The Applicant / Patent Holder "株式会社レゾナック" had 35 patent application filings in the most recent period (2023-01-01 to 2023-03-31). This is a significantly decreased of -49 filings (-58.3%) over 84 they had in the same period of the previous year (2022-01-01 to 2022-03-31).
The highest number of filings in 2016 with 912 cases, and their lowest number in 2022 with 383 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 3,134 cases in total) is 522, and the median is 502. The coefficient of variation (standard deviation/mean) is 0.5, and there have been big fluctuations in the number of filings from year to year.
Index | Value |
---|---|
Average | 522 patents |
Std Dev | 248 |
COV | 0.5 |
Year | Cases | YOY |
---|---|---|
2022 year | 383 cases | -1.29 % |
2021 year | 388 cases | -36.9 % |
2020 year | 615 cases | -20.75 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 株式会社レゾナック for the period of the last 10 years (2014-01-01 to 2024-11-30). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 株式会社レゾナック, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
The changes in the number of patent filings of 株式会社レゾナック over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
This patent analysis report was created for a patent search set of 6,427 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
The number of patents and changes in the number of patents of other companies (competitors) in the same industry as 株式会社レゾナック are shown below.
Comparison of changes in the number of patents with peers and competitors is an important analytical index for understanding the intellectual property strategies of each company. By checking the transition of the number of patents for each company / competitor, you can check the status of focus on technology development and R&D for each company / technology.
It should be noted that patents have a time lag of one and a half years from filing to publication, so it is not possible to analyze the situation more recent than one and a half years.
If you want to find out more information, " Patent Integration , You can compare the number of patent applications with competitors in each technical field in a short time by multiplying with other keywords and patent classifications.Please use it for more detailed patent information analysis such as selection of M&A candidate destinations and alliance destinations.
Below is a patent map showing changes in the number of applications for JP patents of 0 companies in the same industry over the past 20 years.
The changes in the number of patents shared with 株式会社レゾナック’s top coapplicants are shown below.
By searching for the top coapplicants, you can discover what companies 株式会社レゾナック is partnered with to develop technologies and use this information for R&D and intellectual property strategies.
Also, by looking at the change in the number of filings, you can see what companies 株式会社レゾナック conducted joint research with in the past, and check the history of 株式会社レゾナック’s alliances, partnerships, and joint research and development.
If you want to search for more detailed information, you can use Patent Integration to quickly find out specifically what company they filed a joint application with and what invention it was for.
Among the top coapplicants, 国立研究開発法人産業技術総合研究所 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 1 cases.
Name | Cases |
---|---|
国立研究開発法人産業技術総合研究所 | 1 cases |
Among the top coapplicants, 国立研究開発法人産業技術総合研究所 has the highest number of joint applications in the last for the target period (2014 to 2024) with 16 cases, followed by ヒタチケミカルリサーチセンターインコーポレイテッド with 2 cases.
Name | Cases |
---|---|
国立研究開発法人産業技術総合研究所 | 16 cases |
ヒタチケミカルリサーチセンターインコーポレイテッド | 2 cases |
株式会社日立製作所 | 1 cases |
大日本塗料株式会社 | 1 cases |
Below is a ranking of the number of JP patent applications by 株式会社レゾナック’s top 6 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 株式会社レゾナック’s top 6 coapplicants over the last 20 years.
株式会社レゾナック filed 16 joint applications with 国立研究開発法人産業技術総合研究所 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 8 cases in total) is 1.3, and the median is 1.5. The coefficient of variation (standard deviation/mean) is 0.8, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2014 with 5 cases, and their lowest number in 2022 with 0 cases.
Index | Value |
---|---|
Average | 1.3 patents |
Std Dev | 1.1 |
COV | 0.8 |
Year | Cases | YOY |
---|---|---|
2022 year | 0 cases | - |
2021 year | 0 cases | -100 % |
2020 year | 2 cases | 0 |
The following shows JP patents held by 株式会社レゾナック that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 株式会社レゾナック’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 株式会社レゾナック is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 29 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7459485 "電磁波周波数選択透過材及び車両用部品" (Opposition day 2024-08-06) , next is 特許7425971 "インクジェット印刷用インク" (Opposition day 2024-07-23) .
