多層プリント配線板の製造技術 (JP Patent Analysis Report)
The Theme Code "多層プリント配線板の製造技術" had 101 patent application filings in the most recent period (2023-01-01 to 2023-03-31). This is a significantly increased of +36 filings (55.4%) over 65 they had in the same period of the previous year (2022-01-01 to 2022-03-31).
The highest number of filings in 2014 with 678 cases, and their lowest number in 2022 with 258 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 2,150 cases in total) is 358, and the median is 345. The coefficient of variation (standard deviation/mean) is 0.3, and there have been big fluctuations in the number of filings from year to year.
| Index | Value |
|---|---|
| Average | 358 patents |
| Std Dev | 111 |
| COV | 0.3 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 258 cases | -21.58 % |
| 2021 year | 329 cases | -8.86 % |
| 2020 year | 361 cases | -23.84 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 多層プリント配線板の製造技術[5E316] for the period of the last 10 years (2014-01-01 to 2024-11-30). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 多層プリント配線板の製造技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
- Table of Contents
- Foreign Patent Analysis Report
- Patent Filing Summary for 多層プリント配線板の製造技術
- Search Set (Search Formula/Analysis Patents)
- Related Patent Analysis Report
- Competitors Information
- Top company Information
- • Information on Important Patents
- Provision of patent information to the media
- About this Site
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
多層プリント配線板の製造技術, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 多層プリント配線板の製造技術 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Patent Landscape ({{ld.d.db_name | country_map: 'en'}})
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 多層プリント配線板の製造技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
In addition, by visually representing the patent data in this manner, you can convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
In Patent Integration, you can check the specifics of a patent filing by clicking anywhere on the patent landscape screen. You can also quickly check the position of each applicant for each technical field by cross-referencing with other keywords and patent classifications. You can use it as a guide when considering hypotheses about each company's IP strategy on the IP Landscape. You can also use it for higher-grade intellectual property activities. It has reasonable pricing and a simple user interface that is easy for beginners to handle.
Characteristic Terms (Importance)
The following is a list of words (characteristic terms) often used in 多層プリント配線板の製造技術 patent applications. Characteristic terms with a higher importance are used in more patents/patent applications.
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 4,713 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
多層プリント配線板の製造技術[5E316]
Same industry / competition company information (JP)
The patent information of the higher applicant in the technical theme 多層プリント配線板の製造技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
Comparing the number of applications of each company, イビデン株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 123 cases, followed by 新光電気工業株式会社 with 30 cases.
Trends in filing of joint patent applications for the target period (2014 to 2024).
Comparing the number of applications of each company, イビデン株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 654 cases, followed by 株式会社村田製作所 with 399 cases.
| Name | Cases |
|---|---|
| イビデン株式会社 | 654 cases |
| 株式会社村田製作所 | 399 cases |
| 京セラ株式会社 | 362 cases |
| 株式会社レゾナック | 198 cases |
| 新光電気工業株式会社 | 198 cases |
| 日本特殊陶業株式会社 | 139 cases |
| 富士通株式会社 | 93 cases |
| 日本電気株式会社 | 34 cases |
| 株式会社日立製作所 | 9 cases |
| パナソニックホールディングス株式会社 | 2 cases |
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
Top company information (JP)
The patent information of the higher applicant in the technical theme 多層プリント配線板の製造技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
among the top coapplicants, イビデン株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 123 cases, followed by 株式会社村田製作所 with 22 cases.
Trends in filing of joint patent applications for the target period (2014 to 2024).
among the top coapplicants, イビデン株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 654 cases, followed by 株式会社村田製作所 with 399 cases.
Top company, Change in the Number of JP Patents
Below is a ranking of the number of JP patent applications by 多層プリント配線板の製造技術’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 多層プリント配線板の製造技術’s top 7 coapplicants over the last 20 years.
