The Technical Field "研磨" had 260 patent application filings in the most recent period (2023-01-01 to 2023-03-31). This is a significantly decreased of -117 filings (-31.0%) over 377 they had in the same period of the previous year (2022-01-01 to 2022-03-31). This report also includes technical terms related to " サンジング ", " サンディング ", " ポリッシング ", " 研ま ", " 研摩 ", " 研摩処理 ", " 研摩加工 ", " 研磨処理 ", " 研磨加工 " in the search set.
The highest number of filings in 2014 with 2,189 cases, and their lowest number in 2022 with 1,226 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 8,360 cases in total) is 1,393, and the median is 1,506. The coefficient of variation (standard deviation/mean) is 0.3, and there have been big fluctuations in the number of filings from year to year.
Index | Value |
---|---|
Average | 1,393 patents |
Std Dev | 457 |
COV | 0.3 |
Year | Cases | YOY |
---|---|---|
2022 year | 1,226 cases | -10.58 % |
2021 year | 1,371 cases | -16.45 % |
2020 year | 1,641 cases | -7.34 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 研磨 for the period of the last 10 years (2014-01-01 to 2024-11-30). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 研磨, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
The changes in the number of patent filings of 研磨 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
This patent analysis report was created for a patent search set of 16,549 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as 研磨 are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Comparing the number of applications of each company, 株式会社荏原製作所 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 103 cases, followed by キヤノン株式会社 with 12 cases.
Name | Cases |
---|---|
株式会社荏原製作所 | 103 cases |
キヤノン株式会社 | 12 cases |
セイコーエプソン株式会社 | 11 cases |
株式会社レゾナック | 11 cases |
HOYA株式会社 | 9 cases |
株式会社東芝 | 6 cases |
パナソニックホールディングス株式会社 | 2 cases |
富士通株式会社 | 2 cases |
Comparing the number of applications of each company, 株式会社荏原製作所 has the highest number of joint applications in the last for the target period (2014 to 2024) with 716 cases, followed by 株式会社レゾナック with 236 cases.
Name | Cases |
---|---|
株式会社荏原製作所 | 716 cases |
株式会社レゾナック | 236 cases |
HOYA株式会社 | 139 cases |
キヤノン株式会社 | 119 cases |
セイコーエプソン株式会社 | 78 cases |
株式会社東芝 | 64 cases |
富士通株式会社 | 20 cases |
ソニーグループ株式会社 | 16 cases |
パナソニックホールディングス株式会社 | 13 cases |
株式会社日立製作所 | 12 cases |
日本電気株式会社 | 4 cases |
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as 研磨 are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Among the top coapplicants, 株式会社荏原製作所 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 103 cases, followed by キヤノン株式会社 with 12 cases.
Name | Cases |
---|---|
株式会社荏原製作所 | 103 cases |
キヤノン株式会社 | 12 cases |
株式会社東芝 | 6 cases |
パナソニックホールディングス株式会社 | 2 cases |
富士通株式会社 | 2 cases |
Among the top coapplicants, 株式会社荏原製作所 has the highest number of joint applications in the last for the target period (2014 to 2024) with 716 cases, followed by キヤノン株式会社 with 119 cases.
Name | Cases |
---|---|
株式会社荏原製作所 | 716 cases |
キヤノン株式会社 | 119 cases |
株式会社東芝 | 64 cases |
富士通株式会社 | 20 cases |
ソニーグループ株式会社 | 16 cases |
パナソニックホールディングス株式会社 | 13 cases |
株式会社日立製作所 | 12 cases |
Below is a ranking of the number of JP patent applications by 研磨’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 研磨’s top 7 coapplicants over the last 20 years.
研磨 filed 64 joint applications with 株式会社東芝 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 22 cases in total) is 3.7, and the median is 5.0. The coefficient of variation (standard deviation/mean) is 0.6, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2014 with 22 cases, and their lowest number in 2020 with 0 cases.
Index | Value |
---|---|
Average | 3.7 patents |
Std Dev | 2.3 |
COV | 0.6 |
Year | Cases | YOY |
---|---|---|
2022 year | 1 cases | -80.0 % |
2021 year | 5 cases | - |
2020 year | 0 cases | -100 % |
研磨 filed 13 joint applications with パナソニックホールディングス株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 6 cases in total) is 1.0, and the median is 0.5. The coefficient of variation (standard deviation/mean) is 1.2, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2016 with 3 cases, and their lowest number in 2020 with 0 cases.
Index | Value |
---|---|
Average | 1.0 patents |
Std Dev | 1.2 |
COV | 1.2 |
Year | Cases | YOY |
---|---|---|
2022 year | 2 cases | +100 % |
2021 year | 1 cases | - |
2020 year | 0 cases | -100 % |
研磨 filed 16 joint applications with ソニーグループ株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 5 cases in total) is 0.8, and the median is 0. The coefficient of variation (standard deviation/mean) is 1.5, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2016 with 6 cases, and their lowest number in 2022 with 0 cases.
