結晶、結晶のための後処理技術 (JP Patent Analysis Report)
The Theme Code "結晶、結晶のための後処理技術" had 75 patent application filings in the most recent period (2023-01-01 to 2023-04-30). This is a significantly decreased of -28 filings (-27.2%) over 103 they had in the same period of the previous year (2022-01-01 to 2022-04-30).
The highest number of filings in 2015 with 744 cases, and their lowest number in 2023 with 133 cases.
The mean of the number of filings over the last 5 years (2019 to 2024, 1,910 cases in total) is 318, and the median is 376. The coefficient of variation (standard deviation/mean) is 0.6, and there have been big fluctuations in the number of filings from year to year.
| Index | Value |
|---|---|
| Average | 318 patents |
| Std Dev | 185 |
| COV | 0.6 |
| Year | Cases | YOY |
|---|---|---|
| 2023 year | 133 cases | -62.6 % |
| 2022 year | 356 cases | -9.87 % |
| 2021 year | 395 cases | -17.02 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 結晶、結晶のための後処理技術[4G077] for the period of the last 10 years (2015-01-01 to 2024-12-31). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 結晶、結晶のための後処理技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
- Table of Contents
- Foreign Patent Analysis Report
- Patent Filing Summary for 結晶、結晶のための後処理技術
- Search Set (Search Formula/Analysis Patents)
- Related Patent Analysis Report
- Competitors Information
- Top company Information
- • Information on Important Patents
- Provision of patent information to the media
- About this Site
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
結晶、結晶のための後処理技術, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 結晶、結晶のための後処理技術 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Patent Landscape ({{ld.d.db_name | country_map: 'en'}})
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 結晶、結晶のための後処理技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
In addition, by visually representing the patent data in this manner, you can convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
In Patent Integration, you can check the specifics of a patent filing by clicking anywhere on the patent landscape screen. You can also quickly check the position of each applicant for each technical field by cross-referencing with other keywords and patent classifications. You can use it as a guide when considering hypotheses about each company's IP strategy on the IP Landscape. You can also use it for higher-grade intellectual property activities. It has reasonable pricing and a simple user interface that is easy for beginners to handle.
Characteristic Terms (Importance)
The following is a list of words (characteristic terms) often used in 結晶、結晶のための後処理技術 patent applications. Characteristic terms with a higher importance are used in more patents/patent applications.
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 4,720 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
結晶、結晶のための後処理技術[4G077]
Same industry / competition company information (JP)
The patent information of the higher applicant in the technical theme 結晶、結晶のための後処理技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
Comparing the number of applications of each company, 株式会社SUMCO has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 13 cases, followed by 信越半導体株式会社 with 8 cases.
| Name | Cases |
|---|---|
| 株式会社SUMCO | 13 cases |
| 信越半導体株式会社 | 8 cases |
| 住友金属鉱山株式会社 | 5 cases |
| 住友電気工業株式会社 | 1 cases |
Trends in filing of joint patent applications for the target period (2015 to 2025).
Comparing the number of applications of each company, 株式会社SUMCO has the highest number of joint applications in the last for the target period (2015 to 2025) with 427 cases, followed by 住友金属鉱山株式会社 with 292 cases.
| Name | Cases |
|---|---|
| 株式会社SUMCO | 427 cases |
| 住友金属鉱山株式会社 | 292 cases |
| 住友電気工業株式会社 | 274 cases |
| 信越半導体株式会社 | 259 cases |
| 日本電信電話株式会社 | 33 cases |
| 株式会社東芝 | 19 cases |
| 富士通株式会社 | 9 cases |
| 三菱マテリアル株式会社 | 9 cases |
| 株式会社日立製作所 | 5 cases |
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
Top company information (JP)
The patent information of the higher applicant in the technical theme 結晶、結晶のための後処理技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2023 to 2025).
among the top coapplicants, 株式会社SUMCO has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 13 cases, followed by 信越半導体株式会社 with 8 cases.
| Name | Cases |
|---|---|
| 株式会社SUMCO | 13 cases |
| 信越半導体株式会社 | 8 cases |
| 住友電気工業株式会社 | 1 cases |
Trends in filing of joint patent applications for the target period (2015 to 2025).
among the top coapplicants, 株式会社SUMCO has the highest number of joint applications in the last for the target period (2015 to 2025) with 427 cases, followed by 住友電気工業株式会社 with 274 cases.
| Name | Cases |
|---|---|
| 株式会社SUMCO | 427 cases |
| 住友電気工業株式会社 | 274 cases |
| 信越半導体株式会社 | 259 cases |
| 株式会社東芝 | 19 cases |
| 富士通株式会社 | 9 cases |
Top company, Change in the Number of JP Patents
Below is a ranking of the number of JP patent applications by 結晶、結晶のための後処理技術’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 結晶、結晶のための後処理技術’s top 7 coapplicants over the last 20 years.
