3C043 円筒・平面研削技術 Patent Trends
The Theme Code "円筒・平面研削技術" had 227 patent application filings in the publication-lag-adjusted comparison period (2024-01-01 to 2024-10-31). This is a small increased of +9 filings (4.1%) over 218 they had in the same period of the previous year (2023-01-01 to 2023-10-31).
The highest number of filings in 2022 with 299 cases, and their lowest number in 2023 with 255 cases (years covered: 2021, 2022, 2023, 2024).
The mean of the number of filings over the last 4 years (2021 to 2024, 1,089 cases in total) is 272, and the median is 268. The coefficient of variation (standard deviation/mean) is 0.06, and filings have been stable.
| Index | Value |
|---|---|
| Average | 272 patents |
| Std Dev | 17.3 |
| COV | 0.06 |
The number of filings has been decreasing for the publication-lag-adjusted last 3 years (2023 to 2025).
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 70 cases | -73.0% |
| 2024 year | 259 cases | +1.57% |
| 2023 year | 255 cases | -14.72% |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 円筒・平面研削技術[3C043] for the period of the last 6 years (2020 to 2025). You can compare the information in this report with the trends in your competitors’ patent filings and technologies.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 円筒・平面研削技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, and their top coapplicants (joint research partners, alliance partners). It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
円筒・平面研削技術, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 円筒・平面研削技術 over the last 6 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
円筒・平面研削技術 JP patent filing trend (unit: cases)
| Year | Cases |
|---|---|
| 2021 | 276 |
| 2022 | 299 |
| 2023 | 255 |
| 2024 | 259 |
| 2025 | 70 |
Patent Landscape
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 円筒・平面研削技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
Keywords (importance)
Top keywords frequently used in patent filings for 円筒・平面研削技術 are shown below.
Top keywords for 円筒・平面研削技術
| Keyword | Score |
|---|---|
| 加工 | 100.0 |
| 砥石 | 75.05 |
| 回転 | 65.45 |
| 方向 | 61.77 |
| 表面 | 44.86 |
| テーブル | 41.12 |
| 修正 | 35.09 |
| 位置 | 32.87 |
| 有 | 28.92 |
| 外周 | 27.43 |
| 保持 | 26.64 |
| チャック | 25.64 |
| 間 | 22.4 |
| 支持 | 20.75 |
| 移動 | 20.69 |
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 1,159 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
円筒・平面研削技術[3C043]
Recent publications
| Publication No. | Title | Bibliographic info | Theme |
|---|---|---|---|
| 1. JPA2026-162622 | 加工装置、及びウェーハの厚さ測定方法 | ・Applicant 株式会社東京精密 ・Filing date 2025-03-27 ・Publication date 2026-10-09 | 3C034, 3C043, 5F057 |
| 2. JPA2026-164153 | 処理方法および処理装置 | ・Applicant 株式会社ディスコ ・Filing date 2025-03-28 ・Publication date 2026-10-09 | 3C029, 3C034, 3C043, 5F057 |
| 3. JPA2026-163188 | 加工装置およびエッジトリミングの終点検出方法 | ・Applicant 株式会社東京精密 ・Filing date 2025-03-28 ・Publication date 2026-10-09 | 3C029, 3C034, 3C043, 5F057 |
| 4. JPA2026-163816 | 研削ホイール、被加工物の研削方法及びチップの製造方法 | ・Applicant 株式会社ディスコ ・Filing date 2025-03-28 ・Publication date 2026-10-09 | 3C034, 3C043, 5F057, 5F063 |