- | No. | Title | Opposition days |
---|---|---|---|
1 | 特許7459485 | 電磁波周波数選択透過材及び車両用部品 | 2024-08-06 |
2 | 特許7425971 | インクジェット印刷用インク | 2024-07-23 |
3 | 特許7388502 | 金属元素含有粉及び成形体 | 2024-05-29 |
4 | 特許7455017 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-05-20 |
5 | 特許7454906 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-05-20 |
6 | 特許7363945 | 不織布製造用ポリアミドイミド樹脂組成物 | 2024-03-29 |
7 | 特許7363798 | 半導体用接着剤、半導体装置の製造方法及び半導体装置 | 2024-03-26 |
8 | 特許7404620 | 液状樹脂組成物並びに電子部品装置及びその製造方法 | 2024-02-16 |
9 | 特許7343977 | 封止用液状エポキシ樹脂組成物及び電子部品装置 | 2024-02-16 |
10 | 特許7306542 | 樹脂組成物、半導体用配線層積層体及び半導体装置 | 2023-12-27 |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 107 patents Protest from third parties. The average number of Protest is 1.5 times. The most recently Protest patent is 特開2023-174742 "不織布形成材料及びその使用" (Protest day 2024-11-20) , next is 特開2023-068308 "情報処理システム、情報処理方法、および情報処理プログラム" (Protest day 2024-11-11) .
- | No. | Title | Protest days |
---|---|---|---|
1 | 特開2023-174742 | 不織布形成材料及びその使用 | 2024-11-20 |
2 | 特開2023-068308 | 情報処理システム、情報処理方法、および情報処理プログラム | 2024-11-11 |
3 | 特開2023-036633 | 封止用樹脂組成物、半導体装置及び半導体装置の製造方法 | 2024-10-18 |
4 | 特開2022-060063 | エポキシ樹脂組成物及び電子部品装置 | 2024-10-09 |
5 | 特開2022-049640 | 半導体用接着剤、並びに、半導体装置及びその製造方法 | 2024-10-09 |
6 | 再公表2019/198242 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-10-04 |
7 | 特許7582200 | 半導体用接着剤、半導体用接着剤シート、及び半導体装置の製造方法 | 2024-09-26 |
8 | 特許7589435 | 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-09-04 |
9 | 特開2022-171710 | 活性エネルギー線硬化性剥離剤組成物、キャリア用剥離剤及びそれを用いた塗膜形成方法、剥離ライナー形成方法 | 2024-07-10 |
10 | 特開2023-012945 | 封止樹脂組成物及び半導体装置 | 2024-07-01 |
11 | 特開2023-012946 | 封止樹脂組成物及び半導体装置 | 2024-07-01 |
12 | 特開2024-025821 | 液状樹脂組成物並びに電子部品装置及びその製造方法 | 2024-06-27 |
13 | 特許7571815 | 封止組成物及び半導体装置 | 2024-06-14 |
14 | 特許7571407 | 封止用樹脂組成物及び電子部品装置 | 2024-06-14 |
15 | 特開2023-023598 | アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-06-14 |
16 | 特許7573358 | 樹脂組成物及び電子部品装置 | 2024-06-06 |
17 | 特開2022-109489 | プリプレグ、半導体パッケージ用の基板材料、及び、半導体パッケージ用の基板材料を製造する方法 | 2024-05-21 |
18 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 2024-05-13 |
19 | 特開2023-115301 | 粘・接着性組成物 | 2024-04-24 |
20 | 特開2022-166670 | 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ | 2024-04-11 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 180 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.4. The most protest patent is 特許7404620 "液状樹脂組成物並びに電子部品装置及びその製造方法" (5 times) , and the next most protest patent is 特開2021-119239 "アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法" (5 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許7404620 | 液状樹脂組成物並びに電子部品装置及びその製造方法 | 5 times |
2 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 5 times |
3 | 特許7067470 | 感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品 | 5 times |
4 | 特許7005121 | 無加圧接合用銅ペースト、接合体、及び半導体装置 | 4 times |
5 | 特開2019-046499 | 硬化膜付きタッチパネル用基材の製造方法、それに用いる感光性樹脂組成物、感光性エレメント及びタッチパネル | 4 times |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 135 patents Inspection from third parties. The average number of Inspection is 2.2 times. The most recently Inspection patent is 特開2022-060063 "エポキシ樹脂組成物及び電子部品装置" (Inspection day 2024-11-20) , next is 特開2023-068308 "情報処理システム、情報処理方法、および情報処理プログラム" (Inspection day 2024-11-20) .
