases | -78.9 % |
| 2020 year | 19 cases | +280 % |
Trends in filing of joint patent applications with 株式会社デンソー
半導体または固体装置の冷却等技術 filed 553 joint applications with 株式会社デンソー for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 311 cases in total) is 51.8, and the median is 47.0. The coefficient of variation (standard deviation/mean) is 0.6, and there have been big fluctuations in the number of filings from year to year.
The highest number of filings in 2019 with 94 cases, and their lowest number in 2022 with 19 cases.
| Index | Value |
|---|---|
| Average | 51.8 patents |
| Std Dev | 29.6 |
| COV | 0.6 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 19 cases | -55.8 % |
| 2021 year | 43 cases | -15.69 % |
| 2020 year | 51 cases | -45.7 % |
Trends in filing of joint patent applications with 富士通株式会社
半導体または固体装置の冷却等技術 filed 240 joint applications with 富士通株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 72 cases in total) is 12.0, and the median is 8.5. The coefficient of variation (standard deviation/mean) is 0.7, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2014 with 44 cases, and their lowest number in 2021 with 5 cases.
| Index | Value |
|---|---|
| Average | 12.0 patents |
| Std Dev | 8.9 |
| COV | 0.7 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 9 cases | +80.0 % |
| 2021 year | 5 cases | -37.5 % |
| 2020 year | 8 cases | -61.9 % |
Trends in filing of joint patent applications with 株式会社東芝
半導体または固体装置の冷却等技術 filed 143 joint applications with 株式会社東芝 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 37 cases in total) is 6.2, and the median is 5.0. The coefficient of variation (standard deviation/mean) is 0.6, and there have been big fluctuations in the number of filings from year to year.
The highest number of filings in 2015 with 34 cases, and their lowest number in 2022 with 2 cases.
| Index | Value |
|---|---|
| Average | 6.2 patents |
| Std Dev | 3.6 |
| COV | 0.6 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 2 cases | -60.0 % |
| 2021 year | 5 cases | 0 |
| 2020 year | 5 cases | -54.5 % |
Information on important patents (JP)
The following shows JP patents held by 半導体または固体装置の冷却等技術 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 半導体または固体装置の冷却等技術’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 半導体または固体装置の冷却等技術 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
Glossary
- Cited
- Indicates that the patent/patent application has been cited (by Examiners) in notices of reasons for rejection in the examination process of other (Japanese, U.S., or European) patent applications. The higher the number of citations, the more important the patent/patent application is considered to be.
- Request for invalidation trial
- Indicates that a third party has requested a procedure to invalidate the patent. It is likely to affect the business of third parties and is considered to be of high importance.
- Opposition
- Indicates that a third party has filed a petition with the Patent Office to hear the validity of the patent again. Like the trial for invalidation, it is considered to be of high importance.
- Information provision
- Indicates that a third party has provided the Patent Office with useful information for examination for the patent filed. It is usually considered to be of high importance because it is done to prevent the patent from being granted.
- Browsing request
- Indicates that a third party has requested the Patent Office to view the patent bag (a set of documents exchanged between the Patent Office and the applicant). The bag is often checked prior to trial for invalidation, opposition, and provision of information, and is considered to be a highly important patent.
Oppositioned cases
List of latest Oppositioned patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 33 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7470032 "グリーンシートおよびその製造方法" (Opposition day 2024-09-25) , next is 特許7445065 "熱伝導性組成物、及び積層体の製造方法" (Opposition day 2024-08-28) .