Top company Details (JP)
Trends in filing of joint patent applications with 京セラ株式会社
多層プリント配線板の製造技術 filed 362 joint applications with 京セラ株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 102 cases in total) is 17.0, and the median is 18.0. The coefficient of variation (standard deviation/mean) is 0.7, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2016 with 74 cases, and their lowest number in 2022 with 4 cases.
| Index | Value |
|---|---|
| Average | 17.0 patents |
| Std Dev | 12.5 |
| COV | 0.7 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 4 cases | -78.9 % |
| 2021 year | 19 cases | +11.76 % |
| 2020 year | 17 cases | -15.00 % |
Trends in filing of joint patent applications with イビデン株式会社
多層プリント配線板の製造技術 filed 654 joint applications with イビデン株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 344 cases in total) is 57.3, and the median is 56.5. The coefficient of variation (standard deviation/mean) is 0.23, and there have been small fluctuations in the number of filings from year to year.
The number of filings has been increasing for the last 3 years (2020 to 2023). The highest number of filings in 2014 with 105 cases, and their lowest number in 2020 with 45 cases.
| Index | Value |
|---|---|
| Average | 57.3 patents |
| Std Dev | 12.9 |
| COV | 0.23 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 81 cases | +35.0 % |
| 2021 year | 60 cases | +33.3 % |
| 2020 year | 45 cases | -28.57 % |
Trends in filing of joint patent applications with 株式会社村田製作所
多層プリント配線板の製造技術 filed 399 joint applications with 株式会社村田製作所 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 166 cases in total) is 27.7, and the median is 28.5. The coefficient of variation (standard deviation/mean) is 0.5, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been increasing for the last 3 years (2020 to 2023). The highest number of filings in 2017 with 68 cases, and their lowest number in 2022 with 10 cases.
| Index | Value |
|---|---|
| Average | 27.7 patents |
| Std Dev | 14.2 |
| COV | 0.5 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 10 cases | -66.7 % |
| 2021 year | 30 cases | +11.11 % |
| 2020 year | 27 cases | -22.86 % |
Trends in filing of joint patent applications with 富士通株式会社
多層プリント配線板の製造技術 filed 93 joint applications with 富士通株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 15 cases in total) is 2.5, and the median is 0.5. The coefficient of variation (standard deviation/mean) is 1.7, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2016 with 24 cases, and their lowest number in 2022 with 0 cases.
| Index | Value |
|---|---|
| Average | 2.5 patents |
| Std Dev | 4.3 |
| COV | 1.7 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 0 cases | - |
| 2021 year | 0 cases | - |
| 2020 year | 0 cases | -100 % |
Trends in filing of joint patent applications with 日本電気株式会社
多層プリント配線板の製造技術 filed 34 joint applications with 日本電気株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 5 cases in total) is 0.8, and the median is 1.0. The coefficient of variation (standard deviation/mean) is 0.8, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2014 with 11 cases, and their lowest number in 2022 with 0 cases.
| Index | Value |
|---|---|
| Average | 0.8 patents |
| Std Dev | 0.7 |
| COV | 0.8 |
| Year | Cases | YOY |
|---|---|---|
| 2021 year | 2 cases | +100 % |
| 2020 year | 1 cases | 0 |
| 2019 year | 1 cases | 0 |
Information on important patents (JP)
The following shows JP patents held by 多層プリント配線板の製造技術 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 多層プリント配線板の製造技術’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 多層プリント配線板の製造技術 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
Glossary
- Cited
- Indicates that the patent/patent application has been cited (by Examiners) in notices of reasons for rejection in the examination process of other (Japanese, U.S., or European) patent applications. The higher the number of citations, the more important the patent/patent application is considered to be.
- Request for invalidation trial
- Indicates that a third party has requested a procedure to invalidate the patent. It is likely to affect the business of third parties and is considered to be of high importance.
- Opposition
- Indicates that a third party has filed a petition with the Patent Office to hear the validity of the patent again. Like the trial for invalidation, it is considered to be of high importance.
- Information provision
- Indicates that a third party has provided the Patent Office with useful information for examination for the patent filed. It is usually considered to be of high importance because it is done to prevent the patent from being granted.
- Browsing request
- Indicates that a third party has requested the Patent Office to view the patent bag (a set of documents exchanged between the Patent Office and the applicant). The bag is often checked prior to trial for invalidation, opposition, and provision of information, and is considered to be a highly important patent.
