The Theme Code "半導体等の試験・測定技術" had 66 patent application filings in the most recent period (2023-01-01 to 2023-03-31). This is a with an decreasing trend transition of -8 filings (-10.8%) over 74 they had in the same period of the previous year (2022-01-01 to 2022-03-31).
The highest number of filings in 2017 with 469 cases, and their lowest number in 2022 with 286 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 2,122 cases in total) is 354, and the median is 398. The coefficient of variation (standard deviation/mean) is 0.29, and there have been small fluctuations in the number of filings from year to year.
Index | Value |
---|---|
Average | 354 patents |
Std Dev | 103 |
COV | 0.29 |
The number of filings has been decreasing for the last 3 years (2020 to 2023).
Year | Cases | YOY |
---|---|---|
2022 year | 286 cases | -28.32 % |
2021 year | 399 cases | +0.25 % |
2020 year | 398 cases | -8.29 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 半導体等の試験・測定技術[4M106] for the period of the last 10 years (2014-01-01 to 2024-11-30). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 半導体等の試験・測定技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
The changes in the number of patent filings of 半導体等の試験・測定技術 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 半導体等の試験・測定技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
In addition, by visually representing the patent data in this manner, you can convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
In Patent Integration, you can check the specifics of a patent filing by clicking anywhere on the patent landscape screen. You can also quickly check the position of each applicant for each technical field by cross-referencing with other keywords and patent classifications. You can use it as a guide when considering hypotheses about each company's IP strategy on the IP Landscape. You can also use it for higher-grade intellectual property activities. It has reasonable pricing and a simple user interface that is easy for beginners to handle.
The following is a list of words (characteristic terms) often used in 半導体等の試験・測定技術 patent applications. Characteristic terms with a higher importance are used in more patents/patent applications.
This patent analysis report was created for a patent search set of 3,932 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
The patent information of the higher applicant in the technical theme 半導体等の試験・測定技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Comparing the number of applications of each company, 東京エレクトロン株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 45 cases, followed by 三菱電機株式会社 with 15 cases.
Name | Cases |
---|---|
東京エレクトロン株式会社 | 45 cases |
三菱電機株式会社 | 15 cases |
株式会社日立ハイテク | 11 cases |
富士通株式会社 | 2 cases |
株式会社日立製作所 | 1 cases |
株式会社東芝 | 1 cases |
セイコーエプソン株式会社 | 1 cases |
Comparing the number of applications of each company, 東京エレクトロン株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 311 cases, followed by 株式会社日立ハイテク with 171 cases.
Name | Cases |
---|---|
東京エレクトロン株式会社 | 311 cases |
株式会社日立ハイテク | 171 cases |
三菱電機株式会社 | 136 cases |
株式会社東芝 | 26 cases |
セイコーエプソン株式会社 | 14 cases |
富士通株式会社 | 13 cases |
株式会社日立製作所 | 12 cases |
ソニーグループ株式会社 | 7 cases |
日本電気株式会社 | 2 cases |
パナソニックホールディングス株式会社 | 2 cases |
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
The patent information of the higher applicant in the technical theme 半導体等の試験・測定技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
among the top coapplicants, 東京エレクトロン株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 45 cases, followed by 三菱電機株式会社 with 15 cases.
Name | Cases |
---|---|
東京エレクトロン株式会社 | 45 cases |
三菱電機株式会社 | 15 cases |
株式会社日立ハイテク | 11 cases |
富士通株式会社 | 2 cases |
株式会社日立製作所 | 1 cases |
株式会社東芝 | 1 cases |
among the top coapplicants, 東京エレクトロン株式会社 has the highest number of joint applications in the last for the target period (2014 to 2024) with 311 cases, followed by 株式会社日立ハイテク with 171 cases.
Name | Cases |
---|---|
東京エレクトロン株式会社 | 311 cases |
株式会社日立ハイテク | 171 cases |
三菱電機株式会社 | 136 cases |
株式会社東芝 | 26 cases |
富士通株式会社 | 13 cases |
株式会社日立製作所 | 12 cases |
日本電気株式会社 | 2 cases |
Below is a ranking of the number of JP patent applications by 半導体等の試験・測定技術’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 半導体等の試験・測定技術’s top 7 coapplicants over the last 20 years.
