印刷回路に対する電気部品等の電気的接続技術 (JP Patent Analysis Report)
The Theme Code "印刷回路に対する電気部品等の電気的接続技術" had 48 patent application filings in the most recent period (2023-01-01 to 2023-03-31). This is a with an decreasing trend transition of -6 filings (-11.1%) over 54 they had in the same period of the previous year (2022-01-01 to 2022-03-31).
The highest number of filings in 2014 with 614 cases, and their lowest number in 2022 with 168 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 1,513 cases in total) is 252, and the median is 244. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
| Index | Value |
|---|---|
| Average | 252 patents |
| Std Dev | 104 |
| COV | 0.4 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 168 cases | -27.59 % |
| 2021 year | 232 cases | -9.73 % |
| 2020 year | 257 cases | -24.41 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 印刷回路に対する電気部品等の電気的接続技術[5E319] for the period of the last 10 years (2014-01-01 to 2024-11-30). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 印刷回路に対する電気部品等の電気的接続技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
- Table of Contents
- Foreign Patent Analysis Report
- Patent Filing Summary for 印刷回路に対する電気部品等の電気的接続技術
- Search Set (Search Formula/Analysis Patents)
- Related Patent Analysis Report
- Competitors Information
- Top company Information
- • Information on Important Patents
- Provision of patent information to the media
- About this Site
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
印刷回路に対する電気部品等の電気的接続技術, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 印刷回路に対する電気部品等の電気的接続技術 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Patent Landscape ({{ld.d.db_name | country_map: 'en'}})
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 印刷回路に対する電気部品等の電気的接続技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
In addition, by visually representing the patent data in this manner, you can convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
In Patent Integration, you can check the specifics of a patent filing by clicking anywhere on the patent landscape screen. You can also quickly check the position of each applicant for each technical field by cross-referencing with other keywords and patent classifications. You can use it as a guide when considering hypotheses about each company's IP strategy on the IP Landscape. You can also use it for higher-grade intellectual property activities. It has reasonable pricing and a simple user interface that is easy for beginners to handle.
Characteristic Terms (Importance)
The following is a list of words (characteristic terms) often used in 印刷回路に対する電気部品等の電気的接続技術 patent applications. Characteristic terms with a higher importance are used in more patents/patent applications.
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 3,619 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
印刷回路に対する電気部品等の電気的接続技術[5E319]
Same industry / competition company information (JP)
The patent information of the higher applicant in the technical theme 印刷回路に対する電気部品等の電気的接続技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
Comparing the number of applications of each company, イビデン株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 20 cases, followed by 株式会社タムラ製作所 with 16 cases.
| Name | Cases |
|---|---|
| イビデン株式会社 | 20 cases |
| 株式会社タムラ製作所 | 16 cases |
| 千住金属工業株式会社 | 10 cases |
| 三菱電機株式会社 | 9 cases |
| 株式会社東芝 | 3 cases |
| 日本電気株式会社 | 1 cases |
Trends in filing of joint patent applications for the target period (2014 to 2024).
Comparing the number of applications of each company, 株式会社タムラ製作所 has the highest number of joint applications in the last for the target period (2014 to 2024) with 172 cases, followed by イビデン株式会社 with 148 cases.
| Name | Cases |
|---|---|
| 株式会社タムラ製作所 | 172 cases |
| イビデン株式会社 | 148 cases |
| 三菱電機株式会社 | 145 cases |
| 千住金属工業株式会社 | 111 cases |
| 富士通株式会社 | 69 cases |
| 日本電気株式会社 | 50 cases |
| 株式会社東芝 | 21 cases |
| ソニーグループ株式会社 | 9 cases |
| 株式会社日立製作所 | 7 cases |
| パナソニックホールディングス株式会社 | 2 cases |
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
Top company information (JP)
The patent information of the higher applicant in the technical theme 印刷回路に対する電気部品等の電気的接続技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
among the top coapplicants, 株式会社東芝 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 3 cases, followed by 日本電気株式会社 with 1 cases.
Trends in filing of joint patent applications for the target period (2014 to 2024).
among the top coapplicants, 富士通株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 69 cases, followed by 日本電気株式会社 with 50 cases.
| Name | Cases |
|---|---|
| 富士通株式会社 | 69 cases |
| 日本電気株式会社 | 50 cases |
| 株式会社東芝 | 21 cases |
| ソニーグループ株式会社 | 9 cases |
| 株式会社日立製作所 | 7 cases |
| パナソニックホールディングス株式会社 | 2 cases |
Top company, Change in the Number of JP Patents
Below is a ranking of the number of JP patent applications by 印刷回路に対する電気部品等の電気的接続技術’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 印刷回路に対する電気部品等の電気的接続技術’s top 7 coapplicants over the last 20 years.