Oppositioned cases
List of latest Oppositioned patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 8 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7409369 "樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板" (Opposition day 2024-07-08) , next is 特許7375658 "樹脂組成物" (Opposition day 2024-05-08) .
| - | No. | Title | Opposition days |
|---|---|---|---|
| 1 | 特許7409369 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板 | 2024-07-08 |
| 2 | 特許7375658 | 樹脂組成物 | 2024-05-08 |
| 3 | 特許7367891 | 樹脂シート | 2024-04-18 |
| 4 | 特許7332479 | 樹脂材料、積層構造体及び多層プリント配線板 | 2024-02-20 |
| 5 | 特許7342917 | 接着性樹脂シート、プリント配線板および、電子機器。 | 2024-02-19 |
| 6 | 特許7288339 | 配線基板および配線基板の製造方法 | 2023-12-06 |
| 7 | 特許7266454 | 配線基板、積層型配線基板、及び配線基板の製造方法 | 2023-10-27 |
| 8 | 特許7018942 | 硬化性樹脂組成物、接着剤、接着フィルム、回路基板、層間絶縁材料、及び、プリント配線板 | 2022-08-12 |
Protested cases
List of latest Protested patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 13 patents Protest from third parties. The average number of Protest is 1.5 times. The most recently Protest patent is 特開2020-056011 "樹脂フィルム、カバーレイフィルム、回路基板、樹脂付銅箔、金属張積層板、多層回路基板、ポリイミド及び接着剤樹脂組成物" (Protest day 2024-06-28) , next is 特開2022-150087 "ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板" (Protest day 2024-04-16) .
| - | No. | Title | Protest days |
|---|---|---|---|
| 1 | 特開2020-056011 | 樹脂フィルム、カバーレイフィルム、回路基板、樹脂付銅箔、金属張積層板、多層回路基板、ポリイミド及び接着剤樹脂組成物 | 2024-06-28 |
| 2 | 特開2022-150087 | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | 2024-04-16 |
| 3 | 特開2021-147610 | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | 2024-04-16 |
| 4 | 特許7424168 | 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 | 2023-11-10 |
| 5 | 特許7342917 | 接着性樹脂シート、プリント配線板および、電子機器。 | 2023-06-26 |
| 6 | 特許7323314 | 樹脂材料、積層フィルム及び多層プリント配線板 | 2023-03-03 |
| 7 | 特開2020-131552 | キャリアおよび半導体装置の製造方法 | 2022-10-25 |
| 8 | 特許7378908 | 多層回路基板 | 2022-08-09 |
| 9 | 特許7381185 | 回路基板及び多層回路基板 | 2022-07-11 |
| 10 | 特許7112438 | 硬化体、Ｂステージフィルム及び多層プリント配線板 | 2022-01-31 |
| 11 | 特許7112439 | 硬化体、Ｂステージフィルム及び多層プリント配線板 | 2022-01-31 |
| 12 | 特許7112440 | 硬化体、Ｂステージフィルム及び多層プリント配線板 | 2022-01-31 |
| 13 | 特許7259286 | 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板、半導体パッケージ、及び多層プリント配線板の製造方法 | 2021-12-27 |
Top Patents/Patent Applications with the Highest Number of Protested
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 28 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.3. The most protest patent is 特許7381185 "回路基板及び多層回路基板" (4 times) , and the next most protest patent is 特許7378908 "多層回路基板" (3 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許7381185 | 回路基板及び多層回路基板 | 4 times |
| 2 | 特許7378908 | 多層回路基板 | 3 times |
| 3 | 特許7003795 | ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 | 2 times |
| 4 | 特許7323314 | 樹脂材料、積層フィルム及び多層プリント配線板 | 2 times |
| 5 | 特許6878365 | 積層装置および積層方法 | 2 times |
Inspectioned cases
List of latest Inspectioned patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 20 patents Inspection from third parties. The average number of Inspection is 2.0 times. The most recently Inspection patent is 特許7342917 "接着性樹脂シート、プリント配線板および、電子機器。" (Inspection day 2024-10-18) , next is 特開2020-056011 "樹脂フィルム、カバーレイフィルム、回路基板、樹脂付銅箔、金属張積層板、多層回路基板、ポリイミド及び接着剤樹脂組成物" (Inspection day 2024-07-02) .