| 5. JPA2026-164470 | 圧延ロール研削用レジノイド砥石 | ・Applicant ノリタケ株式会社 ・Filing date 2025-03-28 ・Publication date 2026-10-09 | 3C043, 3C063 |
| 6. JPA2026-163819 | 基板の製造方法、レーザー加工装置、基板製造装置、及びチップの製造方法 | ・Applicant 株式会社ディスコ ・Filing date 2025-03-28 ・Publication date 2026-10-09 | 3C043, 4E168, 5F057 |
| 7. JPA2026-164102 | 研削装置および希土類系焼結磁石の製造方法 | ・Applicant 株式会社プロテリアルマグネティクス ・Filing date 2025-03-28 ・Publication date 2026-10-09 | 3C034, 3C043, 3C049, 5E062 |
| 8. JPA2026-161820 | 軌道輪の製造方法 | ・Applicant 株式会社ジェイテクト ・Filing date 2025-03-27 ・Publication date 2026-10-08 | 3C043, 3C049, 3C158, 3J701 |
| 9. JPA2026-161860 | 板状の被加工物の研削方法、研削装置、及びチップの製造方法 | ・Applicant 株式会社ディスコ ・Filing date 2025-03-27 ・Publication date 2026-10-08 | 3C043, 3C047, 5F057, 5F063 |
| 10. JPA2026-161945 | 研削装置、研削方法 | ・Applicant 株式会社東京精密 ・Filing date 2025-03-27 ・Publication date 2026-10-08 | 3C034, 3C043, 5F057 |
| 11. JPA2026-160343 | 研磨装置および研磨方法 | ・Applicant 株式会社荏原製作所 ・Filing date 2025-03-26 ・Publication date 2026-10-08 | 3C034, 3C043, 3C049, 5F057 |
| 12. JPA2026-161848 | 加工装置 | ・Applicant 株式会社ディスコ ・Filing date 2025-03-27 ・Publication date 2026-10-08 | 3C034, 3C043, 3C047, 5F057 |
| 13. JPA2026-161946 | 研削装置 | ・Applicant 株式会社東京精密 ・Filing date 2025-03-27 ・Publication date 2026-10-08 | 3C034, 3C043, 5F057 |
| 14. JPA2026-157907 | 定寸装置、研削焼け状態評価システム及び表面性状推定システム | ・Applicant 株式会社ジェイテクト ・Filing date 2025-03-24 ・Publication date 2026-10-07 | 2G053, 3C029, 3C034, 3C043 |
| 15. JPA2026-157938 | 貼り合わせウェーハの研削方法 | ・Applicant 株式会社ディスコ ・Filing date 2025-03-24 ・Publication date 2026-10-07 | 3C043, 3C049, 5F057 |
Same industry / competition company information (JP)
{'ja': '技術テーマ「円筒・平面研削技術」における上位出願人の特許情報を以下に示します。各企業の特許件数を比較することで、過去および現在の各社の技術テーマにおける研究開発状況や、技術テーマにおける各社の位置付けを確認できます。なお、特許は出願から公開までに一年半のタイムラグがあるため、一年半より直近の状況については分析できない点に注意する必要があります。', 'en': "The patent information of the higher applicant in the technical theme 円筒・平面研削技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme. Patents have a time lag of about 18 months from filing to publication."}
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
Comparing the number of applications of each company, 株式会社ディスコ has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 361 cases, followed by 株式会社東京精密 with 25 cases.
| Name | Cases |
|---|---|
| 株式会社ディスコ | 361 cases |
| 株式会社東京精密 | 25 cases |
| 株式会社ジェイテクト | 19 cases |
| 東京エレクトロン株式会社 | 10 cases |
| ノリタケ株式会社 | 5 cases |
| JFEスチール株式会社 | 4 cases |
Trends in filing of joint patent applications for the target period (2020 to 2025).
Comparing the number of applications of each company, 株式会社ディスコ has the highest number of joint applications in the last for the target period (2020 to 2025) with 835 cases, followed by 株式会社ジェイテクト with 67 cases.
| Name | Cases |
|---|---|
| 株式会社ディスコ | 835 cases |
| 株式会社ジェイテクト | 67 cases |
| 株式会社東京精密 | 57 cases |
| 東京エレクトロン株式会社 | 52 cases |
| ノリタケ株式会社 | 18 cases |
| JFEスチール株式会社 | 14 cases |
Same industry / competition company JP patent filing ranking
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業の長期推移をどう読むか
同業や競合企業の長期的な特許出願件数の推移から、長期トレンドと出願件数の山や谷を確認することができます。
解説の続きを読む
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 6 companies in the same industry over the past 6 years.