Top company Details (JP)
Trends in filing of joint patent applications with 富士通株式会社
印刷回路に対する電気部品等の電気的接続技術 filed 69 joint applications with 富士通株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 9 cases in total) is 1.5, and the median is 1.0. The coefficient of variation (standard deviation/mean) is 1.0, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2015 with 20 cases, and their lowest number in 2022 with 0 cases.
| Index | Value |
|---|---|
| Average | 1.5 patents |
| Std Dev | 1.5 |
| COV | 1.0 |
| Year | Cases | YOY |
|---|---|---|
| 2021 year | 1 cases | -66.7 % |
| 2020 year | 3 cases | -25.00 % |
| 2019 year | 4 cases | +300 % |
Trends in filing of joint patent applications with 株式会社日立製作所
印刷回路に対する電気部品等の電気的接続技術 filed 7 joint applications with 株式会社日立製作所 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 10 years (2013 to 2023, 15 cases in total) is 1.4, and the median is 0. The coefficient of variation (standard deviation/mean) is 1.7, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2014 with 3 cases, and their lowest number in 2022 with 0 cases.
| Index | Value |
|---|---|
| Average | 1.4 patents |
| Std Dev | 2.4 |
| COV | 1.7 |
| Year | Cases | YOY |
|---|---|---|
| 2017 year | 1 cases | - |
| 2016 year | 0 cases | -100 % |
| 2015 year | 3 cases | 0 |
Trends in filing of joint patent applications with 株式会社東芝
印刷回路に対する電気部品等の電気的接続技術 filed 21 joint applications with 株式会社東芝 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 11 cases in total) is 1.8, and the median is 1.5. The coefficient of variation (standard deviation/mean) is 1.0, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2017 with 5 cases, and their lowest number in 2021 with 0 cases.
| Index | Value |
|---|---|
| Average | 1.8 patents |
| Std Dev | 1.8 |
| COV | 1.0 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 1 cases | - |
| 2021 year | 0 cases | - |
| 2020 year | 0 cases | -100 % |
Trends in filing of joint patent applications with 日本電気株式会社
印刷回路に対する電気部品等の電気的接続技術 filed 50 joint applications with 日本電気株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 11 cases in total) is 1.8, and the median is 1.5. The coefficient of variation (standard deviation/mean) is 0.7, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2017 with 12 cases, and their lowest number in 2022 with 0 cases.
| Index | Value |
|---|---|
| Average | 1.8 patents |
| Std Dev | 1.3 |
| COV | 0.7 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 0 cases | -100 % |
| 2021 year | 1 cases | -50.0 % |
| 2020 year | 2 cases | -33.3 % |
Trends in filing of joint patent applications with ソニーグループ株式会社
印刷回路に対する電気部品等の電気的接続技術 filed 9 joint applications with ソニーグループ株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 4 cases in total) is 0.7, and the median is 0.5. The coefficient of variation (standard deviation/mean) is 1.1, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2015 with 3 cases, and their lowest number in 2022 with 0 cases.
| Index | Value |
|---|---|
| Average | 0.7 patents |
| Std Dev | 0.7 |
| COV | 1.1 |
| Year | Cases | YOY |
|---|---|---|
| 2020 year | 2 cases | +100 % |
| 2019 year | 1 cases | 0 |
| 2018 year | 1 cases | - |
Information on important patents (JP)
The following shows JP patents held by 印刷回路に対する電気部品等の電気的接続技術 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 印刷回路に対する電気部品等の電気的接続技術’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 印刷回路に対する電気部品等の電気的接続技術 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
Glossary
- Cited
- Indicates that the patent/patent application has been cited (by Examiners) in notices of reasons for rejection in the examination process of other (Japanese, U.S., or European) patent applications. The higher the number of citations, the more important the patent/patent application is considered to be.
- Request for invalidation trial
- Indicates that a third party has requested a procedure to invalidate the patent. It is likely to affect the business of third parties and is considered to be of high importance.
- Opposition
- Indicates that a third party has filed a petition with the Patent Office to hear the validity of the patent again. Like the trial for invalidation, it is considered to be of high importance.
- Information provision
- Indicates that a third party has provided the Patent Office with useful information for examination for the patent filed. It is usually considered to be of high importance because it is done to prevent the patent from being granted.