| - | No. | Title | Opposition days |
|---|---|---|---|
| 1 | 特許7470032 | グリーンシートおよびその製造方法 | 2024-09-25 |
| 2 | 特許7445065 | 熱伝導性組成物、及び積層体の製造方法 | 2024-08-28 |
| 3 | 特許7441070 | 窒化アルミニウム基板、電子装置及び電子モジュール | 2024-08-27 |
| 4 | 特許7432040 | 窒化ケイ素焼結体 | 2024-07-23 |
| 5 | 特許7384560 | 熱伝導シート、熱伝導シートの実装方法、電子機器の製造方法 | 2024-03-21 |
| 6 | 特許7315133 | 熱伝導性組成物 | 2023-12-21 |
| 7 | 特許7287900 | 熱伝導及び電気絶縁のための装置 | 2023-12-05 |
| 8 | 特許7281093 | 熱伝導性シート | 2023-11-24 |
| 9 | 特許7272352 | アルミナを含有する樹脂組成物及び放熱部材 | 2023-11-09 |
| 10 | 特許7264627 | セラミック板、半導体装置および半導体モジュール | 2023-10-23 |
Protested cases
List of latest Protested patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 25 patents Protest from third parties. The average number of Protest is 1.5 times. The most recently Protest patent is 特開2024-046684 "保持装置" (Protest day 2024-10-28) , next is 特開2023-018445 "導電性ペースト、高熱伝導性材料および半導体装置" (Protest day 2024-10-04) .
| - | No. | Title | Protest days |
|---|---|---|---|
| 1 | 特開2024-046684 | 保持装置 | 2024-10-28 |
| 2 | 特開2023-018445 | 導電性ペースト、高熱伝導性材料および半導体装置 | 2024-10-04 |
| 3 | 特開2024-046683 | 保持装置 | 2024-10-02 |
| 4 | 特開2023-104942 | 熱伝導シート | 2024-09-27 |
| 5 | 特開2024-046686 | 保持装置 | 2024-09-04 |
| 6 | 特許7556872 | 放熱シート | 2024-05-08 |
| 7 | 特開2023-148623 | 熱伝導性組成物 | 2024-03-28 |
| 8 | 特許7556871 | 放熱シート | 2024-03-19 |
| 9 | 特許7577046 | 熱伝導性シリコーン組成物 | 2024-02-29 |
| 10 | 特許7470032 | グリーンシートおよびその製造方法 | 2023-12-12 |
| 11 | 特表2022-549450 | 電子アセンブリのための工学材料 | 2023-11-06 |
| 12 | 特許7519378 | 熱伝導性シリコーンポッティング組成物 | 2023-09-11 |
| 13 | 特開2022-042309 | 熱伝導部材及びその製造方法、並びに放熱構造体 | 2023-07-20 |
| 14 | 特許7389014 | 絶縁放熱シート | 2023-02-06 |
| 15 | 特許7264627 | セラミック板、半導体装置および半導体モジュール | 2023-01-17 |
| 16 | 特許7287900 | 熱伝導及び電気絶縁のための装置 | 2022-12-26 |
| 17 | 特許6950848 | 半導体パッケージに用いる熱伝導性組成物 | 2022-08-26 |
| 18 | 特許7212768 | セラミックス回路基板および電子部品モジュール | 2022-07-07 |
| 19 | 特許7278998 | 熱伝導シート | 2022-06-21 |
| 20 | 特許7405806 | パワーモジュール | 2022-06-09 |
Top Patents/Patent Applications with the Highest Number of Protested
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 70 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.3. The most protest patent is 特許7264627 "セラミック板、半導体装置および半導体モジュール" (4 times) , and the next most protest patent is 特開2024-046684 "保持装置" (3 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許7264627 | セラミック板、半導体装置および半導体モジュール | 4 times |
| 2 | 特開2024-046684 | 保持装置 | 3 times |
| 3 | 特許7278998 | 熱伝導シート | 3 times |
| 4 | 特許6794613 | 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、及び成形体 | 3 times |
| 5 | 特許7230432 | 接合体、及び、絶縁回路基板 | 2 times |
Inspectioned cases
List of latest Inspectioned patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 42 patents Inspection from third parties. The average number of Inspection is 1.5 times. The most recently Inspection patent is 特開2024-046684 "保持装置" (Inspection day 2024-11-20) , next is 特開2024-046683 "保持装置" (Inspection day 2024-10-23) .