Top company Details (JP)
Trends in filing of joint patent applications with 住友電気工業株式会社
結晶、結晶のための後処理技術 filed 274 joint applications with 住友電気工業株式会社 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 42 cases in total) is 7.0, and the median is 5.5. The coefficient of variation (standard deviation/mean) is 1.0, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2015 with 77 cases, and their lowest number in 2023 with 1 cases.
| Index | Value |
|---|---|
| Average | 7.0 patents |
| Std Dev | 7.3 |
| COV | 1.0 |
| Year | Cases | YOY |
|---|---|---|
| 2023 year | 1 cases | -75.0 % |
| 2022 year | 4 cases | -42.9 % |
| 2021 year | 7 cases | -12.50 % |
Trends in filing of joint patent applications with 株式会社SUMCO
結晶、結晶のための後処理技術 filed 427 joint applications with 株式会社SUMCO for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 142 cases in total) is 23.7, and the median is 27.5. The coefficient of variation (standard deviation/mean) is 0.6, and there have been big fluctuations in the number of filings from year to year.
The highest number of filings in 2017 with 90 cases, and their lowest number in 2023 with 13 cases.
| Index | Value |
|---|---|
| Average | 23.7 patents |
| Std Dev | 13.7 |
| COV | 0.6 |
| Year | Cases | YOY |
|---|---|---|
| 2023 year | 13 cases | -56.7 % |
| 2022 year | 30 cases | -6.25 % |
| 2021 year | 32 cases | +28.00 % |
Trends in filing of joint patent applications with 信越半導体株式会社
結晶、結晶のための後処理技術 filed 259 joint applications with 信越半導体株式会社 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 128 cases in total) is 21.3, and the median is 28.0. The coefficient of variation (standard deviation/mean) is 0.6, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2021 to 2024). The highest number of filings in 2015 with 40 cases, and their lowest number in 2023 with 7 cases.
| Index | Value |
|---|---|
| Average | 21.3 patents |
| Std Dev | 12.5 |
| COV | 0.6 |
| Year | Cases | YOY |
|---|---|---|
| 2023 year | 7 cases | -78.1 % |
| 2022 year | 32 cases | +6.67 % |
| 2021 year | 30 cases | -6.25 % |
Trends in filing of joint patent applications with 富士通株式会社
結晶、結晶のための後処理技術 filed 9 joint applications with 富士通株式会社 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 5 cases in total) is 0.8, and the median is 0.5. The coefficient of variation (standard deviation/mean) is 1.3, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2016 with 3 cases, and their lowest number in 2023 with 0 cases.
| Index | Value |
|---|---|
| Average | 0.8 patents |
| Std Dev | 1.1 |
| COV | 1.3 |
| Year | Cases | YOY |
|---|---|---|
| 2021 year | 3 cases | +200 % |
| 2020 year | 1 cases | 0 |
| 2019 year | 1 cases | - |
Trends in filing of joint patent applications with 株式会社東芝
結晶、結晶のための後処理技術 filed 19 joint applications with 株式会社東芝 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 6 cases in total) is 1.0, and the median is 1.0. The coefficient of variation (standard deviation/mean) is 1.0, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2016 with 4 cases, and their lowest number in 2023 with 0 cases.
| Index | Value |
|---|---|
| Average | 1.0 patents |
| Std Dev | 1.0 |
| COV | 1.0 |
| Year | Cases | YOY |
|---|---|---|
| 2021 year | 2 cases | 0 |
| 2020 year | 2 cases | 0 |
| 2019 year | 2 cases | -33.3 % |
Information on important patents (JP)
The following shows JP patents held by 結晶、結晶のための後処理技術 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 結晶、結晶のための後処理技術’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 結晶、結晶のための後処理技術 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
Glossary
- Cited
- Indicates that the patent/patent application has been cited (by Examiners) in notices of reasons for rejection in the examination process of other (Japanese, U.S., or European) patent applications. The higher the number of citations, the more important the patent/patent application is considered to be.
- Request for invalidation trial
- Indicates that a third party has requested a procedure to invalidate the patent. It is likely to affect the business of third parties and is considered to be of high importance.
- Opposition
- Indicates that a third party has filed a petition with the Patent Office to hear the validity of the patent again. Like the trial for invalidation, it is considered to be of high importance.
- Information provision
- Indicates that a third party has provided the Patent Office with useful information for examination for the patent filed. It is usually considered to be of high importance because it is done to prevent the patent from being granted.
- Browsing request
- Indicates that a third party has requested the Patent Office to view the patent bag (a set of documents exchanged between the Patent Office and the applicant). The bag is often checked prior to trial for invalidation, opposition, and provision of information, and is considered to be a highly important patent.