- Browsing request
- Indicates that a third party has requested the Patent Office to view the patent bag (a set of documents exchanged between the Patent Office and the applicant). The bag is often checked prior to trial for invalidation, opposition, and provision of information, and is considered to be a highly important patent.
Invalidationed Trial cases
List of latest Invalidationed Trial patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 1 patents Invalidation Trial from third parties. The average number of Invalidation Trial is 3.0 times. The most recently Invalidation Trial patent is 特許4192197 "メタルマスク及びその製造方法" (Invalidation Trial day 2022-02-14) .
| - | No. | Title | Invalidation Trial days |
|---|---|---|---|
| 1 | 特許4192197 | メタルマスク及びその製造方法 | 2022-02-14 |
Top Patents/Patent Applications with the Highest Number of Invalidationed Trial
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 2 patents/patent applications were invalidation trial more than once in the examination process of other patent applications. The mean of the number of invalidation trial is 1.0. The most invalidation trial patent is 特許6138324 "半田付け装置、半田付け方法、プリント基板の製造方法、および製品の製造方法" (1 times) , and the next most invalidation trial patent is 特許6302430 "ボール配列用マスクの製造方法" (1 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6138324 | 半田付け装置、半田付け方法、プリント基板の製造方法、および製品の製造方法 | 1 times |
| 2 | 特許6302430 | ボール配列用マスクの製造方法 | 1 times |
Oppositioned cases
List of latest Oppositioned patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 6 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7450318 "はんだ組成物およびフレキシブル回路基板の製造方法" (Opposition day 2024-09-12) , next is 特許7143659 "金属ベース基板" (Opposition day 2023-03-27) .
| - | No. | Title | Opposition days |
|---|---|---|---|
| 1 | 特許7450318 | はんだ組成物およびフレキシブル回路基板の製造方法 | 2024-09-12 |
| 2 | 特許7143659 | 金属ベース基板 | 2023-03-27 |
| 3 | 特許7147313 | 金属ベース基板 | 2023-03-24 |
| 4 | 特許7091519 | 配列用マスク | 2022-12-20 |
| 5 | 特許7089491 | フラックス組成物、ソルダペースト及び電子回路基板 | 2022-12-19 |
| 6 | 特許7037047 | 車両用窓ガラス | 2022-09-16 |
Protested cases
List of latest Protested patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 19 patents Protest from third parties. The average number of Protest is 1.4 times. The most recently Protest patent is 特開2023-071201 "接合材と接合方法および半導体装置の製造方法" (Protest day 2024-10-03) , next is 特開2022-138239 "圧着端子を備えるフレキシブルプリント配線板及びその製造方法" (Protest day 2024-07-31) .
| - | No. | Title | Protest days |
|---|---|---|---|
| 1 | 特開2023-071201 | 接合材と接合方法および半導体装置の製造方法 | 2024-10-03 |
| 2 | 特開2022-138239 | 圧着端子を備えるフレキシブルプリント配線板及びその製造方法 | 2024-07-31 |
| 3 | 特開2024-035412 | はんだ組成物および電子基板 | 2024-07-24 |
| 4 | 特開2024-061816 | スクリーンマスクの製造方法 | 2024-07-19 |
| 5 | 特開2021-053703 | 局所はんだ付けノズル及び局所はんだ付け装置 | 2024-07-04 |
| 6 | 特許7503604 | はんだ組成物および電子基板の製造方法 | 2024-05-30 |
| 7 | 特開2023-060639 | はんだ組成物および電子部品 | 2024-05-24 |
| 8 | 特許7528985 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-03-18 |
| 9 | 特許7450318 | はんだ組成物およびフレキシブル回路基板の製造方法 | 2024-02-13 |
| 10 | 特表2022-549450 | 電子アセンブリのための工学材料 | 2023-11-06 |
| 11 | 特許7554218 | はんだ組成物および電子基板 | 2023-10-25 |
| 12 | 特許7361481 | はんだ組成物および電子基板の製造方法 | 2023-03-13 |
| 13 | 特許7348222 | はんだ組成物 | 2022-10-14 |
| 14 | 特許7454762 | スクリーン印刷装置およびスクリーン印刷方法 | 2022-08-25 |
| 15 | 特開2021-037718 | スクリーンマスク及びスクリーンマスクの製造方法 | 2022-08-11 |
| 16 | 特許7201461 | 微小粒子配列用マスク | 2022-07-12 |
| 17 | 特許7324024 | フラックス及びソルダペースト | 2022-06-20 |
| 18 | 特開2020-136304 | 導電性ボール検査リペア装置 | 2022-01-05 |
| 19 | 特許7066798 | はんだ組成物 | 2021-12-13 |
Top Patents/Patent Applications with the Highest Number of Protested
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 49 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.4. The most protest patent is 特許6913064 "はんだ組成物および電子基板の製造方法" (4 times) , and the next most protest patent is 特許7503604 "はんだ組成物および電子基板の製造方法" (4 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6913064 | はんだ組成物および電子基板の製造方法 | 4 times |
| 2 | 特許7503604 | はんだ組成物および電子基板の製造方法 | 4 times |
| 3 | 特許6560279 | 局所はんだ付け用フラックス組成物およびはんだ付け方法 | 3 times |
| 4 | 特開2016-181723 | 回路キャリアの製造方法および回路キャリア | 3 times |
| 5 | 特許7450318 | はんだ組成物およびフレキシブル回路基板の製造方法 | 2 times |
Inspectioned cases
List of latest Inspectioned patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 17 patents Inspection from third parties. The average number of Inspection is 1.2 times. The most recently Inspection patent is 特開2023-071201 "接合材と接合方法および半導体装置の製造方法" (Inspection day 2024-10-29) , next is 特開2022-138239 "圧着端子を備えるフレキシブルプリント配線板及びその製造方法" (Inspection day 2024-09-02) .
