5F037 半導体装置の組立体技術 Patent Trends
The Theme Code "半導体装置の組立体技術" had 37 patent application filings in the publication-lag-adjusted comparison period (2024-01-01 to 2024-10-31). This is a significantly increased of +12 filings (48.0%) over 25 they had in the same period of the previous year (2023-01-01 to 2023-10-31).
The highest number of filings in 2024 with 38 cases, and their lowest number in 2023 with 26 cases (years covered: 2021, 2022, 2023, 2024).
The mean of the number of filings over the last 4 years (2021 to 2024, 126 cases in total) is 31.5, and the median is 31.0. The coefficient of variation (standard deviation/mean) is 0.15, and filings have been moderate fluctuations.
| Index | Value |
|---|---|
| Average | 31.5 patents |
| Std Dev | 4.8 |
| COV | 0.15 |
The number of filings has been decreasing for the publication-lag-adjusted last 3 years (2023 to 2025).
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 2 cases | -94.7% |
| 2024 year | 38 cases | +46.2% |
| 2023 year | 26 cases | -23.53% |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 半導体装置の組立体技術[5F037] for the period of the last 6 years (2020 to 2025). You can compare the information in this report with the trends in your competitors’ patent filings and technologies.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 半導体装置の組立体技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, and their top coapplicants (joint research partners, alliance partners). It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
半導体装置の組立体技術, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 半導体装置の組立体技術 over the last 6 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
半導体装置の組立体技術 JP patent filing trend (unit: cases)
| Year | Cases |
|---|---|
| 2021 | 28 |
| 2022 | 34 |
| 2023 | 26 |
| 2024 | 38 |
| 2025 | 2 |
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 128 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
半導体装置の組立体技術[5F037]
Recent publications
| Publication No. | Title | Bibliographic info | Theme |
|---|---|---|---|
| 1. JPA2026-148523 | 透明ディスプレイモジュール及びその製造方法 | ・Applicant 晶呈科技股分有限公司 ・Filing date 2026-03-04 ・Publication date 2026-09-17 | 3K013, 3K014, 5C094, 5F037, 5F142, +1 more |
| 2. JPA-HYO2026-531598 | 多孔質部分を備えるインターポーザに結合された集積デバイス | ・Applicant クアルコムインコーポレイテッド ・Filing date 2024-08-30 ・Publication date 2026-09-17 | 5F037 |
| 3. JPA-HYO2026-531142 | フォトニック集積回路を含むパッケージのための電気相互接続 | ・Applicant シシリーマージャーサブツーインコーポレイテッド ・Filing date 2024-12-27 ・Publication date 2026-09-15 | 2K102, 5F033, 5F037, 5F038 |
| 4. JPA-HYO2026-530823 | 電源モジュール、車載充電装置、一体型コントローラ、および車両 | ・Applicant ビーワイディーカンパニーリミテッド ・Filing date 2024-08-13 ・Publication date 2026-09-10 | 5F037, 5H125, 5H730, 5H740 |
| 5. JPA-HYO2026-530336 | メモリ及び共有の書き込みポートを有する集積回路 | ・Applicant バーサムマテリアルズユーエスリミティドライアビリティカンパニー ・Filing date 2024-08-08 ・Publication date 2026-09-08 | 5B160, 5F037, 5F083 |
| 6. JPA-HYO2026-530231 | パワー半導体モジュールパッケージ用の溶接アセンブリ及びその製造方法 | ・Applicant ザ・ユニバーシティ・オブ・ホンコン ・Filing date 2024-07-23 ・Publication date 2026-09-07 | 5F037 |
| 7. JPA-HYO2026-530076 | 磁気パッケージ内にインダクタを備える集積回路 | ・Applicant テキサスインスツルメンツインコーポレイテッド ・Filing date 2024-08-28 ・Publication date 2026-09-03 | 4M109, 5E070, 5E336, 5F037 |
| 8. JPA2026-140809 | マイクロエレクトロニクスにおける信頼性向上及び歩留向上のための直接接合型スタック構造 | ・Applicant アデイアセミコンダクターボンディングテクノロジーズインコーポレイテッド ・Filing date 2020-06-25 ・Publication date 2026-09-03 | 5F037, 5F144 |
| 9. JPA-HYO2026-529940 | 埋め込み相互接続構造を有する集積デバイス | ・Applicant クアルコムインコーポレイテッド ・Filing date 2024-07-12 ・Publication date 2026-09-03 | 5E316, 5F037 |