| - | No. | Title | Inspection days |
|---|---|---|---|
| 1 | 特開2024-046684 | 保持装置 | 2024-11-20 |
| 2 | 特開2024-046683 | 保持装置 | 2024-10-23 |
| 3 | 特開2023-018445 | 導電性ペースト、高熱伝導性材料および半導体装置 | 2024-10-08 |
| 4 | 特開2024-046686 | 保持装置 | 2024-10-02 |
| 5 | 特開2023-104942 | 熱伝導シート | 2024-10-01 |
| 6 | 特許7519378 | 熱伝導性シリコーンポッティング組成物 | 2024-08-22 |
| 7 | 特開2024-148151 | 高集積化パワーエレクトロニクス及び高集積化パワーエレクトロニクスの製造方法 | 2024-07-04 |
| 8 | 特開2024-120177 | パワーエレクトロニクスデバイスがフリップチップ内に組み込まれたパワーエレクトロニクスアセンブリ | 2024-06-21 |
| 9 | 特開2023-148623 | 熱伝導性組成物 | 2024-04-08 |
| 10 | 特開2023-140028 | 電子機器 | 2024-03-18 |
| 11 | 特許7577046 | 熱伝導性シリコーン組成物 | 2024-03-13 |
| 12 | 特許7470032 | グリーンシートおよびその製造方法 | 2023-12-14 |
| 13 | 特表2022-549450 | 電子アセンブリのための工学材料 | 2023-12-01 |
| 14 | 特開2024-059088 | パワーエレクトロニクスデバイスを組み込んだパワーエレクトロニクスアセンブリ | 2023-11-06 |
| 15 | 特開2024-059580 | ２重のグラファイト層を含むパワーエレクトロニクスデバイスアセンブリ、及びパワーエレクトロニクスデバイスアセンブリを組み込んだ冷却板 | 2023-11-06 |
| 16 | 特許7592799 | 電気絶縁層を有するパワーエレクトロニクスデバイスアセンブリ | 2023-11-06 |
| 17 | 特開2024-028177 | Ｓセルを組み込んだコールドプレート | 2023-09-08 |
| 18 | 特許7594058 | 埋め込まれたパワーエレクトロニクスデバイスを有するパワーエレクトロニクスアセンブリ | 2023-08-25 |
| 19 | 特開2022-042309 | 熱伝導部材及びその製造方法、並びに放熱構造体 | 2023-08-04 |
| 20 | 特許7584307 | ゲルタイプの熱界面材料 | 2023-05-02 |
Top Patents/Patent Applications with the Highest Number of Inspectioned
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 106 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.3. The most inspection patent is 特開2015-156490 "熱伝導シート、その製造方法及び熱伝導シートを用いた放熱装置" (5 times) , and the next most inspection patent is 特許7264627 "セラミック板、半導体装置および半導体モジュール" (5 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特開2015-156490 | 熱伝導シート、その製造方法及び熱伝導シートを用いた放熱装置 | 5 times |
| 2 | 特許7264627 | セラミック板、半導体装置および半導体モジュール | 5 times |
| 3 | 特許7170629 | 焼結体、基板、回路基板、および焼結体の製造方法 | 4 times |
| 4 | 特開2024-046684 | 保持装置 | 4 times |
| 5 | 特開2024-046686 | 保持装置 | 3 times |
Cited cases
Top Patents/Patent Applications with the Highest Number of Cited
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 2,110 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.6. The most cited patent is 特許6871183 "放熱構造体およびそれを備えるバッテリー" (21 times) , and the next most cited patent is 特許6372516 "液冷ジャケットの製造方法及び液冷ジャケット" (21 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6871183 | 放熱構造体およびそれを備えるバッテリー | 21 times |
| 2 | 特許6372516 | 液冷ジャケットの製造方法及び液冷ジャケット | 21 times |
| 3 | 特許6867102 | 銅放熱材、キャリア付銅箔、コネクタ、端子、積層体、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法 | 20 times |
| 4 | 特許6578900 | 半導体装置及びその製造方法 | 20 times |
| 5 | 特許7284566 | 半導体装置 | 18 times |
Providing patent information to the media (newspapers, magazines, etc.)
