The Theme Code "含窒素連結基の形式による高分子化合物一般技術" had 94 patent application filings in the most recent period (2023-01-01 to 2023-04-30). This is a significantly decreased of -27 filings (-22.3%) over 121 they had in the same period of the previous year (2022-01-01 to 2022-04-30).
The highest number of filings in 2019 with 540 cases, and their lowest number in 2023 with 170 cases.
The mean of the number of filings over the last 5 years (2019 to 2024, 1,815 cases in total) is 302, and the median is 335. The coefficient of variation (standard deviation/mean) is 0.6, and there have been big fluctuations in the number of filings from year to year.
Index | Value |
---|---|
Average | 302 patents |
Std Dev | 169 |
COV | 0.6 |
The number of filings has been decreasing for the last 3 years (2021 to 2024).
Year | Cases | YOY |
---|---|---|
2023 year | 170 cases | -51.3 % |
2022 year | 349 cases | +8.72 % |
2021 year | 321 cases | -23.39 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for 含窒素連結基の形式による高分子化合物一般技術[4J043] for the period of the last 10 years (2015-01-01 to 2024-12-31). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of 含窒素連結基の形式による高分子化合物一般技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
The changes in the number of patent filings of 含窒素連結基の形式による高分子化合物一般技術 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for 含窒素連結基の形式による高分子化合物一般技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
In addition, by visually representing the patent data in this manner, you can convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
In Patent Integration, you can check the specifics of a patent filing by clicking anywhere on the patent landscape screen. You can also quickly check the position of each applicant for each technical field by cross-referencing with other keywords and patent classifications. You can use it as a guide when considering hypotheses about each company's IP strategy on the IP Landscape. You can also use it for higher-grade intellectual property activities. It has reasonable pricing and a simple user interface that is easy for beginners to handle.
The following is a list of words (characteristic terms) often used in 含窒素連結基の形式による高分子化合物一般技術 patent applications. Characteristic terms with a higher importance are used in more patents/patent applications.
This patent analysis report was created for a patent search set of 3,694 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
The patent information of the higher applicant in the technical theme 含窒素連結基の形式による高分子化合物一般技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Comparing the number of applications of each company, JSR株式会社 has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 16 cases, followed by 株式会社カネカ with 9 cases.
Comparing the number of applications of each company, 日産化学株式会社 has the highest number of joint applications in the last for the target period (2015 to 2025) with 311 cases, followed by 株式会社カネカ with 175 cases.
Name | Cases |
---|---|
日産化学株式会社 | 311 cases |
株式会社カネカ | 175 cases |
日鉄ケミカル&マテリアル株式会社 | 156 cases |
東レ株式会社 | 150 cases |
JSR株式会社 | 127 cases |
株式会社レゾナック | 107 cases |
UBE株式会社 | 86 cases |
東洋紡株式会社 | 37 cases |
住友ベークライト株式会社 | 33 cases |
三井化学株式会社 | 30 cases |
日東電工株式会社 | 10 cases |
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
The patent information of the higher applicant in the technical theme 含窒素連結基の形式による高分子化合物一般技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
among the top coapplicants, JSR株式会社 has the highest number of joint applications in the last in the last 3 years (2023 to 2025) with 16 cases, followed by 株式会社カネカ with 9 cases.
among the top coapplicants, 日産化学株式会社 has the highest number of joint applications in the last for the target period (2015 to 2025) with 311 cases, followed by 株式会社カネカ with 175 cases.
Below is a ranking of the number of JP patent applications by 含窒素連結基の形式による高分子化合物一般技術’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by 含窒素連結基の形式による高分子化合物一般技術’s top 7 coapplicants over the last 20 years.
含窒素連結基の形式による高分子化合物一般技術 filed 175 joint applications with 株式会社カネカ for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 125 cases in total) is 20.8, and the median is 22.5. The coefficient of variation (standard deviation/mean) is 0.6, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2021 to 2024). The highest number of filings in 2020 with 36 cases, and their lowest number in 2023 with 9 cases.