Competitor filing ranking
| Name | Cases |
|---|---|
| 株式会社ディスコ | 835 |
| 株式会社ジェイテクト | 67 |
| 株式会社東京精密 | 57 |
| 東京エレクトロン株式会社 | 52 |
| ノリタケ株式会社 | 18 |
| JFEスチール株式会社 | 14 |
Top company information (JP)
{'ja': '技術テーマ「円筒・平面研削技術」における上位出願人の特許情報を以下に示します。各企業の特許件数を比較することで、過去および現在の各社の技術テーマにおける研究開発状況や、技術テーマにおける各社の位置付けを確認できます。なお、特許は出願から公開までに一年半のタイムラグがあるため、一年半より直近の状況については分析できない点に注意する必要があります。', 'en': "The patent information of the higher applicant in the technical theme 円筒・平面研削技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme. Patents have a time lag of about 18 months from filing to publication."}
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業との比較のポイント
同業や競合企業が特許に注力している分野を知ることで、自社の戦略や製品開発の方向性を把握することができます。
解説の続きを読む
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
among the top coapplicants, 株式会社ディスコ has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 361 cases, followed by 株式会社東京精密 with 25 cases.
| Name | Cases |
|---|---|
| 株式会社ディスコ | 361 cases |
| 株式会社東京精密 | 25 cases |
| 株式会社ジェイテクト | 19 cases |
Trends in filing of joint patent applications for the target period (2020 to 2025).
among the top coapplicants, 株式会社ディスコ has the highest number of joint applications in the last for the target period (2020 to 2025) with 835 cases, followed by 株式会社ジェイテクト with 67 cases.
| Name | Cases |
|---|---|
| 株式会社ディスコ | 835 cases |
| 株式会社ジェイテクト | 67 cases |
| 株式会社東京精密 | 57 cases |
Top company JP patent filing ranking
Below is a ranking of the number of JP patent applications by 円筒・平面研削技術’s top 3 coapplicants over the last 6 years.
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業の長期推移をどう読むか
同業や競合企業の長期的な特許出願件数の推移から、長期トレンドと出願件数の山や谷を確認することができます。
解説の続きを読む
Top co-applicant filing ranking
| Name | Cases |
|---|---|
| 株式会社ディスコ | 835 |
| 株式会社ジェイテクト | 67 |
| 株式会社東京精密 | 57 |
Top company, Change in the Number of JP Patents
Below is a patent map showing the changes in the numbers of JP patent filings by 円筒・平面研削技術’s top 3 coapplicants over the last 6 years.
Top co-applicant filing ranking
| Name | Cases |
|---|---|
| 株式会社ディスコ | 835 |
| 株式会社ジェイテクト | 67 |
| 株式会社東京精密 | 57 |
Top company details
Trends in filing of joint patent applications with 株式会社ディスコ
円筒・平面研削技術 filed 835 joint applications with 株式会社ディスコ for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 800 cases in total) is 160, and the median is 162. The coefficient of variation (standard deviation/mean) is 0.09, and filings have been stable.
The highest number of filings in 2022 with 183 cases, and their lowest number in 2021 with 138 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 160 patents |
| Std Dev | 14.7 |
| COV | 0.09 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 35 cases | -78.4% |
| 2024 year | 162 cases | -1.22% |
| 2023 year | 164 cases | -10.38% |
Trends in filing of joint patent applications with 株式会社東京精密
円筒・平面研削技術 filed 57 joint applications with 株式会社東京精密 for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 49 cases in total) is 9.8, and the median is 9.0. The coefficient of variation (standard deviation/mean) is 0.3, and filings have been large fluctuations.
The number of filings has been decreasing for the publication-lag-adjusted last 3 years (2023 to 2025). The highest number of filings in 2020 with 15 cases, and their lowest number in 2023 with 6 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 9.8 patents |
| Std Dev | 3.1 |
| COV | 0.3 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 8 cases | -27.27% |
| 2024 year | 11 cases | +83.3% |
| 2023 year | 6 cases | -33.3% |
Trends in filing of joint patent applications with 株式会社ジェイテクト
円筒・平面研削技術 filed 67 joint applications with 株式会社ジェイテクト for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 64 cases in total) is 12.8, and the median is 9.0. The coefficient of variation (standard deviation/mean) is 0.6, and filings have been large fluctuations.
The number of filings has been decreasing for the publication-lag-adjusted last 3 years (2023 to 2025). The highest number of filings in 2022 with 26 cases, and their lowest number in 2020 with 6 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 12.8 patents |
| Std Dev | 7.5 |
| COV | 0.6 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 3 cases | -66.7% |
| 2024 year | 9 cases | +28.57% |
| 2023 year | 7 cases | -73.1% |
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佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業との比較のポイント
同業や競合企業が特許に注力している分野を知ることで、自社の戦略や製品開発の方向性を把握することができます。
解説の続きを読む