半導体等の試験・測定技術 filed 12 joint applications with 株式会社日立製作所 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 8 cases in total) is 1.3, and the median is 1.5. The coefficient of variation (standard deviation/mean) is 0.6, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2016 with 2 cases, and their lowest number in 2022 with 0 cases.
Index | Value |
---|---|
Average | 1.3 patents |
Std Dev | 0.7 |
COV | 0.6 |
Year | Cases | YOY |
---|---|---|
2022 year | 0 cases | -100 % |
2021 year | 1 cases | -50.0 % |
2020 year | 2 cases | 0 |
半導体等の試験・測定技術 filed 13 joint applications with 富士通株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 7 cases in total) is 1.2, and the median is 0.5. The coefficient of variation (standard deviation/mean) is 1.3, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2017 with 4 cases, and their lowest number in 2022 with 0 cases.
Index | Value |
---|---|
Average | 1.2 patents |
Std Dev | 1.5 |
COV | 1.3 |
Year | Cases | YOY |
---|---|---|
2022 year | 0 cases | - |
2021 year | 0 cases | -100 % |
2020 year | 1 cases | - |
半導体等の試験・測定技術 filed 26 joint applications with 株式会社東芝 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 13 cases in total) is 2.2, and the median is 2.0. The coefficient of variation (standard deviation/mean) is 0.7, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2014 with 7 cases, and their lowest number in 2016 with 0 cases.
Index | Value |
---|---|
Average | 2.2 patents |
Std Dev | 1.6 |
COV | 0.7 |
Year | Cases | YOY |
---|---|---|
2022 year | 1 cases | -50.0 % |
2021 year | 2 cases | -60.0 % |
2020 year | 5 cases | +66.7 % |
半導体等の試験・測定技術 filed 136 joint applications with 三菱電機株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 57 cases in total) is 9.5, and the median is 9.5. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
The highest number of filings in 2015 with 25 cases, and their lowest number in 2022 with 6 cases.
Index | Value |
---|---|
Average | 9.5 patents |
Std Dev | 3.4 |
COV | 0.4 |
Year | Cases | YOY |
---|---|---|
2022 year | 6 cases | -40.0 % |
2021 year | 10 cases | 0 |
2020 year | 10 cases | +66.7 % |
半導体等の試験・測定技術 filed 311 joint applications with 東京エレクトロン株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 215 cases in total) is 35.8, and the median is 38.0. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2020 with 57 cases, and their lowest number in 2015 with 12 cases.
Index | Value |
---|---|
Average | 35.8 patents |
Std Dev | 14.2 |
COV | 0.4 |
Year | Cases | YOY |
---|---|---|
2022 year | 33 cases | +22.22 % |
2021 year | 27 cases | -52.6 % |
2020 year | 57 cases | +32.6 % |
The following shows JP patents held by 半導体等の試験・測定技術 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 半導体等の試験・測定技術’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 半導体等の試験・測定技術 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 2 patents Invalidation Trial from third parties. The average number of Invalidation Trial is 2.0 times. The most recently Invalidation Trial patent is 特許4932871 "電気検査の対象物と接触方式により接点を形成するための電気接点素子、並びに当該接触配列" (Invalidation Trial day 2023-12-27) , next is 特許3889689 "電鋳管の製造方法及び電鋳管" (Invalidation Trial day 2022-06-09) .
- | No. | Title | Invalidation Trial days |
---|---|---|---|
1 | 特許4932871 | 電気検査の対象物と接触方式により接点を形成するための電気接点素子、並びに当該接触配列 | 2023-12-27 |
2 | 特許3889689 | 電鋳管の製造方法及び電鋳管 | 2022-06-09 |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 1 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7466964 "基板厚測定装置及び基板厚測定方法" (Opposition day 2024-10-07) .
