5F057 半導体の機械的処理技術 Patent Trends
The Theme Code "半導体の機械的処理技術" had 646 patent application filings in the publication-lag-adjusted comparison period (2024-01-01 to 2024-10-31). This is a slightly increased of +10 filings (1.6%) over 636 they had in the same period of the previous year (2023-01-01 to 2023-10-31).
The highest number of filings in 2022 with 993 cases, and their lowest number in 2023 with 762 cases (years covered: 2021, 2022, 2023, 2024).
The mean of the number of filings over the last 4 years (2021 to 2024, 3,467 cases in total) is 867, and the median is 856. The coefficient of variation (standard deviation/mean) is 0.12, and filings have been moderate fluctuations.
| Index | Value |
|---|---|
| Average | 867 patents |
| Std Dev | 101 |
| COV | 0.12 |
The number of filings has been decreasing for the publication-lag-adjusted last 3 years (2023 to 2025).
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 184 cases | -76.2% |
| 2024 year | 774 cases | +1.57% |
| 2023 year | 762 cases | -23.26% |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 半導体の機械的処理技術[5F057] for the period of the last 6 years (2020 to 2025). You can compare the information in this report with the trends in your competitors’ patent filings and technologies.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 半導体の機械的処理技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, and their top coapplicants (joint research partners, alliance partners). It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
半導体の機械的処理技術, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 半導体の機械的処理技術 over the last 6 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
半導体の機械的処理技術 JP patent filing trend (unit: cases)
| Year | Cases |
|---|---|
| 2021 | 938 |
| 2022 | 993 |
| 2023 | 762 |
| 2024 | 774 |
| 2025 | 184 |
Patent Landscape
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 半導体の機械的処理技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
Keywords (importance)
Top keywords frequently used in patent filings for 半導体の機械的処理技術 are shown below.
Top keywords for 半導体の機械的処理技術
| Keyword | Score |
|---|---|
| 加工 | 100.0 |
| 表面 | 86.32 |
| 研磨 | 74.51 |
| パッド | 61.29 |
| 研削 | 59.17 |
| 含有 | 46.73 |
| 回転 | 46.63 |
| 方向 | 38.38 |
| 組成 | 38.35 |
| 修正 | 35.51 |
| 基板 | 32.4 |
| テーブル | 31.13 |
| 砥 | 30.71 |
| 粒子 | 25.49 |
| 外周 | 24.77 |
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 3,651 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
半導体の機械的処理技術[5F057]
Recent publications
| Publication No. | Title | Bibliographic info | Theme |
|---|---|---|---|
| 1. JPP7920060 | 被加工物の処理方法 | ・Applicant 株式会社ディスコ ・Filing date 2023-01-17 ・Publication date 2026-09-14 | 3C043, 5F057, 5F063, 5F131 |
| 2. JPP7919804 | 半導体加工用粘着テープ | ・Applicant 日東電工株式会社 ・Filing date 2022-05-17 ・Publication date 2026-09-14 | 4J004, 4J040, 5F057 |
| 3. JPP7920448 | 硫黄含有アニオン性界面活性剤を含むタングステンＣＭＰ組成物 | ・Applicant シーエムシーマテリアルズリミティドライアビリティカンパニー ・Filing date 2023-09-19 ・Publication date 2026-09-14 | 5F057 |
| 4. JPA-HYO2026-531000 | 研磨中のプロセス信頼性のための音響モニタリング | ・Applicant アプライドマテリアルズインコーポレイテッド ・Filing date 2024-07-18 ・Publication date 2026-09-11 | 2G047, 3C158, 5F057 |