Index | Value |
---|---|
Average | 0.8 patents |
Std Dev | 1.2 |
COV | 1.5 |
Year | Cases | YOY |
---|---|---|
2019 year | 3 cases | +50.0 % |
2018 year | 2 cases | +100 % |
2017 year | 1 cases | -83.3 % |
研磨 filed 716 joint applications with 株式会社荏原製作所 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 384 cases in total) is 64.0, and the median is 73.0. The coefficient of variation (standard deviation/mean) is 0.27, and there have been small fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2017 with 100 cases, and their lowest number in 2015 with 52 cases.
Index | Value |
---|---|
Average | 64.0 patents |
Std Dev | 17.5 |
COV | 0.27 |
Year | Cases | YOY |
---|---|---|
2022 year | 74 cases | +25.42 % |
2021 year | 59 cases | -18.06 % |
2020 year | 72 cases | -5.26 % |
研磨 filed 119 joint applications with キヤノン株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 56 cases in total) is 9.3, and the median is 10.5. The coefficient of variation (standard deviation/mean) is 0.5, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2015 with 20 cases, and their lowest number in 2019 with 4 cases.
Index | Value |
---|---|
Average | 9.3 patents |
Std Dev | 4.9 |
COV | 0.5 |
Year | Cases | YOY |
---|---|---|
2022 year | 10 cases | -37.5 % |
2021 year | 16 cases | +23.08 % |
2020 year | 13 cases | +225 % |
The following shows JP patents held by 研磨 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 研磨’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 研磨 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 1 patents Invalidation Trial from third parties. The average number of Invalidation Trial is 2.0 times. The most recently Invalidation Trial patent is 特許6015941 "食用畜肉塊の除毛装置" (Invalidation Trial day 2022-05-31) .
- | No. | Title | Invalidation Trial days |
---|---|---|---|
1 | 特許6015941 | 食用畜肉塊の除毛装置 | 2022-05-31 |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 60 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7438110 "可撓性ハードコート" (Opposition day 2024-08-26) , next is 特許7432040 "窒化ケイ素焼結体" (Opposition day 2024-07-23) .
- | No. | Title | Opposition days |
---|---|---|---|
1 | 特許7438110 | 可撓性ハードコート | 2024-08-26 |
2 | 特許7432040 | 窒化ケイ素焼結体 | 2024-07-23 |
3 | 特許7368998 | 研磨用組成物および磁気ディスク基板製造方法 | 2024-04-18 |
4 | 特許7371665 | ヒートシール紙 | 2024-04-02 |
5 | 特許7355468 | 軟包装材用紙、および軟包装体 | 2024-04-02 |
6 | 特許7355469 | 軟包装材用紙、および軟包装体 | 2024-04-02 |
7 | 特許7348860 | 研磨パッド及び研磨パッドの製造方法 | 2024-03-19 |
8 | 特許7319157 | 研磨用組成物 | 2024-01-25 |
9 | 特許7301055 | 薬液、基板の処理方法 | 2023-12-27 |
10 | 特許7304186 | 保持パッド及びその製造方法 | 2023-12-27 |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 94 patents Protest from third parties. The average number of Protest is 1.4 times. The most recently Protest patent is 特開2023-014749 "シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法" (Protest day 2024-10-24) , next is 特開2022-057581 "研磨用組成物、基板の研磨方法および基板の製造方法" (Protest day 2024-10-21) .
- | No. | Title | Protest days |
---|---|---|---|
1 | 特開2023-014749 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-24 |
2 | 特開2022-057581 | 研磨用組成物、基板の研磨方法および基板の製造方法 | 2024-10-21 |
3 | 特開2021-116225 | シリカ粒子の製造方法、シリカゾルの製造方法、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-16 |
4 | 特開2022-130226 | 積層ポリエステルフィルムの機能層除去方法 | 2024-10-11 |
5 | 特開2023-007711 | シリカゾルの製造方法、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-09-27 |
6 | 特開2023-147178 | 研磨用組成物、研磨方法、および半導体基板の製造方法 | 2024-09-27 |
7 | 特開2021-127482 | グラスライニング製品及びその製造方法 | 2024-09-10 |
8 | 特開2024-019543 | 水硬性組成物、水硬性組成物混合材料および硬化体 | 2024-09-03 |
9 | 特開2021-132209 | 研磨用パッド、および導電性半導体基板の製造方法 | 2024-08-23 |
10 | 特表2023-506487 | 低酸化物トレンチディッシングシャロートレンチアイソレーション化学的機械平坦化研磨 | 2024-08-08 |
11 | 特開2023-004282 | シリカゾルの製造方法及び研磨方法 | 2024-07-11 |
12 | 特開2023-004281 | シリカ粒子の製造方法、シリカゾルの製造方法及び研磨方法 | 2024-07-11 |
13 | 特開2022-104290 | 口腔用組成物 | 2024-06-28 |
14 | 特開2022-100948 | 角栓除去補助剤 | 2024-06-27 |
15 | 特許7515583 | 通気性プラグ、基板支持アセンブリおよびシャワープレート | 2024-06-18 |
16 | 特開2022-118024 | 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット | 2024-06-17 |
17 | 特表2023-533326 | 高品質の炭化ケイ素種結晶、炭化ケイ素結晶、炭化ケイ素基板およびそれらの製造方法 | 2024-06-12 |
18 | 特表2024-503457 | 電気化学素子用電極リード及びこれを備えた電気化学素子 | 2024-06-10 |
19 | 特表2023-502070 | 研磨材製品及びその形成方法 | 2024-05-28 |
20 | 特表2023-539508 | 酸化セリウム粒子、これを含む化学的機械的研磨用スラリー組成物および半導体素子の製造方法 | 2024-05-22 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 219 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.4. The most protest patent is 特開2022-130226 "積層ポリエステルフィルムの機能層除去方法" (5 times) , and the next most protest patent is 特許6654380 "建材の製造方法" (5 times) .