- | No. | Title | Opposition days |
---|---|---|---|
1 | 特許7466964 | 基板厚測定装置及び基板厚測定方法 | 2024-10-07 |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 1 patents Protest from third parties. The average number of Protest is 1.0 times. The most recently Protest patent is 特表2022-523054 "高アスペクト比構造の測定のための中赤外分光法" (Protest day 2022-09-09) .
- | No. | Title | Protest days |
---|---|---|---|
1 | 特表2022-523054 | 高アスペクト比構造の測定のための中赤外分光法 | 2022-09-09 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 5 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.2. The most protest patent is 特表2018-506030 "テストヘッドのための接触プローブの製造方法" (2 times) , and the next most protest patent is 特許6508373 "インジウムリン基板およびインジウムリン基板の製造方法" (1 times) .
- | No. | Title | |
---|---|---|---|
1 | 特表2018-506030 | テストヘッドのための接触プローブの製造方法 | 2 times |
2 | 特許6508373 | インジウムリン基板およびインジウムリン基板の製造方法 | 1 times |
3 | 特表2022-523054 | 高アスペクト比構造の測定のための中赤外分光法 | 1 times |
4 | 特許6752829 | 高周波適用に適したバーチカルプローブをもつ試験ヘッド | 1 times |
5 | 特表2018-513389 | 様々な動作状態での試験ヘッドでのプローブ保持を適正化し、各々のガイドホールでのスライドを改善するバーチカルプローブをもつ試験ヘッド | 1 times |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 5 patents Inspection from third parties. The average number of Inspection is 1.0 times. The most recently Inspection patent is 特許7228517 "改善された周波数特性を有する試験ヘッド" (Inspection day 2024-08-07) , next is 特許7476039 "半導体装置の検査装置、及び、半導体装置の検査方法" (Inspection day 2024-03-18) .
- | No. | Title | Inspection days |
---|---|---|---|
1 | 特許7228517 | 改善された周波数特性を有する試験ヘッド | 2024-08-07 |
2 | 特許7476039 | 半導体装置の検査装置、及び、半導体装置の検査方法 | 2024-03-18 |
3 | 特許7528011 | マルチビーム走査装置 | 2024-03-18 |
4 | 特許7458935 | 計測装置、及び、計測方法 | 2024-03-18 |
5 | 特表2022-523054 | 高アスペクト比構造の測定のための中赤外分光法 | 2022-10-17 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 21 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.0. The most inspection patent is 特表2018-513389 "様々な動作状態での試験ヘッドでのプローブ保持を適正化し、各々のガイドホールでのスライドを改善するバーチカルプローブをもつ試験ヘッド" (2 times) , and the next most inspection patent is 特許5987967 "プロービング装置及びプローブコンタクト方法" (1 times) .
- | No. | Title | |
---|---|---|---|
1 | 特表2018-513389 | 様々な動作状態での試験ヘッドでのプローブ保持を適正化し、各々のガイドホールでのスライドを改善するバーチカルプローブをもつ試験ヘッド | 2 times |
2 | 特許5987967 | プロービング装置及びプローブコンタクト方法 | 1 times |
3 | 特表2022-523054 | 高アスペクト比構造の測定のための中赤外分光法 | 1 times |
4 | 特許5904428 | プロービング装置及びプローブコンタクト方法 | 1 times |
5 | 特許5967508 | 搬送ユニット及びプローバ | 1 times |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 879 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.6. The most cited patent is 特許6486712 "酸化物半導体膜" (30 times) , and the next most cited patent is 特許6712939 "静電容量測定用の測定器、及び、測定器を用いて処理システムにおける搬送位置データを較正する方法" (21 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許6486712 | 酸化物半導体膜 | 30 times |
2 | 特許6712939 | 静電容量測定用の測定器、及び、測定器を用いて処理システムにおける搬送位置データを較正する方法 | 21 times |
3 | 特許6668278 | 試料観察装置および試料観察方法 | 21 times |
4 | 特許6444207 | 六方晶単結晶基板の検査方法及び検査装置 | 20 times |
5 | 特許6797481 | 半導体インゴットの検査方法、検査装置及びレーザー加工装置 | 20 times |
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