半導体又は固体装置の封緘,被覆構造と材料技術 (JP Patent Analysis Report)
The Theme Code "半導体又は固体装置の封緘,被覆構造と材料技術" had 80 patent application filings in the most recent period (2023-01-01 to 2023-03-31). This is a small increased of +3 filings (3.9%) over 77 they had in the same period of the previous year (2022-01-01 to 2022-03-31).
The highest number of filings in 2016 with 690 cases, and their lowest number in 2022 with 251 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 2,226 cases in total) is 371, and the median is 358. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
| Index | Value |
|---|---|
| Average | 371 patents |
| Std Dev | 166 |
| COV | 0.4 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 251 cases | -19.03 % |
| 2021 year | 310 cases | -23.46 % |
| 2020 year | 405 cases | -13.28 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 半導体又は固体装置の封緘,被覆構造と材料技術[4M109] for the period of the last 10 years (2014-01-01 to 2024-11-30). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 半導体又は固体装置の封緘,被覆構造と材料技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
- Table of Contents
- Foreign Patent Analysis Report
- Patent Filing Summary for 半導体又は固体装置の封緘,被覆構造と材料技術
- Search Set (Search Formula/Analysis Patents)
- Related Patent Analysis Report
- Competitors Information
- Top company Information
- • Information on Important Patents
- Provision of patent information to the media
- About this Site
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
Introduction
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
半導体又は固体装置の封緘,被覆構造と材料技術, Changes in the Number of JP Patents/Patent Applications
The changes in the number of patent filings of 半導体又は固体装置の封緘,被覆構造と材料技術 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Patent Landscape ({{ld.d.db_name | country_map: 'en'}})
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 半導体又は固体装置の封緘,被覆構造と材料技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
In addition, by visually representing the patent data in this manner, you can convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
In Patent Integration, you can check the specifics of a patent filing by clicking anywhere on the patent landscape screen. You can also quickly check the position of each applicant for each technical field by cross-referencing with other keywords and patent classifications. You can use it as a guide when considering hypotheses about each company's IP strategy on the IP Landscape. You can also use it for higher-grade intellectual property activities. It has reasonable pricing and a simple user interface that is easy for beginners to handle.
Characteristic Terms (Importance)
The following is a list of words (characteristic terms) often used in 半導体又は固体装置の封緘,被覆構造と材料技術 patent applications. Characteristic terms with a higher importance are used in more patents/patent applications.
Search Set (Analysis Patents)
This patent analysis report was created for a patent search set of 4,848 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
半導体又は固体装置の封緘,被覆構造と材料技術[4M109]
Same industry / competition company information (JP)
The patent information of the higher applicant in the technical theme 半導体又は固体装置の封緘,被覆構造と材料技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
Comparing the number of applications of each company, 株式会社レゾナック has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 32 cases, followed by 住友ベークライト株式会社 with 31 cases.
| Name | Cases |
|---|---|
| 株式会社レゾナック | 32 cases |
| 住友ベークライト株式会社 | 31 cases |
| 三菱電機株式会社 | 25 cases |
| 日東電工株式会社 | 15 cases |
| 株式会社東芝 | 9 cases |
| 信越化学工業株式会社 | 8 cases |
Trends in filing of joint patent applications for the target period (2014 to 2024).
Comparing the number of applications of each company, 株式会社レゾナック has the highest number of joint applications in the last for the target period (2014 to 2024) with 473 cases, followed by 三菱電機株式会社 with 306 cases.
| Name | Cases |
|---|---|
| 株式会社レゾナック | 473 cases |
| 三菱電機株式会社 | 306 cases |
| 住友ベークライト株式会社 | 245 cases |
| 信越化学工業株式会社 | 187 cases |
| 日東電工株式会社 | 143 cases |
| 株式会社東芝 | 78 cases |
| 株式会社日立製作所 | 13 cases |
| 日本電気株式会社 | 3 cases |
| パナソニックホールディングス株式会社 | 3 cases |
Same industry / competition company, Change in the Number of JP Patents
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
Top company information (JP)
The patent information of the higher applicant in the technical theme 半導体又は固体装置の封緘,被覆構造と材料技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Trends in filing of joint patent applications in the last 3 years (2022 to 2024).
among the top coapplicants, 株式会社レゾナック has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 32 cases, followed by 住友ベークライト株式会社 with 31 cases.
| Name | Cases |
|---|---|
| 株式会社レゾナック | 32 cases |
| 住友ベークライト株式会社 | 31 cases |
| 三菱電機株式会社 | 25 cases |
| 日東電工株式会社 | 15 cases |
| 株式会社東芝 | 9 cases |
Trends in filing of joint patent applications for the target period (2014 to 2024).
among the top coapplicants, 株式会社レゾナック has the highest number of joint applications in the last for the target period (2014 to 2024) with 473 cases, followed by 三菱電機株式会社 with 306 cases.