| 5. JPA2026-143954 | 基板処理装置、供給装置 | ・Applicant 株式会社荏原製作所 ・Filing date 2025-02-28 ・Publication date 2026-09-09 | 3C047, 3C158, 5F057, 5F131, 5F157 |
| 6. JPA2026-144670 | 加工装置および加工方法 | ・Applicant 株式会社東京精密 ・Filing date 2025-02-28 ・Publication date 2026-09-09 | 3C047, 5F057 |
| 7. JPA2026-144234 | 加工装置、及びワークの加工方法 | ・Applicant 株式会社ディスコ ・Filing date 2025-02-28 ・Publication date 2026-09-09 | 3C034, 3C043, 3C047, 5F057 |
| 8. JPA2026-144671 | ウェーハ加工システム | ・Applicant 株式会社東京精密 ・Filing date 2025-02-28 ・Publication date 2026-09-09 | 3C034, 3C158, 5F057, 5F131 |
| 9. JPA2026-142767 | 保持テーブル、処理装置、処理方法及びチップの製造方法 | ・Applicant 株式会社ディスコ ・Filing date 2025-02-27 ・Publication date 2026-09-08 | 3C034, 3C043, 3C158, 5F057, 5F063, +1 more |
| 10. JPA2026-142796 | ウェーハ加工装置 | ・Applicant 株式会社東京精密 ・Filing date 2025-02-27 ・Publication date 2026-09-08 | 2F065, 2G051, 5F057 |
| 11. JPA2026-143561 | コロイダルシリカ及びその製造方法 | ・Applicant 扶桑化学工業株式会社 ・Filing date 2023-07-19 ・Publication date 2026-09-08 | 4G072, 5F057 |
| 12. JPP7916908 | セリウム化合物除去用洗浄液、洗浄方法及び半導体ウェハの製造方法 | ・Applicant 三菱ケミカル株式会社 ・Filing date 2022-08-23 ・Publication date 2026-09-08 | 4H003, 5F057, 5F157 |
| 13. JPA2026-142797 | ウェーハ加工装置 | ・Applicant 株式会社東京精密 ・Filing date 2025-02-27 ・Publication date 2026-09-08 | 2F065, 3C034, 3C049, 5F057, 5F131 |
| 14. JPA2026-143695 | 研磨パッドおよびその製造方法 | ・Applicant エンパルスカンパニーリミテッド ・Filing date 2024-09-03 ・Publication date 2026-09-08 | 3C158, 5F057 |
| 15. JPA-HYO2026-530512 | 高濃度ドープホウ素シリコン膜のための酸化チタン系化学機械研磨組成物 | ・Applicant インテグリス・インコーポレーテッド ・Filing date 2024-08-30 ・Publication date 2026-09-08 | 5F057 |
Same industry / competition company information (JP)
{'ja': '技術テーマ「半導体の機械的処理技術」における上位出願人の特許情報を以下に示します。各企業の特許件数を比較することで、過去および現在の各社の技術テーマにおける研究開発状況や、技術テーマにおける各社の位置付けを確認できます。なお、特許は出願から公開までに一年半のタイムラグがあるため、一年半より直近の状況については分析できない点に注意する必要があります。', 'en': "The patent information of the higher applicant in the technical theme 半導体の機械的処理技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme. Patents have a time lag of about 18 months from filing to publication."}
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
Comparing the number of applications of each company, 株式会社ディスコ has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 625 cases, followed by 株式会社荏原製作所 with 139 cases.
| Name | Cases |
|---|---|
| 株式会社ディスコ | 625 cases |
| 株式会社荏原製作所 | 139 cases |
| 株式会社フジミインコーポレーテッド | 57 cases |
| 富士紡ホールディングス株式会社 | 57 cases |
| アプライドマテリアルズインコーポレイテッド | 34 cases |
| 東京エレクトロン株式会社 | 34 cases |
Trends in filing of joint patent applications for the target period (2020 to 2025).
Comparing the number of applications of each company, 株式会社ディスコ has the highest number of joint applications in the last for the target period (2020 to 2025) with 1,457 cases, followed by 株式会社荏原製作所 with 348 cases.
| Name | Cases |
|---|---|
| 株式会社ディスコ | 1,457 cases |
| 株式会社荏原製作所 | 348 cases |
| アプライドマテリアルズインコーポレイテッド | 182 cases |
| 株式会社フジミインコーポレーテッド | 172 cases |
| 東京エレクトロン株式会社 | 171 cases |
| 富士紡ホールディングス株式会社 | 153 cases |
Same industry / competition company JP patent filing ranking
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業の長期推移をどう読むか
同業や競合企業の長期的な特許出願件数の推移から、長期トレンドと出願件数の山や谷を確認することができます。
解説の続きを読む
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 6 companies in the same industry over the past 6 years.