| - | No. | Title | Inspection days |
|---|---|---|---|
| 1 | 特開2023-071201 | 接合材と接合方法および半導体装置の製造方法 | 2024-10-29 |
| 2 | 特開2022-138239 | 圧着端子を備えるフレキシブルプリント配線板及びその製造方法 | 2024-09-02 |
| 3 | 特開2021-053703 | 局所はんだ付けノズル及び局所はんだ付け装置 | 2024-07-11 |
| 4 | 特開2023-060639 | はんだ組成物および電子部品 | 2024-06-28 |
| 5 | 特開2024-150425 | ステンシルプリンタ及び位置合わせ方法 | 2024-05-09 |
| 6 | 特許7528985 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-04-30 |
| 7 | 特許7450318 | はんだ組成物およびフレキシブル回路基板の製造方法 | 2024-03-06 |
| 8 | 特表2022-549450 | 電子アセンブリのための工学材料 | 2023-12-01 |
| 9 | 特許7503604 | はんだ組成物および電子基板の製造方法 | 2023-08-29 |
| 10 | 特許7357186 | 電極接続素子、これを備える発光装置及び発光装置の製造方法 | 2023-08-02 |
| 11 | 特許7324024 | フラックス及びソルダペースト | 2023-03-20 |
| 12 | 特許6418968 | 電子部品実装用パッケージ、電子装置および電子モジュール | 2022-10-06 |
| 13 | 特許7454762 | スクリーン印刷装置およびスクリーン印刷方法 | 2022-09-21 |
| 14 | 特許7038334 | スイッチ | 2022-04-18 |
| 15 | 特許5500278 | フォームはんだ | 2022-04-04 |
| 16 | 特許5369682 | フォームはんだおよび電子部品 | 2022-04-04 |
| 17 | 特開2020-136304 | 導電性ボール検査リペア装置 | 2022-02-02 |
Top Patents/Patent Applications with the Highest Number of Inspectioned
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 58 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.3. The most inspection patent is 特許7450318 "はんだ組成物およびフレキシブル回路基板の製造方法" (3 times) , and the next most inspection patent is 特許7011892 "はんだ接合材料及び接続構造体の製造方法" (3 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許7450318 | はんだ組成物およびフレキシブル回路基板の製造方法 | 3 times |
| 2 | 特許7011892 | はんだ接合材料及び接続構造体の製造方法 | 3 times |
| 3 | 特開2016-181723 | 回路キャリアの製造方法および回路キャリア | 3 times |
| 4 | 特許6913064 | はんだ組成物および電子基板の製造方法 | 2 times |
| 5 | 特許6500138 | ボール配列用マスク | 2 times |
Cited cases
Top Patents/Patent Applications with the Highest Number of Cited
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 794 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.6. The most cited patent is 特許6200534 "鉛フリーはんだ合金、電子回路基板および電子制御装置" (30 times) , and the next most cited patent is 特開2017-192987 "半田組成物及び半田付け製品の製造方法" (30 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6200534 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 | 30 times |
| 2 | 特開2017-192987 | 半田組成物及び半田付け製品の製造方法 | 30 times |
| 3 | 特許6310894 | はんだ組成物および電子基板の製造方法 | 29 times |
| 4 | 特許6679265 | 印刷装置 | 18 times |
| 5 | 特許6518451 | 伸縮性回路基板 | 16 times |
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