The Theme Code "プリント配線の製造技術" had 49 patent application filings in the most recent period (2023-01-01 to 2023-03-31). This is a significantly decreased of -20 filings (-29.0%) over 69 they had in the same period of the previous year (2022-01-01 to 2022-03-31).
The highest number of filings in 2014 with 546 cases, and their lowest number in 2021 with 222 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 1,535 cases in total) is 256, and the median is 244. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
Index | Value |
---|---|
Average | 256 patents |
Std Dev | 95.0 |
COV | 0.4 |
The number of filings has been decreasing for the last 3 years (2020 to 2023).
Year | Cases | YOY |
---|---|---|
2022 year | 231 cases | +4.05 % |
2021 year | 222 cases | -13.28 % |
2020 year | 256 cases | -32.6 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for プリント配線の製造技術[5E343] for the period of the last 10 years (2014-01-01 to 2024-11-30). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of プリント配線の製造技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
The changes in the number of patent filings of プリント配線の製造技術 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for プリント配線の製造技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
In addition, by visually representing the patent data in this manner, you can convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
In Patent Integration, you can check the specifics of a patent filing by clicking anywhere on the patent landscape screen. You can also quickly check the position of each applicant for each technical field by cross-referencing with other keywords and patent classifications. You can use it as a guide when considering hypotheses about each company's IP strategy on the IP Landscape. You can also use it for higher-grade intellectual property activities. It has reasonable pricing and a simple user interface that is easy for beginners to handle.
The following is a list of words (characteristic terms) often used in プリント配線の製造技術 patent applications. Characteristic terms with a higher importance are used in more patents/patent applications.
This patent analysis report was created for a patent search set of 3,515 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
The patent information of the higher applicant in the technical theme プリント配線の製造技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Comparing the number of applications of each company, イビデン株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 61 cases, followed by 株式会社レゾナック with 7 cases.
Name | Cases |
---|---|
イビデン株式会社 | 61 cases |
株式会社レゾナック | 7 cases |
株式会社東芝 | 3 cases |
京セラ株式会社 | 2 cases |
セイコーエプソン株式会社 | 2 cases |
Comparing the number of applications of each company, 株式会社レゾナック has the highest number of joint applications in the last for the target period (2014 to 2024) with 189 cases, followed by イビデン株式会社 with 149 cases.
Name | Cases |
---|---|
株式会社レゾナック | 189 cases |
イビデン株式会社 | 149 cases |
京セラ株式会社 | 72 cases |
富士通株式会社 | 31 cases |
株式会社東芝 | 23 cases |
セイコーエプソン株式会社 | 12 cases |
パナソニックホールディングス株式会社 | 3 cases |
日本電気株式会社 | 1 cases |
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
The patent information of the higher applicant in the technical theme プリント配線の製造技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
among the top coapplicants, イビデン株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 61 cases, followed by 株式会社レゾナック with 7 cases.
among the top coapplicants, 株式会社レゾナック has the highest number of joint applications in the last for the target period (2014 to 2024) with 189 cases, followed by イビデン株式会社 with 149 cases.
Name | Cases |
---|---|
株式会社レゾナック | 189 cases |
イビデン株式会社 | 149 cases |
京セラ株式会社 | 72 cases |
富士通株式会社 | 31 cases |
パナソニックホールディングス株式会社 | 3 cases |
Below is a ranking of the number of JP patent applications by プリント配線の製造技術’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by プリント配線の製造技術’s top 7 coapplicants over the last 20 years.
プリント配線の製造技術 filed 189 joint applications with 株式会社レゾナック for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 54 cases in total) is 9.0, and the median is 5.0. The coefficient of variation (standard deviation/mean) is 0.9, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2017 with 43 cases, and their lowest number in 2022 with 5 cases.
Index | Value |
---|---|
Average | 9.0 patents |
Std Dev | 8.4 |
COV | 0.9 |
Year | Cases | YOY |
---|---|---|
2022 year | 5 cases | 0 |
2021 year | 5 cases | 0 |
2020 year | 5 cases | -81.5 % |
プリント配線の製造技術 filed 3 joint applications with パナソニックホールディングス株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 10 years (2013 to 2023, 4 cases in total) is 0.4, and the median is 0. The coefficient of variation (standard deviation/mean) is 1.8, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2015 with 2 cases, and their lowest number in 2022 with 0 cases.
Index | Value |
---|---|
Average | 0.4 patents |
Std Dev | 0.6 |
COV | 1.8 |
Year | Cases | YOY |
---|---|---|
2015 year | 2 cases | +100 % |
2014 year | 1 cases | 0 |
2013 year | 1 cases | - |
プリント配線の製造技術 filed 31 joint applications with 富士通株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 2 cases in total) is 0.3, and the median is 0. The coefficient of variation (standard deviation/mean) is 1.4, and there have been very big fluctuations in the number of filings from year to year.