| 10. JPA2026-140658 | 半導体装置 | ・Applicant 方略電子股ふん有限公司 ・Filing date 2026-01-08 ・Publication date 2026-09-02 | 2H137, 2H147, 3K244, 5E338, 5F037 |
| 11. JPA2026-139817 | 光半導体パッケージ及び光半導体パッケージの製造方法 | ・Applicant 浜松ホトニクス株式会社 ・Filing date 2021-12-13 ・Publication date 2026-09-01 | 4M118, 5F037, 5F149, 5F889 |
| 12. JPA2026-139737 | センサ、撮像システム、およびセンサを形成する方法 | ・Applicant ケーエルエーコーポレイション ・Filing date 2022-06-14 ・Publication date 2026-09-01 | 2G051, 4M118, 5F037 |
| 13. JPA2026-139597 | 半導体パッケージのストレイン制御装置、前記ストレイン制御装置を含む半導体パッケージおよび前記半導体パッケージを含む半導体モジュール | ・Applicant エルエックスセミコンカンパニーリミティド ・Filing date 2026-02-13 ・Publication date 2026-09-01 | 5F037, 5F136 |
| 14. JPA2026-139805 | 積層体の作製方法、及び、積層体 | ・Applicant 株式会社レゾナック ・Filing date 2021-12-08 ・Publication date 2026-09-01 | 5E314, 5F037, 5F061 |
| 15. JPA-HYO2026-529627 | ウェハスケールメモリ用のシステム、方法、及び装置 | ・Applicant バーサムマテリアルズユーエスリミティドライアビリティカンパニー ・Filing date 2024-08-08 ・Publication date 2026-09-01 | 5F037, 5F083 |
Same industry / competition company information (JP)
{'ja': '技術テーマ「半導体装置の組立体技術」における上位出願人の特許情報を以下に示します。各企業の特許件数を比較することで、過去および現在の各社の技術テーマにおける研究開発状況や、技術テーマにおける各社の位置付けを確認できます。なお、特許は出願から公開までに一年半のタイムラグがあるため、一年半より直近の状況については分析できない点に注意する必要があります。', 'en': "The patent information of the higher applicant in the technical theme 半導体装置の組立体技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme. Patents have a time lag of about 18 months from filing to publication."}
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
Comparing the number of applications of each company, キオクシア株式会社 has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 5 cases, followed by ヒタチ・エナジー・リミテッド with 5 cases.
| Name | Cases |
|---|---|
| キオクシア株式会社 | 5 cases |
| ヒタチ・エナジー・リミテッド | 5 cases |
| 三星電子株式会社 | 3 cases |
| 富士電機株式会社 | 2 cases |
| ローム株式会社 | 2 cases |
| 三菱電機株式会社 | 2 cases |
Trends in filing of joint patent applications for the target period (2020 to 2025).
Comparing the number of applications of each company, キオクシア株式会社 has the highest number of joint applications in the last for the target period (2020 to 2025) with 17 cases, followed by 富士電機株式会社 with 13 cases.
| Name | Cases |
|---|---|
| キオクシア株式会社 | 17 cases |
| 富士電機株式会社 | 13 cases |
| ローム株式会社 | 11 cases |
| 三菱電機株式会社 | 7 cases |
| ヒタチ・エナジー・リミテッド | 6 cases |
| 三星電子株式会社 | 4 cases |
Same industry / competition company JP patent filing ranking
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業の長期推移をどう読むか
同業や競合企業の長期的な特許出願件数の推移から、長期トレンドと出願件数の山や谷を確認することができます。
解説の続きを読む
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 6 companies in the same industry over the past 6 years.
Competitor filing ranking
| Name | Cases |
|---|---|
| キオクシア株式会社 | 17 |
| 富士電機株式会社 | 13 |
| ローム株式会社 | 11 |
| 三菱電機株式会社 | 7 |
| ヒタチ・エナジー・リミテッド | 6 |
| 三星電子株式会社 | 4 |
Top company information (JP)
{'ja': '技術テーマ「半導体装置の組立体技術」における上位出願人の特許情報を以下に示します。各企業の特許件数を比較することで、過去および現在の各社の技術テーマにおける研究開発状況や、技術テーマにおける各社の位置付けを確認できます。なお、特許は出願から公開までに一年半のタイムラグがあるため、一年半より直近の状況については分析できない点に注意する必要があります。', 'en': "The patent information of the higher applicant in the technical theme 半導体装置の組立体技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme. Patents have a time lag of about 18 months from filing to publication."}
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業との比較のポイント
同業や競合企業が特許に注力している分野を知ることで、自社の戦略や製品開発の方向性を把握することができます。
解説の続きを読む
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
among the top coapplicants, キオクシア株式会社 has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 5 cases, followed by ヒタチ・エナジー・リミテッド with 5 cases.