Index | Value |
---|---|
Average | 20.8 patents |
Std Dev | 13.2 |
COV | 0.6 |
Year | Cases | YOY |
---|---|---|
2023 year | 9 cases | -66.7 % |
2022 year | 27 cases | +50.0 % |
2021 year | 18 cases | -50.0 % |
含窒素連結基の形式による高分子化合物一般技術 filed 107 joint applications with 株式会社レゾナック for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 31 cases in total) is 5.2, and the median is 5.5. The coefficient of variation (standard deviation/mean) is 0.6, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2021 to 2024). The highest number of filings in 2017 with 21 cases, and their lowest number in 2023 with 4 cases.
Index | Value |
---|---|
Average | 5.2 patents |
Std Dev | 3.0 |
COV | 0.6 |
Year | Cases | YOY |
---|---|---|
2023 year | 4 cases | -33.3 % |
2022 year | 6 cases | +20.00 % |
2021 year | 5 cases | -16.67 % |
含窒素連結基の形式による高分子化合物一般技術 filed 33 joint applications with 住友ベークライト株式会社 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 24 cases in total) is 4.0, and the median is 3.5. The coefficient of variation (standard deviation/mean) is 0.8, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been increasing for the last 3 years (2021 to 2024). The highest number of filings in 2023 with 9 cases, and their lowest number in 2016 with 0 cases.
Index | Value |
---|---|
Average | 4.0 patents |
Std Dev | 3.2 |
COV | 0.8 |
Year | Cases | YOY |
---|---|---|
2023 year | 9 cases | +28.57 % |
2022 year | 7 cases | +133 % |
2021 year | 3 cases | -25.00 % |
含窒素連結基の形式による高分子化合物一般技術 filed 311 joint applications with 日産化学株式会社 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 111 cases in total) is 18.5, and the median is 11.5. The coefficient of variation (standard deviation/mean) is 0.9, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2017 with 73 cases, and their lowest number in 2023 with 7 cases.
Index | Value |
---|---|
Average | 18.5 patents |
Std Dev | 16.0 |
COV | 0.9 |
Year | Cases | YOY |
---|---|---|
2023 year | 7 cases | -30.0 % |
2022 year | 10 cases | -23.08 % |
2021 year | 13 cases | -61.8 % |
含窒素連結基の形式による高分子化合物一般技術 filed 127 joint applications with JSR株式会社 for the analysis period (2015 to 2025).
The mean of the number of filings over the last 5 years (2019 to 2024, 60 cases in total) is 10.0, and the median is 12.5. The coefficient of variation (standard deviation/mean) is 0.5, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2021 to 2024). The highest number of filings in 2015 with 33 cases, and their lowest number in 2020 with 4 cases.
Index | Value |
---|---|
Average | 10.0 patents |
Std Dev | 4.7 |
COV | 0.5 |
Year | Cases | YOY |
---|---|---|
2023 year | 13 cases | -13.33 % |
2022 year | 15 cases | +15.38 % |
2021 year | 13 cases | +225 % |
The following shows JP patents held by 含窒素連結基の形式による高分子化合物一般技術 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and 含窒素連結基の形式による高分子化合物一般技術’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which 含窒素連結基の形式による高分子化合物一般技術 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
In the last 3 years (2022-01-01 ~ 2024-12-31), there were 24 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7453260 "硬化性樹脂組成物、樹脂膜、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス" (Opposition day 2024-09-09) , next is 特許7382810 "光学フィルム" (Opposition day 2024-04-15) .