Oppositioned cases
List of latest Oppositioned patents
In the last 3 years (2022-01-01 ~ 2024-12-31), there were 3 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7050270 "半導体発光素子及び発光モジュール" (Opposition day 2022-09-29) , next is 特許6905719 "六方晶窒化ホウ素単結晶、該六方晶窒化ホウ素単結晶を配合した複合材組成物および該複合材組成物を成形してなる放熱部材" (Opposition day 2022-01-20) .
| - | No. | Title | Opposition days |
|---|---|---|---|
| 1 | 特許7050270 | 半導体発光素子及び発光モジュール | 2022-09-29 |
| 2 | 特許6905719 | 六方晶窒化ホウ素単結晶、該六方晶窒化ホウ素単結晶を配合した複合材組成物および該複合材組成物を成形してなる放熱部材 | 2022-01-20 |
| 3 | 特許6922054 | 電子ビーム生成用カソード部材およびその製造方法 | 2022-01-20 |
Protested cases
List of latest Protested patents
In the last 3 years (2022-01-01 ~ 2024-12-31), there were 15 patents Protest from third parties. The average number of Protest is 1.5 times. The most recently Protest patent is 特開2024-031873 "炭化ケイ素粉末、及びこれを用いて炭化ケイ素インゴットを製造する方法" (Protest day 2024-12-24) , next is 特開2024-138514 "膜構造体、圧電体膜及び超伝導体膜" (Protest day 2024-12-10) .
| - | No. | Title | Protest days |
|---|---|---|---|
| 1 | 特開2024-031873 | 炭化ケイ素粉末、及びこれを用いて炭化ケイ素インゴットを製造する方法 | 2024-12-24 |
| 2 | 特開2024-138514 | 膜構造体、圧電体膜及び超伝導体膜 | 2024-12-10 |
| 3 | 特開2023-106715 | 単結晶シリコンの製造方法及び評価方法 | 2024-12-09 |
| 4 | 特開2022-063653 | 酸化ガリウム結晶の製造装置 | 2024-10-18 |
| 5 | 特表2023-533326 | 高品質の炭化ケイ素種結晶、炭化ケイ素結晶、炭化ケイ素基板およびそれらの製造方法 | 2024-06-12 |
| 6 | 特開2021-172552 | 結晶膜 | 2024-06-07 |
| 7 | 特開2023-094576 | 炭化ケイ素粉末、及びこれを用いて炭化ケイ素インゴットを製造する方法 | 2024-05-13 |
| 8 | 特開2023-070126 | 炭化ケイ素ウエハ及びこの製造方法 | 2024-02-28 |
| 9 | 特許7480738 | シリコンウェーハの洗浄方法及び自然酸化膜付きシリコンウェーハの製造方法 | 2024-01-29 |
| 10 | 特開2023-093304 | ＨＶＰＥ法によるＧａ２Ｏ３結晶膜の蒸着方法、蒸着装置、および、これを用いて得られたＧａ２Ｏ３結晶膜蒸着基板 | 2023-12-20 |
| 11 | 特開2022-147881 | Ｇａ２Ｏ３系単結晶基板並びにＧａ２Ｏ３系単結晶基板の製造方法 | 2023-12-20 |
| 12 | 特許7483240 | 単結晶成長装置およびＩＩＩ－Ｖ族半導体単結晶の製造方法 | 2023-10-24 |
| 13 | 特開2022-003004 | ポリシリコンロッド及びポリシリコンロッド製造方法 | 2023-07-25 |
| 14 | 特許7190841 | ＳｉＣインゴットの製造方法及びＳｉＣウェハの製造方法 | 2022-06-10 |
| 15 | 特許7281937 | 低炭素高純度多結晶シリコン塊とその製造方法 | 2022-03-08 |
Top Patents/Patent Applications with the Highest Number of Protested
Of the patent applications filed in the last 10 years (2015-01-01 to 2024-12-31), 49 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.4. The most protest patent is 特許6472732 "樹脂材料、ビニール製袋、多結晶シリコン棒、多結晶シリコン塊" (3 times) , and the next most protest patent is 特許7050270 "半導体発光素子及び発光モジュール" (3 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6472732 | 樹脂材料、ビニール製袋、多結晶シリコン棒、多結晶シリコン塊 | 3 times |
| 2 | 特許7050270 | 半導体発光素子及び発光モジュール | 3 times |
| 3 | 特開2024-138514 | 膜構造体、圧電体膜及び超伝導体膜 | 3 times |
| 4 | 再公表2016/009660 | ＧａＡｓ結晶 | 3 times |
| 5 | 特許6848173 | 含繊維結晶、含繊維結晶の製造方法、含繊維結晶の製造装置および薬剤ソーキング装置 | 3 times |
Inspectioned cases
List of latest Inspectioned patents
In the last 3 years (2022-01-01 ~ 2024-12-31), there were 28 patents Inspection from third parties. The average number of Inspection is 1.5 times. The most recently Inspection patent is 特開2023-106715 "単結晶シリコンの製造方法及び評価方法" (Inspection day 2024-12-26) , next is 特開2022-063653 "酸化ガリウム結晶の製造装置" (Inspection day 2024-11-05) .