| - | No. | Title | Inspection days |
|---|---|---|---|
| 1 | 特許7342917 | 接着性樹脂シート、プリント配線板および、電子機器。 | 2024-10-18 |
| 2 | 特開2020-056011 | 樹脂フィルム、カバーレイフィルム、回路基板、樹脂付銅箔、金属張積層板、多層回路基板、ポリイミド及び接着剤樹脂組成物 | 2024-07-02 |
| 3 | 特開2021-147610 | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | 2024-05-08 |
| 4 | 特開2022-150087 | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | 2024-05-07 |
| 5 | 特許7332479 | 樹脂材料、積層構造体及び多層プリント配線板 | 2024-03-25 |
| 6 | 特許7424168 | 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 | 2023-11-16 |
| 7 | 特許7367891 | 樹脂シート | 2023-09-19 |
| 8 | 特許7594058 | 埋め込まれたパワーエレクトロニクスデバイスを有するパワーエレクトロニクスアセンブリ | 2023-08-25 |
| 9 | 特許5021216 | プリント配線板およびその製造方法 | 2023-06-23 |
| 10 | 特許7451880 | 半導体パッケージおよび製造方法 | 2023-05-01 |
| 11 | 特許4299087 | プリント配線板 | 2023-03-28 |
| 12 | 特許7323314 | 樹脂材料、積層フィルム及び多層プリント配線板 | 2023-03-07 |
| 13 | 特許7500792 | パワーエレクトロニクスアセンブリ及びその製造方法 | 2023-02-27 |
| 14 | 特許7378908 | 多層回路基板 | 2022-08-16 |
| 15 | 特許7381185 | 回路基板及び多層回路基板 | 2022-07-25 |
| 16 | 特表2022-523898 | パッケージング基板及びその製造方法 | 2022-03-24 |
| 17 | 特許7112438 | 硬化体、Ｂステージフィルム及び多層プリント配線板 | 2022-02-09 |
| 18 | 特許7112439 | 硬化体、Ｂステージフィルム及び多層プリント配線板 | 2022-02-09 |
| 19 | 特許7112440 | 硬化体、Ｂステージフィルム及び多層プリント配線板 | 2022-02-09 |
| 20 | 特許7259286 | 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板、半導体パッケージ、及び多層プリント配線板の製造方法 | 2022-01-19 |
Top Patents/Patent Applications with the Highest Number of Inspectioned
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 42 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.5. The most inspection patent is 特許7342917 "接着性樹脂シート、プリント配線板および、電子機器。" (5 times) , and the next most inspection patent is 特許7381185 "回路基板及び多層回路基板" (4 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許7342917 | 接着性樹脂シート、プリント配線板および、電子機器。 | 5 times |
| 2 | 特許7381185 | 回路基板及び多層回路基板 | 4 times |
| 3 | 特許7424168 | 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 | 4 times |
| 4 | 特許7378908 | 多層回路基板 | 3 times |
| 5 | 特許7119920 | 樹脂組成物 | 2 times |
Cited cases
Top Patents/Patent Applications with the Highest Number of Cited
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 992 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.8. The most cited patent is 特許6854124 "熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板" (34 times) , and the next most cited patent is 特許6626697 "配線基板およびその製造方法" (29 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6854124 | 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板 | 34 times |
| 2 | 特許6626697 | 配線基板およびその製造方法 | 29 times |
| 3 | 特許6542616 | 部品内蔵配線基板の製造方法、部品内蔵配線基板および電子部品固定用テープ | 28 times |
| 4 | 特許6492801 | 接着フィルム | 25 times |
| 5 | 特許6756107 | 樹脂フィルム、支持体付き樹脂フィルム、プリプレグ、高多層用金属張積層板及び高多層印刷配線板 | 23 times |
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