Top company, Change in the Number of JP Patents
Below is a ranking of the number of JP patent applications by 半導体又は固体装置の封緘,被覆構造と材料技術’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 半導体又は固体装置の封緘,被覆構造と材料技術’s top 7 coapplicants over the last 20 years.
Top company Details (JP)
Trends in filing of joint patent applications with 住友ベークライト株式会社
半導体又は固体装置の封緘,被覆構造と材料技術 filed 245 joint applications with 住友ベークライト株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 130 cases in total) is 21.7, and the median is 20.5. The coefficient of variation (standard deviation/mean) is 0.3, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2017 with 35 cases, and their lowest number in 2021 with 16 cases.
| Index | Value |
|---|---|
| Average | 21.7 patents |
| Std Dev | 6.6 |
| COV | 0.3 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 18 cases | +12.50 % |
| 2021 year | 16 cases | -48.4 % |
| 2020 year | 31 cases | +6.90 % |
Trends in filing of joint patent applications with 株式会社日立製作所
半導体又は固体装置の封緘,被覆構造と材料技術 filed 13 joint applications with 株式会社日立製作所 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 10 years (2013 to 2023, 15 cases in total) is 1.4, and the median is 0. The coefficient of variation (standard deviation/mean) is 1.3, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2016 with 5 cases, and their lowest number in 2022 with 0 cases.
| Index | Value |
|---|---|
| Average | 1.4 patents |
| Std Dev | 1.8 |
| COV | 1.3 |
| Year | Cases | YOY |
|---|---|---|
| 2018 year | 1 cases | - |
| 2017 year | 0 cases | -100 % |
| 2016 year | 5 cases | +66.7 % |
Trends in filing of joint patent applications with 株式会社レゾナック
半導体又は固体装置の封緘,被覆構造と材料技術 filed 473 joint applications with 株式会社レゾナック for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 246 cases in total) is 41.0, and the median is 31.0. The coefficient of variation (standard deviation/mean) is 0.8, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2018 with 116 cases, and their lowest number in 2022 with 24 cases.
| Index | Value |
|---|---|
| Average | 41.0 patents |
| Std Dev | 34.8 |
| COV | 0.8 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 24 cases | -11.11 % |
| 2021 year | 27 cases | -25.00 % |
| 2020 year | 36 cases | +2.86 % |
Trends in filing of joint patent applications with 三菱電機株式会社
半導体又は固体装置の封緘,被覆構造と材料技術 filed 306 joint applications with 三菱電機株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 164 cases in total) is 27.3, and the median is 31.0. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
The highest number of filings in 2017 with 48 cases, and their lowest number in 2022 with 15 cases.
| Index | Value |
|---|---|
| Average | 27.3 patents |
| Std Dev | 11.5 |
| COV | 0.4 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 15 cases | -50.0 % |
| 2021 year | 30 cases | -9.09 % |
| 2020 year | 33 cases | +3.12 % |
Trends in filing of joint patent applications with 株式会社東芝
半導体又は固体装置の封緘,被覆構造と材料技術 filed 78 joint applications with 株式会社東芝 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 34 cases in total) is 5.7, and the median is 7.0. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2015 with 14 cases, and their lowest number in 2019 with 3 cases.
| Index | Value |
|---|---|
| Average | 5.7 patents |
| Std Dev | 2.3 |
| COV | 0.4 |
| Year | Cases | YOY |
|---|---|---|
| 2022 year | 7 cases | -12.50 % |
| 2021 year | 8 cases | +14.29 % |
| 2020 year | 7 cases | +133 % |
Information on important patents (JP)
The following shows JP patents held by 半導体又は固体装置の封緘,被覆構造と材料技術 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 半導体又は固体装置の封緘,被覆構造と材料技術’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 半導体又は固体装置の封緘,被覆構造と材料技術 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
Glossary
- Cited
- Indicates that the patent/patent application has been cited (by Examiners) in notices of reasons for rejection in the examination process of other (Japanese, U.S., or European) patent applications. The higher the number of citations, the more important the patent/patent application is considered to be.