- | No. | Title | Opposition days |
---|---|---|---|
1 | 特許7453260 | 硬化性樹脂組成物、樹脂膜、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス | 2024-09-09 |
2 | 特許7382810 | 光学フィルム | 2024-04-15 |
3 | 特許7332479 | 樹脂材料、積層構造体及び多層プリント配線板 | 2024-02-20 |
4 | 特許7320334 | 新規なジアミン及びその製造方法、並びに該ジアミンより製造されるポリアミック酸及びポリイミド | 2024-01-26 |
5 | 特許7306542 | 樹脂組成物、半導体用配線層積層体及び半導体装置 | 2023-12-27 |
6 | 特許7201860 | 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法 | 2023-07-05 |
7 | 特許7201859 | 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法 | 2023-06-26 |
8 | 特許7194313 | 硬化性樹脂組成物、仮固定材、及び、電子部品の製造方法 | 2023-06-12 |
9 | 特許7183377 | ポリイミド系樹脂 | 2023-06-02 |
10 | 特許7180459 | アルカリ可溶性樹脂溶液の製造方法 | 2023-05-29 |
In the last 3 years (2022-01-01 ~ 2024-12-31), there were 47 patents Protest from third parties. The average number of Protest is 1.7 times. The most recently Protest patent is 特表2023-534634 "誘電体膜形成組成物" (Protest day 2024-12-05) , next is 特開2023-174742 "不織布形成材料及びその使用" (Protest day 2024-11-20) .
- | No. | Title | Protest days |
---|---|---|---|
1 | 特表2023-534634 | 誘電体膜形成組成物 | 2024-12-05 |
2 | 特開2023-174742 | 不織布形成材料及びその使用 | 2024-11-20 |
3 | 特表2024-529230 | 折り畳み性能に優れた光学フィルム及びこれを含む表示装置 | 2024-11-06 |
4 | 特開2024-008858 | ポリアミド系フィルム、その製造方法、並びにそれを含むカバーウィンドウおよびディスプレイ装置 | 2024-10-22 |
5 | 特許7601043 | 感光性樹脂組成物 | 2024-08-23 |
6 | 特開2020-056011 | 樹脂フィルム、カバーレイフィルム、回路基板、樹脂付銅箔、金属張積層板、多層回路基板、ポリイミド及び接着剤樹脂組成物 | 2024-06-28 |
7 | 特許7578408 | ポリイミド、ポリイミド組成物、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | 2024-04-26 |
8 | 特開2022-150087 | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | 2024-04-16 |
9 | 特開2021-147610 | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | 2024-04-16 |
10 | 特許7469537 | ポリイミドの製造方法 | 2024-03-19 |
11 | 特開2022-160509 | ポリイミド樹脂組成物 | 2024-03-12 |
12 | 特許7517208 | 液晶配向剤、液晶配向膜、液晶素子及び液晶素子の製造方法 | 2024-02-19 |
13 | 特許7533102 | 電子材料 | 2024-01-26 |
14 | 特開2022-066412 | ポリイミドの製造方法 | 2024-01-10 |
15 | 特許7486279 | ポリイミドの製造方法 | 2024-01-09 |
16 | 特開2021-070824 | ポリイミド組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板 | 2023-12-13 |
17 | 特許7479781 | 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板 | 2023-12-12 |
18 | 特許7509512 | 不織布製造用ポリアミドイミド樹脂組成物 | 2023-11-22 |
19 | 特許7437454 | ポリアミド系フィルム、その製造方法、並びにそれを含むカバーウィンドウおよびディスプレイ装置 | 2023-11-02 |
20 | 特許7505981 | 電子デバイスで使用するためのポリマー | 2023-10-27 |
Of the patent applications filed in the last 10 years (2015-01-01 to 2024-12-31), 102 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.5. The most protest patent is 特許7479781 "金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板" (6 times) , and the next most protest patent is 特許7486279 "ポリイミドの製造方法" (6 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許7479781 | 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板 | 6 times |
2 | 特許7486279 | ポリイミドの製造方法 | 6 times |
3 | 特許7381185 | 回路基板及び多層回路基板 | 4 times |
4 | 特許7042765 | 電極用バインダー樹脂組成物、電極合剤ペースト、及び電極の製造方法 | 4 times |
5 | 特許7016605 | タッチパネル用積層体、及び、折り畳み式画像表示装置 | 4 times |
In the last 3 years (2022-01-01 ~ 2024-12-31), there were 58 patents Inspection from third parties. The average number of Inspection is 1.8 times. The most recently Inspection patent is 特開2021-095558 "ポリイミド前駆体溶液及びポリイミド膜の製造方法" (Inspection day 2024-12-03) , next is 特開2023-174742 "不織布形成材料及びその使用" (Inspection day 2024-11-29) .