The highest number of filings in 2015 with 11 cases, and their lowest number in 2022 with 0 cases.
Index | Value |
---|---|
Average | 0.3 patents |
Std Dev | 0.5 |
COV | 1.4 |
Year | Cases | YOY |
---|---|---|
2019 year | 1 cases | 0 |
2018 year | 1 cases | -80.0 % |
2017 year | 5 cases | +66.7 % |
プリント配線の製造技術 filed 149 joint applications with イビデン株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 108 cases in total) is 18.0, and the median is 14.0. The coefficient of variation (standard deviation/mean) is 0.7, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been increasing for the last 3 years (2020 to 2023). The highest number of filings in 2022 with 45 cases, and their lowest number in 2016 with 5 cases.
Index | Value |
---|---|
Average | 18.0 patents |
Std Dev | 13.1 |
COV | 0.7 |
Year | Cases | YOY |
---|---|---|
2022 year | 45 cases | +114 % |
2021 year | 21 cases | +75.0 % |
2020 year | 12 cases | +50.0 % |
プリント配線の製造技術 filed 72 joint applications with 京セラ株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 21 cases in total) is 3.5, and the median is 3.5. The coefficient of variation (standard deviation/mean) is 0.6, and there have been relatively large fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2015 with 24 cases, and their lowest number in 2022 with 2 cases.
Index | Value |
---|---|
Average | 3.5 patents |
Std Dev | 2.2 |
COV | 0.6 |
Year | Cases | YOY |
---|---|---|
2022 year | 2 cases | -50.0 % |
2021 year | 4 cases | +33.3 % |
2020 year | 3 cases | -40.0 % |
The following shows JP patents held by プリント配線の製造技術 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and プリント配線の製造技術’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which プリント配線の製造技術 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 21 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7472742 "導電パターン付き基板の製造方法およびLED実装回路基板の製造方法" (Opposition day 2024-10-21) , next is 特許7420555 "セラミックス回路基板" (Opposition day 2024-07-18) .
- | No. | Title | Opposition days |
---|---|---|---|
1 | 特許7472742 | 導電パターン付き基板の製造方法およびLED実装回路基板の製造方法 | 2024-10-21 |
2 | 特許7420555 | セラミックス回路基板 | 2024-07-18 |
3 | 特許7415813 | 銅張積層板および銅張積層板の製造方法 | 2024-07-10 |
4 | 特許7330382 | 複合基板 | 2024-02-02 |
5 | 特許7278336 | 電子インタフェースを備えた電子カード | 2023-11-17 |
6 | 特許7266454 | 配線基板、積層型配線基板、及び配線基板の製造方法 | 2023-10-27 |
7 | 特許7243888 | セラミックス基板、セラミックス分割基板、及びセラミックス基板の製造方法 | 2023-09-05 |
8 | 特許7197677 | 接合基板 | 2023-06-27 |
9 | 特許7162576 | 電子インタフェースを備えた電子カード | 2023-04-26 |
10 | 特許7151758 | 銅張積層板および銅張積層板の製造方法 | 2023-03-30 |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 19 patents Protest from third parties. The average number of Protest is 1.5 times. The most recently Protest patent is 特開2022-121771 "無電解めっき用触媒液" (Protest day 2024-11-07) , next is 特開2024-061816 "スクリーンマスクの製造方法" (Protest day 2024-07-19) .
- | No. | Title | Protest days |
---|---|---|---|
1 | 特開2022-121771 | 無電解めっき用触媒液 | 2024-11-07 |
2 | 特開2024-061816 | スクリーンマスクの製造方法 | 2024-07-19 |
3 | 特許7452560 | プリント配線板の製造方法 | 2023-09-15 |
4 | 特許7427455 | 接着フィルム、プリント配線板及び半導体装置 | 2023-07-11 |
5 | 特許7473761 | 成形フィルムおよびその製造方法、成形体およびその製造方法 | 2023-05-30 |
6 | 特許7278215 | セラミックス回路基板の製造方法 | 2022-12-16 |
7 | 特許7334438 | 絶縁回路基板の製造方法及びその絶縁回路基板 | 2022-12-15 |
8 | 特許7391762 | 導電性ペースト、および、セラミック配線基板の製造方法 | 2022-11-18 |
9 | 特許7335614 | スクリーンマスク、スクリーンマスクの製造方法及び印刷物の製造方法 | 2022-10-28 |
10 | 特許7386514 | スクリーン印刷版 | 2022-10-27 |
11 | 特許7454762 | スクリーン印刷装置およびスクリーン印刷方法 | 2022-08-25 |