- Request for invalidation trial
- Indicates that a third party has requested a procedure to invalidate the patent. It is likely to affect the business of third parties and is considered to be of high importance.
- Opposition
- Indicates that a third party has filed a petition with the Patent Office to hear the validity of the patent again. Like the trial for invalidation, it is considered to be of high importance.
- Information provision
- Indicates that a third party has provided the Patent Office with useful information for examination for the patent filed. It is usually considered to be of high importance because it is done to prevent the patent from being granted.
- Browsing request
- Indicates that a third party has requested the Patent Office to view the patent bag (a set of documents exchanged between the Patent Office and the applicant). The bag is often checked prior to trial for invalidation, opposition, and provision of information, and is considered to be a highly important patent.
Oppositioned cases
List of latest Oppositioned patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 22 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7478632 "酸化マグネシウム粉末、フィラー組成物、樹脂組成物、及び放熱部品" (Opposition day 2024-10-09) , next is 特許7457781 "感光性樹脂組成物、それを用いて製造された感光性樹脂膜およびカラーフィルタ" (Opposition day 2024-09-27) .
| - | No. | Title | Opposition days |
|---|---|---|---|
| 1 | 特許7478632 | 酸化マグネシウム粉末、フィラー組成物、樹脂組成物、及び放熱部品 | 2024-10-09 |
| 2 | 特許7457781 | 感光性樹脂組成物、それを用いて製造された感光性樹脂膜およびカラーフィルタ | 2024-09-27 |
| 3 | 特許7452446 | 紫外発光装置 | 2024-09-18 |
| 4 | 特許7432776 | 発光素子封止用樹脂組成物、光源装置及び光源装置の製造方法 | 2024-08-09 |
| 5 | 特許7449713 | 硬化性樹脂組成物、硬化物及び電子部品 | 2024-07-19 |
| 6 | 特許7455017 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-05-20 |
| 7 | 特許7363798 | 半導体用接着剤、半導体装置の製造方法及び半導体装置 | 2024-03-26 |
| 8 | 特許7337462 | エポキシ樹脂組成物 | 2024-02-21 |
| 9 | 特許7404620 | 液状樹脂組成物並びに電子部品装置及びその製造方法 | 2024-02-16 |
| 10 | 特許7343977 | 封止用液状エポキシ樹脂組成物及び電子部品装置 | 2024-02-16 |
Protested cases
List of latest Protested patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 70 patents Protest from third parties. The average number of Protest is 1.5 times. The most recently Protest patent is 特開2023-171548 "中空パッケージおよびその製造方法" (Protest day 2024-10-24) , next is 特開2023-036633 "封止用樹脂組成物、半導体装置及び半導体装置の製造方法" (Protest day 2024-10-18) .
| - | No. | Title | Protest days |
|---|---|---|---|
| 1 | 特開2023-171548 | 中空パッケージおよびその製造方法 | 2024-10-24 |
| 2 | 特開2023-036633 | 封止用樹脂組成物、半導体装置及び半導体装置の製造方法 | 2024-10-18 |
| 3 | 特開2022-049640 | 半導体用接着剤、並びに、半導体装置及びその製造方法 | 2024-10-09 |
| 4 | 再公表2019/198242 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-10-04 |
| 5 | 特許7589435 | 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-09-04 |
| 6 | 特開2023-012945 | 封止樹脂組成物及び半導体装置 | 2024-07-01 |
| 7 | 特開2023-012946 | 封止樹脂組成物及び半導体装置 | 2024-07-01 |
| 8 | 特開2024-025821 | 液状樹脂組成物並びに電子部品装置及びその製造方法 | 2024-06-27 |
| 9 | 特許7601143 | 樹脂組成物 | 2024-06-17 |
| 10 | 特許7571815 | 封止組成物及び半導体装置 | 2024-06-14 |
| 11 | 特許7571407 | 封止用樹脂組成物及び電子部品装置 | 2024-06-14 |
| 12 | 特開2023-023598 | アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-06-14 |
| 13 | 特開2022-070657 | 樹脂組成物 | 2024-06-12 |
| 14 | 特許7573358 | 樹脂組成物及び電子部品装置 | 2024-06-06 |
| 15 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 2024-05-13 |
| 16 | 特開2022-113053 | 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置 | 2024-04-23 |
| 17 | 特許7601568 | 封止用樹脂シート | 2024-03-21 |
| 18 | 特許7513074 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-03-19 |
| 19 | 特許7521550 | 封止用液状樹脂組成物及び電子部品装置 | 2024-03-18 |
| 20 | 特許7528985 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-03-18 |
Top Patents/Patent Applications with the Highest Number of Protested
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 107 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.4. The most protest patent is 特許7404620 "液状樹脂組成物並びに電子部品装置及びその製造方法" (5 times) , and the next most protest patent is 特開2021-119239 "アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法" (5 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許7404620 | 液状樹脂組成物並びに電子部品装置及びその製造方法 | 5 times |
| 2 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 5 times |
| 3 | 特許7302331 | 樹脂組成物 | 4 times |
| 4 | 特許7237828 | エポキシ樹脂組成物、電子部品実装構造体およびその製造方法 | 3 times |
| 5 | 特許6996743 | エポキシ樹脂組成物 | 3 times |
Inspectioned cases
List of latest Inspectioned patents
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 74 patents Inspection from third parties. The average number of Inspection is 1.8 times. The most recently Inspection patent is 特開2022-049640 "半導体用接着剤、並びに、半導体装置及びその製造方法" (Inspection day 2024-11-20) , next is 特開2023-171548 "中空パッケージおよびその製造方法" (Inspection day 2024-10-29) .