| - | No. | Title | Inspection days |
|---|---|---|---|
| 1 | 特開2023-106715 | 単結晶シリコンの製造方法及び評価方法 | 2024-12-26 |
| 2 | 特開2022-063653 | 酸化ガリウム結晶の製造装置 | 2024-11-05 |
| 3 | 特開2021-172552 | 結晶膜 | 2024-08-09 |
| 4 | 特表2023-533326 | 高品質の炭化ケイ素種結晶、炭化ケイ素結晶、炭化ケイ素基板およびそれらの製造方法 | 2024-07-17 |
| 5 | 特開2023-070126 | 炭化ケイ素ウエハ及びこの製造方法 | 2024-04-09 |
| 6 | 特許7480738 | シリコンウェーハの洗浄方法及び自然酸化膜付きシリコンウェーハの製造方法 | 2024-02-26 |
| 7 | 特開2023-017165 | リチャージ用多結晶シリコン塊 | 2024-02-20 |
| 8 | 特開2022-147881 | Ｇａ２Ｏ３系単結晶基板並びにＧａ２Ｏ３系単結晶基板の製造方法 | 2024-01-25 |
| 9 | 特許4729766 | 超電導酸化物材料の製造方法 | 2024-01-17 |
| 10 | 特許6054235 | ＳｉＣ種結晶及びＳｉＣ単結晶の製造方法 | 2023-11-09 |
| 11 | 特許7427848 | 多結晶ＳｉＣ成形体及びその製造方法 | 2023-10-18 |
| 12 | 特許6728395 | ダイヤモンド工具ピース | 2023-08-21 |
| 13 | 特開2017-108179 | 炭化珪素単結晶基板、炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法 | 2023-08-09 |
| 14 | 特許5874932 | ダイヤモンド材料の処理方法及び得られた製品 | 2023-08-04 |
| 15 | 特許6007429 | ダイヤモンド工具 | 2023-08-04 |
| 16 | 特許7312833 | 結晶材料を切り分けるためのレーザ・アシスト法 | 2023-07-06 |
| 17 | 特許7315677 | 結晶材料を切り分けるためのレーザ・アシスト法 | 2023-07-06 |
| 18 | 特許7422479 | ＳｉＣインゴット及びＳｉＣインゴットの製造方法 | 2023-02-24 |
| 19 | 特許7190841 | ＳｉＣインゴットの製造方法及びＳｉＣウェハの製造方法 | 2023-01-13 |
| 20 | 特許6762484 | ＳｉＣエピタキシャルウェハ及びその製造方法 | 2023-01-13 |
Top Patents/Patent Applications with the Highest Number of Inspectioned
Of the patent applications filed in the last 10 years (2015-01-01 to 2024-12-31), 98 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.4. The most inspection patent is 特許6472732 "樹脂材料、ビニール製袋、多結晶シリコン棒、多結晶シリコン塊" (6 times) , and the next most inspection patent is 再公表2016/009660 "ＧａＡｓ結晶" (6 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6472732 | 樹脂材料、ビニール製袋、多結晶シリコン棒、多結晶シリコン塊 | 6 times |
| 2 | 再公表2016/009660 | ＧａＡｓ結晶 | 6 times |
| 3 | 特許7190841 | ＳｉＣインゴットの製造方法及びＳｉＣウェハの製造方法 | 5 times |
| 4 | 特許6845798 | ワイドバンドギャップ結晶を昇華再結晶するための炉 | 5 times |
| 5 | 特開2018-065710 | 多結晶シリコン塊、多結晶シリコン棒、および単結晶シリコンの製造方法 | 4 times |
Cited cases
Top Patents/Patent Applications with the Highest Number of Cited
Of the patent applications filed in the last 10 years (2015-01-01 to 2024-12-31), 1,192 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.7. The most cited patent is 特許6690282 "炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法" (29 times) , and the next most cited patent is 特許6627131 "結晶性積層構造体および半導体装置" (27 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6690282 | 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法 | 29 times |
| 2 | 特許6627131 | 結晶性積層構造体および半導体装置 | 27 times |
| 3 | 特許6793942 | 酸化ガリウムの製造方法及び結晶成長装置 | 26 times |
| 4 | 特許6514915 | 単結晶基板の製造方法およびレーザ素子の製造方法 | 26 times |
| 5 | 特許6629509 | 酸化物半導体膜 | 25 times |
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