Competitor filing ranking
| Name | Cases |
|---|---|
| 株式会社ディスコ | 1,457 |
| 株式会社荏原製作所 | 348 |
| アプライドマテリアルズインコーポレイテッド | 182 |
| 株式会社フジミインコーポレーテッド | 172 |
| 東京エレクトロン株式会社 | 171 |
| 富士紡ホールディングス株式会社 | 153 |
Top company information (JP)
{'ja': '技術テーマ「半導体の機械的処理技術」における上位出願人の特許情報を以下に示します。各企業の特許件数を比較することで、過去および現在の各社の技術テーマにおける研究開発状況や、技術テーマにおける各社の位置付けを確認できます。なお、特許は出願から公開までに一年半のタイムラグがあるため、一年半より直近の状況については分析できない点に注意する必要があります。', 'en': "The patent information of the higher applicant in the technical theme 半導体の機械的処理技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme. Patents have a time lag of about 18 months from filing to publication."}
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業との比較のポイント
同業や競合企業が特許に注力している分野を知ることで、自社の戦略や製品開発の方向性を把握することができます。
解説の続きを読む
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
among the top coapplicants, 株式会社ディスコ has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 625 cases, followed by 株式会社荏原製作所 with 139 cases.
| Name | Cases |
|---|---|
| 株式会社ディスコ | 625 cases |
| 株式会社荏原製作所 | 139 cases |
| 株式会社フジミインコーポレーテッド | 57 cases |
Trends in filing of joint patent applications for the target period (2020 to 2025).
among the top coapplicants, 株式会社ディスコ has the highest number of joint applications in the last for the target period (2020 to 2025) with 1,457 cases, followed by 株式会社荏原製作所 with 348 cases.
| Name | Cases |
|---|---|
| 株式会社ディスコ | 1,457 cases |
| 株式会社荏原製作所 | 348 cases |
| 株式会社フジミインコーポレーテッド | 172 cases |
Top company JP patent filing ranking
Below is a ranking of the number of JP patent applications by 半導体の機械的処理技術’s top 3 coapplicants over the last 6 years.
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業の長期推移をどう読むか
同業や競合企業の長期的な特許出願件数の推移から、長期トレンドと出願件数の山や谷を確認することができます。
解説の続きを読む
Top co-applicant filing ranking
| Name | Cases |
|---|---|
| 株式会社ディスコ | 1,457 |
| 株式会社荏原製作所 | 348 |
| アプライドマテリアルズインコーポレイテッド | 182 |
Top company, Change in the Number of JP Patents
Below is a patent map showing the changes in the numbers of JP patent filings by 半導体の機械的処理技術’s top 3 coapplicants over the last 6 years.
Top co-applicant filing ranking
| Name | Cases |
|---|---|
| 株式会社ディスコ | 1,457 |
| 株式会社荏原製作所 | 348 |
| アプライドマテリアルズインコーポレイテッド | 182 |
Top company details
Trends in filing of joint patent applications with 株式会社ディスコ
半導体の機械的処理技術 filed 1,457 joint applications with 株式会社ディスコ for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 1,412 cases in total) is 282, and the median is 290. The coefficient of variation (standard deviation/mean) is 0.09, and filings have been stable.
The number of filings has been decreasing for the publication-lag-adjusted last 3 years (2023 to 2025). The highest number of filings in 2022 with 323 cases, and their lowest number in 2020 with 248 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 282 patents |
| Std Dev | 26.1 |
| COV | 0.09 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 45 cases | -84.5% |
| 2024 year | 290 cases | 0 |
| 2023 year | 290 cases | -10.22% |
Trends in filing of joint patent applications with 株式会社荏原製作所
半導体の機械的処理技術 filed 348 joint applications with 株式会社荏原製作所 for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 336 cases in total) is 67.2, and the median is 70.0. The coefficient of variation (standard deviation/mean) is 0.14, and filings have been moderate fluctuations.
The number of filings has been decreasing for the publication-lag-adjusted last 3 years (2023 to 2025). The highest number of filings in 2022 with 81 cases, and their lowest number in 2023 with 55 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 67.2 patents |
| Std Dev | 9.5 |
| COV | 0.14 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 12 cases | -83.3% |
| 2024 year | 72 cases | +30.9% |
| 2023 year | 55 cases | -32.1% |
Trends in filing of joint patent applications with 株式会社フジミインコーポレーテッド
半導体の機械的処理技術 filed 172 joint applications with 株式会社フジミインコーポレーテッド for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 167 cases in total) is 33.4, and the median is 34.0. The coefficient of variation (standard deviation/mean) is 0.20, and filings have been moderate fluctuations.
The number of filings has been decreasing for the publication-lag-adjusted last 3 years (2023 to 2025). The highest number of filings in 2020 with 41 cases, and their lowest number in 2023 with 23 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 33.4 patents |
| Std Dev | 6.8 |
| COV | 0.20 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 5 cases | -82.8% |
| 2024 year | 29 cases | +26.09% |
| 2023 year | 23 cases | -32.4% |
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佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業との比較のポイント
同業や競合企業が特許に注力している分野を知ることで、自社の戦略や製品開発の方向性を把握することができます。
解説の続きを読む