| - | No. | Title | Inspection days |
|---|---|---|---|
| 1 | 特開2022-049640 | 半導体用接着剤、並びに、半導体装置及びその製造方法 | 2024-11-20 |
| 2 | 特開2023-171548 | 中空パッケージおよびその製造方法 | 2024-10-29 |
| 3 | 再公表2019/198242 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-10-17 |
| 4 | 特許7589435 | 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-10-09 |
| 5 | 特許7571815 | 封止組成物及び半導体装置 | 2024-07-18 |
| 6 | 特開2024-025821 | 液状樹脂組成物並びに電子部品装置及びその製造方法 | 2024-07-18 |
| 7 | 特開2023-012945 | 封止樹脂組成物及び半導体装置 | 2024-07-18 |
| 8 | 特許7571407 | 封止用樹脂組成物及び電子部品装置 | 2024-07-18 |
| 9 | 特開2023-012946 | 封止樹脂組成物及び半導体装置 | 2024-07-18 |
| 10 | 特開2023-023598 | アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-07-18 |
| 11 | 特許7601143 | 樹脂組成物 | 2024-07-01 |
| 12 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 2024-06-26 |
| 13 | 特許7573358 | 樹脂組成物及び電子部品装置 | 2024-06-26 |
| 14 | 特開2022-070657 | 樹脂組成物 | 2024-06-24 |
| 15 | 特開2022-113053 | 樹脂組成物、樹脂ペースト、硬化物、半導体チップパッケージ及び半導体装置 | 2024-05-10 |
| 16 | 特許7521550 | 封止用液状樹脂組成物及び電子部品装置 | 2024-05-01 |
| 17 | 特許7528985 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-04-30 |
| 18 | 特開2021-127404 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-04-30 |
| 19 | 特許7513074 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-04-08 |
| 20 | 特許7509192 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-03-29 |
Top Patents/Patent Applications with the Highest Number of Inspectioned
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 118 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.7. The most inspection patent is 特開2021-119239 "アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法" (9 times) , and the next most inspection patent is 特許7302331 "樹脂組成物" (6 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 9 times |
| 2 | 特許7302331 | 樹脂組成物 | 6 times |
| 3 | 特許6887687 | 樹脂組成物、接着剤、封止材、ダム剤、半導体装置、およびイメージセンサーモジュール | 5 times |
| 4 | 特許6389145 | 付加硬化型シリコーン樹脂組成物、及び半導体装置 | 4 times |
| 5 | 特許7237828 | エポキシ樹脂組成物、電子部品実装構造体およびその製造方法 | 4 times |
Cited cases
Top Patents/Patent Applications with the Highest Number of Cited
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 1,314 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.8. The most cited patent is 特許6688007 "半導体発光装置及びその製造方法" (39 times) , and the next most cited patent is 特許6586555 "硬化性シリコーン組成物、それからなる半導体用封止剤および半導体装置" (23 times) .
| - | No. | Title | |
|---|---|---|---|
| 1 | 特許6688007 | 半導体発光装置及びその製造方法 | 39 times |
| 2 | 特許6586555 | 硬化性シリコーン組成物、それからなる半導体用封止剤および半導体装置 | 23 times |
| 3 | 特許6477001 | 発光装置及び発光装置の製造方法 | 22 times |
| 4 | 特許6065135 | 発光装置 | 22 times |
| 5 | 特許6327220 | 発光装置 | 22 times |
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