- | No. | Title | Inspection days |
---|---|---|---|
1 | 特開2022-060063 | エポキシ樹脂組成物及び電子部品装置 | 2024-11-20 |
2 | 特開2023-068308 | 情報処理システム、情報処理方法、および情報処理プログラム | 2024-11-20 |
3 | 特開2022-049640 | 半導体用接着剤、並びに、半導体装置及びその製造方法 | 2024-11-20 |
4 | 再公表2019/198242 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-10-17 |
5 | 特許7582200 | 半導体用接着剤、半導体用接着剤シート、及び半導体装置の製造方法 | 2024-10-10 |
6 | 特許7589435 | 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-10-09 |
7 | 特開2022-171710 | 活性エネルギー線硬化性剥離剤組成物、キャリア用剥離剤及びそれを用いた塗膜形成方法、剥離ライナー形成方法 | 2024-07-30 |
8 | 再公表2021/131752 | 1,3−ブタンジオール | 2024-07-29 |
9 | 特許7571815 | 封止組成物及び半導体装置 | 2024-07-18 |
10 | 特開2024-025821 | 液状樹脂組成物並びに電子部品装置及びその製造方法 | 2024-07-18 |
11 | 特開2023-012945 | 封止樹脂組成物及び半導体装置 | 2024-07-18 |
12 | 特許7571407 | 封止用樹脂組成物及び電子部品装置 | 2024-07-18 |
13 | 特開2023-012946 | 封止樹脂組成物及び半導体装置 | 2024-07-18 |
14 | 特開2023-023598 | アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-07-18 |
15 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 2024-06-26 |
16 | 特許7573358 | 樹脂組成物及び電子部品装置 | 2024-06-26 |
17 | 特開2022-109489 | プリプレグ、半導体パッケージ用の基板材料、及び、半導体パッケージ用の基板材料を製造する方法 | 2024-06-05 |
18 | 特開2023-115301 | 粘・接着性組成物 | 2024-05-28 |
19 | 特許7521693 | リチウムイオン二次電池用負極材、リチウムイオン二次電池用負極及びリチウムイオン二次電池 | 2024-05-01 |
20 | 特許7521550 | 封止用液状樹脂組成物及び電子部品装置 | 2024-05-01 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 202 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 2.0. The most inspection patent is 再公表2021/131752 "1,3−ブタンジオール" (16 times) , and the next most inspection patent is 特許7067470 "感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品" (11 times) .
- | No. | Title | |
---|---|---|---|
1 | 再公表2021/131752 | 1,3−ブタンジオール | 16 times |
2 | 特許7067470 | 感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品 | 11 times |
3 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 9 times |
4 | 特許7018168 | 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法 | 9 times |
5 | 特許7005121 | 無加圧接合用銅ペースト、接合体、及び半導体装置 | 8 times |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 1,284 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.5. The most cited patent is 特許6503725 "エポキシ樹脂組成物、樹脂シート、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物及び金属基板" (26 times) , and the next most cited patent is 特許6922157 "樹脂組成物、積層板及び多層プリント配線板" (25 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許6503725 | エポキシ樹脂組成物、樹脂シート、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物及び金属基板 | 26 times |
2 | 特許6922157 | 樹脂組成物、積層板及び多層プリント配線板 | 25 times |
3 | 特許6756107 | 樹脂フィルム、支持体付き樹脂フィルム、プリプレグ、高多層用金属張積層板及び高多層印刷配線板 | 23 times |
4 | 特許6604080 | リチウムイオン二次電池用正極活物質、リチウムイオン二次電池用正極材料及びリチウムイオン二次電池 | 21 times |
5 | 特許6304271 | 封止用エポキシ樹脂成形材料及び電子部品装置 | 19 times |
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