12 | 特開2021-037718 | スクリーンマスク及びスクリーンマスクの製造方法 | 2022-08-11 |
13 | 特開2020-004524 | 真空印刷用導電性ペースト | 2022-06-20 |
14 | 特許7410872 | セラミックス-銅複合体、セラミックス-銅複合体の製造方法、セラミックス回路基板およびパワーモジュール | 2022-06-01 |
15 | 特許7234743 | 接合体、及び、絶縁回路基板 | 2022-05-26 |
16 | 特許7055096 | 展延性導電ペーストおよび曲面プリント配線板の製造方法 | 2022-03-11 |
17 | 特開2019-151731 | CNTインク、スクリーン印刷用インク、及びCNT膜の製造方法 | 2022-02-17 |
18 | 特許7320839 | リンス剤及びリンス剤の使用方法 | 2022-02-10 |
19 | 再公表2019/035237 | 樹脂フィルム、プリント配線板用基材及びプリント配線板 | 2022-02-02 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 38 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.3. The most protest patent is 特許7278215 "セラミックス回路基板の製造方法" (3 times) , and the next most protest patent is 特許7055096 "展延性導電ペーストおよび曲面プリント配線板の製造方法" (3 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許7278215 | セラミックス回路基板の製造方法 | 3 times |
2 | 特許7055096 | 展延性導電ペーストおよび曲面プリント配線板の製造方法 | 3 times |
3 | 特開2020-004524 | 真空印刷用導電性ペースト | 3 times |
4 | 特開2020-057799 | プリント配線板用基板、プリント配線板、プリント配線板用基板の製造方法、及びプリント配線板の製造方法 | 2 times |
5 | 特開2022-121771 | 無電解めっき用触媒液 | 2 times |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 22 patents Inspection from third parties. The average number of Inspection is 1.7 times. The most recently Inspection patent is 特表2023-534297 "回路基板、回路デバイス、印刷材料容器アセンブリ" (Inspection day 2024-11-12) , next is 特許7452560 "プリント配線板の製造方法" (Inspection day 2023-10-02) .
- | No. | Title | Inspection days |
---|---|---|---|
1 | 特表2023-534297 | 回路基板、回路デバイス、印刷材料容器アセンブリ | 2024-11-12 |
2 | 特許7452560 | プリント配線板の製造方法 | 2023-10-02 |
3 | 特許7427455 | 接着フィルム、プリント配線板及び半導体装置 | 2023-07-21 |
4 | 特開2021-019188 | 印刷された導電性線分を製造するためのシステム、装置、及び方法 | 2023-06-19 |
5 | 特許7473761 | 成形フィルムおよびその製造方法、成形体およびその製造方法 | 2023-06-07 |
6 | 特許7118394 | スクリーンマスクの製造方法 | 2023-02-13 |
7 | 特許7335614 | スクリーンマスク、スクリーンマスクの製造方法及び印刷物の製造方法 | 2022-12-20 |
8 | 特許7386514 | スクリーン印刷版 | 2022-11-30 |
9 | 特許7391762 | 導電性ペースト、および、セラミック配線基板の製造方法 | 2022-11-24 |
10 | 特許7454762 | スクリーン印刷装置およびスクリーン印刷方法 | 2022-09-21 |
11 | 特開2020-004524 | 真空印刷用導電性ペースト | 2022-06-28 |
12 | 特許6997104 | 高周波プリント配線板用基材 | 2022-06-01 |
13 | 特許7055096 | 展延性導電ペーストおよび曲面プリント配線板の製造方法 | 2022-05-25 |
14 | 特許7125534 | 印刷用メタルマスク | 2022-05-19 |
15 | 特許7125533 | 印刷用メタルマスクの製造方法 | 2022-05-19 |
16 | 特許7568296 | 透明導電回路 | 2022-05-17 |
17 | 特許7176847 | 分散体、塗膜を含む製品、導電性パターン付き構造体の製造方法、及び、導電性パターン付き構造体 | 2022-04-26 |
18 | 再公表2019/035237 | 樹脂フィルム、プリント配線板用基材及びプリント配線板 | 2022-02-24 |
19 | 特許7320839 | リンス剤及びリンス剤の使用方法 | 2022-02-24 |
20 | 特許6733266 | 感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品 | 2022-02-17 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 59 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.3. The most inspection patent is 特許7055096 "展延性導電ペーストおよび曲面プリント配線板の製造方法" (4 times) , and the next most inspection patent is 特開2018-182126 "パターン形成用シート、パターン製造装置およびパターン製造方法" (4 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許7055096 | 展延性導電ペーストおよび曲面プリント配線板の製造方法 | 4 times |
2 | 特開2018-182126 | パターン形成用シート、パターン製造装置およびパターン製造方法 | 4 times |
3 | 特許7118394 | スクリーンマスクの製造方法 | 4 times |
4 | 特許6733266 | 感光性樹脂組成物、感光性樹脂フィルム、硬化物の製造方法、積層体、及び電子部品 | 3 times |
5 | 特開2020-004524 | 真空印刷用導電性ペースト | 2 times |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 759 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.7. The most cited patent is 特許6488189 "伸縮性配線基板" (22 times) , and the next most cited patent is 特許6679265 "印刷装置" (18 times) .
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