"Patent Integration Report" is a web service provided by "Patent Integration Co., Ltd." operated by patent attorneys who are experts in intellectual property rights. Based on the latest patent data, this is one of the largest patent report services in Japan that provides information on technology trends in various companies and technology fields.
The purpose of this web service is to make intellectual property information familiar to many people, regardless of whether they have an interest in intellectual property rights, and to make use of it.
We actively provide various types of patent information that can be used in various media articles such as newspapers, magazines, and web media. Please feel free to contact us from "Inquiry form for details on the content of patent information that can be provided, conditions for provision, etc. Please contact us.
About this Site
All rights related to the data, documents and charts belong to "an integrated patent search/analysis service provider, Patent Integration". Please specify the source “Patent Integration Report, URL: https://patent-i.com/report/en/" when inserting them into in-house materials, external report materials, etc., regardless of whether they are paid or free of charge.
Patent data is obtained by aggregating and analyzing the latest patent data issued by the Patent Offices of respective countries and jurisdictions and by WIPO. Although we take great care in publishing and analyzing the results, we do not guarantee the correctness of the data. We appreciate your understanding.
If you have any concerns about this service, please feel free to contact us.
All rights to the data, documents, figures and tables are reserved by e-Patent. When publishing internal documents, external reports, etc. (whether paid or free of charge), please use the following URL: https://e-patent.co.jp/.
Please note the following points for use.
e-Patent will not be liable for any damages or losses arising from the use of the global patent application status, ranking information, or population search formula in the "SDGs Global Company Ranking from a Patent Perspective". Items with ● in front of the target are not supported at this time (judged to be difficult to approach from the patent information analysis).
Citation of patent application status and ranking information
There is no problem to cite patent application status and ranking information, but please clearly indicate "Source: e-Patent Co.
Graphs are image data.
Please note that the various graphs are image data, but we cannot provide them in text data.Scope of coverage for each goal/target
- Based on the description of each goal and target of the SDGs, we have set the scope of technologies to be covered based on our and e-Patent's past experience, etc. (in some cases, the search is based on social issues themselves). Therefore, please note that there is a possibility that this "SDGs Global Company Ranking from Patent Perspective" may not cover 100%.
- A population search formula is clearly indicated for each goal/target (database: Patent Integration). You may use the population search formula as it is, or you may improve it by yourself.
- This search covers patents and utility models, including both published and registered patents (design and design patents are excluded). The unit of count is the number of applications, not the number of patent families.
About the name collation and name control of applicants and right holders
- Company rankings are based on the results calculated by "Patent Integration", with Japanese organizations in Japanese and other companies in English (some are in Japanese).
- Company names may be the names of the companies at the time of application, but the results calculated by Patent Integration are used as is. Company names are used as they were at the time of application.
- Because of the fluctuation in the names of companies (i.e., applicant/right holder names in the patent information), there are cases where the same company appears more than once in the top 10. The number of applications filed by the same company in the top 10 is the total number of applications filed by the company.
Credit notation
・MeCab user dictionary for science technology term © National Bioscience Database Center licensed under CC Attribution-Share Alike 4.0 International
Our Commitment to Safety and Security
Patent Integration Co., Ltd. is committed to providing high-quality patent information based on the latest patent data on more than 45 million cases collected from the Patent Offices in Japan, the U.S., Europe, and Taiwan and from PCT publication. 
Patent Integration Co., Ltd. collects the patent data from the Patent Offices in Japan, the U.S., Europe, and Taiwan and from PCT publications to provide it widely in the form of reports so that anyone can check patent information and patent trends with confidence. 
Patent Integration Co., Ltd. is committed to various efforts to enhance the reliability of the information and to allow users to search patent information with confidence.