- | No. | Title | Inspection days |
---|---|---|---|
1 | 特開2021-095558 | ポリイミド前駆体溶液及びポリイミド膜の製造方法 | 2024-12-03 |
2 | 特開2023-174742 | 不織布形成材料及びその使用 | 2024-11-29 |
3 | 特許7578408 | ポリイミド、ポリイミド組成物、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | 2024-11-20 |
4 | 特開2023-131106 | 液晶配向剤、液晶配向膜及び液晶素子 | 2024-11-01 |
5 | 特許7601043 | 感光性樹脂組成物 | 2024-09-27 |
6 | 特開2020-056011 | 樹脂フィルム、カバーレイフィルム、回路基板、樹脂付銅箔、金属張積層板、多層回路基板、ポリイミド及び接着剤樹脂組成物 | 2024-07-02 |
7 | 特許5651953 | 液晶配向剤、及び液晶表示素子 | 2024-05-29 |
8 | 特許5594148 | 熱可塑性ポリイミド、積層体及びプリント配線板用基板 | 2024-05-17 |
9 | 特開2021-147610 | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | 2024-05-08 |
10 | 特開2022-150087 | ポリイミド、架橋ポリイミド、接着剤フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板、回路基板及び多層回路基板 | 2024-05-07 |
11 | 特許7469537 | ポリイミドの製造方法 | 2024-04-05 |
12 | 特許7517208 | 液晶配向剤、液晶配向膜、液晶素子及び液晶素子の製造方法 | 2024-03-28 |
13 | 特許7332479 | 樹脂材料、積層構造体及び多層プリント配線板 | 2024-03-25 |
14 | 特開2022-160509 | ポリイミド樹脂組成物 | 2024-03-21 |
15 | 特許7533102 | 電子材料 | 2024-02-07 |
16 | 特許7486279 | ポリイミドの製造方法 | 2024-01-23 |
17 | 特開2022-066412 | ポリイミドの製造方法 | 2024-01-19 |
18 | 特許7079227 | 溶剤可溶性ポリイミド樹脂の製造方法 | 2024-01-16 |
19 | 特許7479781 | 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板 | 2023-12-20 |
20 | 特開2021-070824 | ポリイミド組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板 | 2023-12-20 |
Of the patent applications filed in the last 10 years (2015-01-01 to 2024-12-31), 98 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.9. The most inspection patent is 特許7016605 "タッチパネル用積層体、及び、折り畳み式画像表示装置" (10 times) , and the next most inspection patent is 特開2016-130325 "ポリイミド及びポリイミド前駆体" (7 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許7016605 | タッチパネル用積層体、及び、折り畳み式画像表示装置 | 10 times |
2 | 特開2016-130325 | ポリイミド及びポリイミド前駆体 | 7 times |
3 | 特許7486279 | ポリイミドの製造方法 | 7 times |
4 | 特許7479781 | 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板 | 6 times |
5 | 特許7431039 | ポリアミド酸組成物およびその製造方法、ポリイミドフィルム、積層体およびその製造方法、ならびにフレキシブルデバイス | 5 times |
Of the patent applications filed in the last 10 years (2015-01-01 to 2024-12-31), 962 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.9. The most cited patent is 特開2016-125063 "表示装置用ウィンドウフィルムおよびこれを含む表示装置" (32 times) , and the next most cited patent is 特許6550872 "プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置" (30 times) .
- | No. | Title | |
---|---|---|---|
1 | 特開2016-125063 | 表示装置用ウィンドウフィルムおよびこれを含む表示装置 | 32 times |
2 | 特許6550872 | プリント配線基板用樹脂組成物、プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置 | 30 times |
3 | 特許6492688 | 液晶配向剤、液晶配向膜及びその製造方法、並びに液晶表示素子 | 28 times |
4 | 特許6922157 | 樹脂組成物、積層板及び多層プリント配線板 | 25 times |
5 | 特許7479781 | 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板 | 22 times |
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