| Name | Cases |
|---|---|
| キオクシア株式会社 | 5 cases |
| ヒタチ・エナジー・リミテッド | 5 cases |
| 三星電子株式会社 | 3 cases |
Trends in filing of joint patent applications for the target period (2020 to 2025).
among the top coapplicants, キオクシア株式会社 has the highest number of joint applications in the last for the target period (2020 to 2025) with 17 cases, followed by ヒタチ・エナジー・リミテッド with 6 cases.
| Name | Cases |
|---|---|
| キオクシア株式会社 | 17 cases |
| ヒタチ・エナジー・リミテッド | 6 cases |
| 三星電子株式会社 | 4 cases |
Top company JP patent filing ranking
Below is a ranking of the number of JP patent applications by 半導体装置の組立体技術’s top 3 coapplicants over the last 6 years.
佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業の長期推移をどう読むか
同業や競合企業の長期的な特許出願件数の推移から、長期トレンドと出願件数の山や谷を確認することができます。
解説の続きを読む
Top co-applicant filing ranking
| Name | Cases |
|---|---|
| キオクシア株式会社 | 17 |
| 富士電機株式会社 | 13 |
| ローム株式会社 | 11 |
Top company, Change in the Number of JP Patents
Below is a patent map showing the changes in the numbers of JP patent filings by 半導体装置の組立体技術’s top 3 coapplicants over the last 6 years.
Top co-applicant filing ranking
| Name | Cases |
|---|---|
| キオクシア株式会社 | 17 |
| 富士電機株式会社 | 13 |
| ローム株式会社 | 11 |
Top company details
Trends in filing of joint patent applications with キオクシア株式会社
半導体装置の組立体技術 filed 17 joint applications with キオクシア株式会社 for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 17 cases in total) is 3.4, and the median is 5.0. The coefficient of variation (standard deviation/mean) is 0.6, and filings have been large fluctuations.
Because some years show zero filings in the collected data, strong trend claims are avoided; see the yearly table. The highest number of filings in 2020 with 5 cases, and their lowest number in 2024 with 0 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 3.4 patents |
| Std Dev | 2.1 |
| COV | 0.6 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 0 cases | - |
| 2024 year | 0 cases | -100% |
| 2023 year | 5 cases | +150% |
Trends in filing of joint patent applications with ヒタチ・エナジー・リミテッド
半導体装置の組立体技術 filed 6 joint applications with ヒタチ・エナジー・リミテッド for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 6 cases in total) is 1.2, and the median is 1.0. The coefficient of variation (standard deviation/mean) is 1.0, and filings have been large fluctuations.
Because some years show zero filings in the collected data, strong trend claims are avoided; see the yearly table. The highest number of filings in 2023 with 3 cases, and their lowest number in 2020 with 0 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 1.2 patents |
| Std Dev | 1.2 |
| COV | 1.0 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 0 cases | -100% |
| 2024 year | 2 cases | -33.3% |
| 2023 year | 3 cases | +200% |
Trends in filing of joint patent applications with 三星電子株式会社
半導体装置の組立体技術 filed 4 joint applications with 三星電子株式会社 for the analysis period (2020 to 2025).
The mean of the number of filings over the last 5 years (2020 to 2024, 4 cases in total) is 0.8, and the median is 0. The coefficient of variation (standard deviation/mean) is 1.5, and filings have been large fluctuations.
Because some years show zero filings in the collected data, strong trend claims are avoided; see the yearly table. The highest number of filings in 2023 with 3 cases, and their lowest number in 2020 with 0 cases (years covered: 2020, 2021, 2022, 2023, 2024).
| Index | Value |
|---|---|
| Average | 0.8 patents |
| Std Dev | 1.2 |
| COV | 1.5 |
| Year | Cases | YOY |
|---|---|---|
| 2025 year | 0 cases | - |
| 2024 year | 0 cases | -100% |
| 2023 year | 3 cases | +200% |
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佐藤総合特許事務所 代表弁理士
佐藤 寿のコメント
競合企業との比較のポイント
同業や競合企業が特許に注力している分野を知ることで、自社の戦略や製品開発の方向性を把握することができます。
解説の続きを読む