- | No. | Title | |
---|---|---|---|
1 | 特開2022-130226 | 積層ポリエステルフィルムの機能層除去方法 | 5 times |
2 | 特許6654380 | 建材の製造方法 | 5 times |
3 | 特許6985786 | 歯磨組成物及び歯磨組成物における容器へのイソプロピルメチルフェノールの吸着抑制方法 | 5 times |
4 | 特許7195040 | 光学ガラス、プリフォーム及び光学素子 | 4 times |
5 | 特許7479254 | 歯磨組成物及び歯磨組成物における容器へのイソプロピルメチルフェノールの吸着抑制方法 | 4 times |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 137 patents Inspection from third parties. The average number of Inspection is 1.5 times. The most recently Inspection patent is 特許7271993 "セリウム化合物除去用洗浄液、洗浄方法及び半導体ウェハの製造方法" (Inspection day 2024-10-29) , next is 特開2023-014749 "シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法" (Inspection day 2024-10-29) .
- | No. | Title | Inspection days |
---|---|---|---|
1 | 特許7271993 | セリウム化合物除去用洗浄液、洗浄方法及び半導体ウェハの製造方法 | 2024-10-29 |
2 | 特開2023-014749 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-29 |
3 | 特許7211147 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-28 |
4 | 特許7331436 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-28 |
5 | 特許7331437 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-28 |
6 | 特許7552669 | シリカゾル、研磨組成物、シリコンウェーハの研磨方法、シリコンウェーハの製造方法、化学的機械的研磨組成物及び半導体デバイスの製造方法 | 2024-10-28 |
7 | 特許7331435 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-28 |
8 | 特開2022-130226 | 積層ポリエステルフィルムの機能層除去方法 | 2024-10-24 |
9 | 特開2022-057581 | 研磨用組成物、基板の研磨方法および基板の製造方法 | 2024-10-24 |
10 | 特開2023-007711 | シリカゾルの製造方法、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-24 |
11 | 特開2021-116225 | シリカ粒子の製造方法、シリカゾルの製造方法、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 | 2024-10-24 |
12 | 特開2023-147178 | 研磨用組成物、研磨方法、および半導体基板の製造方法 | 2024-10-23 |
13 | 特開2021-127482 | グラスライニング製品及びその製造方法 | 2024-10-18 |
14 | 特許7572464 | 結合研磨物品及びそれを作製する方法 | 2024-10-03 |
15 | 特開2021-132209 | 研磨用パッド、および導電性半導体基板の製造方法 | 2024-09-19 |
16 | 特表2023-524616 | 結合耐久性が改善された金属製品及び関連方法 | 2024-09-11 |
17 | 特開2024-019543 | 水硬性組成物、水硬性組成物混合材料および硬化体 | 2024-09-09 |
18 | 特表2023-506487 | 低酸化物トレンチディッシングシャロートレンチアイソレーション化学的機械平坦化研磨 | 2024-09-06 |
19 | 特許7082235 | 太陽電池及びその製造方法、太陽電池モジュール | 2024-09-03 |
20 | 特許7441241 | 点灯式ステータスインジケータを備えるエアロゾル発生装置 | 2024-08-22 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 345 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.4. The most inspection patent is 特許6654380 "建材の製造方法" (13 times) , and the next most inspection patent is 特開2022-130226 "積層ポリエステルフィルムの機能層除去方法" (8 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許6654380 | 建材の製造方法 | 13 times |
2 | 特開2022-130226 | 積層ポリエステルフィルムの機能層除去方法 | 8 times |
3 | 特許7479254 | 歯磨組成物及び歯磨組成物における容器へのイソプロピルメチルフェノールの吸着抑制方法 | 8 times |
4 | 特開2017-036209 | 高純度シリカゾルおよびその製造方法 | 6 times |
5 | 特許6438564 | 侵食性防汚コーティング組成物 | 5 times |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 3,386 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.6. The most cited patent is 特許6318108 "磁気テープ" (64 times) , and the next most cited patent is 特許6549528 "磁気テープおよび磁気テープ装置" (59 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許6318108 | 磁気テープ | 64 times |
2 | 特許6549528 | 磁気テープおよび磁気テープ装置 | 59 times |
3 | 特許7171139 | 被加工物の加工方法 | 50 times |
4 | 特許6479997 | 回転可能かつ並進可能な入力機構のための圧縮可能な封止 | 42 times |
5 | 特許6762231 | MTJメモリデバイスの製造方法 | 29 times |
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