The Theme Code "エポキシ樹脂技術" had 100 patent application filings in the most recent period (2023-01-01 to 2023-03-31). This is a significantly decreased of -47 filings (-32.0%) over 147 they had in the same period of the previous year (2022-01-01 to 2022-03-31).
The highest number of filings in 2016 with 891 cases, and their lowest number in 2021 with 439 cases.
The mean of the number of filings over the last 5 years (2018 to 2023, 3,181 cases in total) is 530, and the median is 498. The coefficient of variation (standard deviation/mean) is 0.4, and there have been big fluctuations in the number of filings from year to year.
Index | Value |
---|---|
Average | 530 patents |
Std Dev | 208 |
COV | 0.4 |
The number of filings has been decreasing for the last 3 years (2020 to 2023).
Year | Cases | YOY |
---|---|---|
2022 year | 443 cases | +0.91 % |
2021 year | 439 cases | -20.76 % |
2020 year | 554 cases | -20.06 % |
This report provides the latest patent analysis information (the IP landscape, including a patent map) on the patent search results of the JP patent database for エポキシ樹脂技術[4J036] for the period of the last 10 years (2014-01-01 to 2024-11-30). You can compare the information in this report with the trends in your competitors’ patent filings and technologies, and use it to search for important patents.
This service provides, free of charge, a patent analysis report based on the latest patent data (Japanese, U.S., European, and PCT application publications) for use in patent searches, patent analysis, and IP landscaping. The service is offered by "Patent Integration" a firm specializing in patent search/patent analysis.
This report includes basic information to help you understand the IP strategy and management of エポキシ樹脂技術, such as changes in the number of patents/patent applications they have filed, comparisons of the numbers of patents/patent applications filed by their peers and competitors, their top coapplicants (joint research partners, alliance partners), and their most important patents. It can be used in various intellectual property business operations such as IP landscaping, patent search/patent analysis, preparation of intellectual property business evaluation reports, selection of M&A candidates, and selection of alliance partners.
He is a patent attorney at a patent office. He specializes in invention counseling, patent filing, and intellectual property strategies for start-up companies and new businesses in the fields of software, information technology and artificial intelligence. He runs a patent course for beginners on Udemy, an online course provider.
After studying physics at the University of Tokyo as a doctoral student, he was engaged in intellectual property analysis and technology trend research as an in-house patent attorney at a precision equipment manufacturer and at Toyota Central R&D Labs. Inc..
The concept of the "IP landscape" (IPL) has been attracting attention recently.
An IP landscape is not limited to patent information, but also integrates and analyzes business information (e.g., non-patent information such as papers, news releases, stock information, and market information). Intellectual-property-based business management is realized through the analysis of intellectual property information applied to the formulation of management strategies and business strategies. This is a comprehensive approach that includes but not limited to planning of open and closed strategies, selecting M&A candidates, searching for alliance partners, and formulating intellectual property strategies, through the exploitation of intellectual property information.
IP landscaping usually includes patent search and patent analysis. In patent search and patent analysis, it is important to grasp the market position of each company and the overall technological trends and development trends for each technology. More specifically, it is important to understand what intellectual property your own company and other companies hold, what the strengths and weaknesses of other companies are, and how other companies are trying to exploit their intellectual property. In other words, it is important to understand both the business strategy and the intellectual property strategy of each company.
After reading this search report, you may be interested in more detailed patent searches and patent analysis. We offer a service called Patent Integration, which is an integrated patent search and patent analysis service. With reasonable pricing and a simple user interface such that even beginners can quickly search for and analyze patent information by company or technology from a web browser, please consider using it for detailed patent searches, patent analysis, and IP landscaping.
Patent Integration has a patent-landscaping function that can visually represent a set of tens of thousands of patents/patent applications. This allows you to convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
The changes in the number of patent filings of エポキシ樹脂技術 over the last 20 years (JP) are shown below.
The change in the number of patents/patent applications is the most basic index in patent analysis. By examining the change in the number of patents/patent applications, you can see the status of technological development and R&D focus for each company or technology. It should be noted that since there is a one and a half year lag between the filing and the laying open of patent applications, it is not possible to analyze the situation more recently than one and half years prior to the present.
In this report, you can only see the change in the number of patents/patent applications by company or technology, whereas Patent Integration allows you to quickly compare the number of patent applications with your competitors in each technical field by cross-referencing with other keywords and patent classifications.
Patent landscaping is a visualization of the distribution of patent filings (application focus areas) for each technical keyword. Mountains and islands indicated by heatmap contours represent clusters of patent applications filed, and red areas on the heatmap indicate many patent filings relating to the keyword.
The patent landscape for エポキシ樹脂技術 gives an intuitive understanding of what patent filings they have made and what technical position is to be established. By selecting filing year checkboxes and filtering, you can track their past filing trends (what technical area they have focused on).
By selecting applicant/patent holder checkboxes and filtering, you can visually grasp the technical areas of the filings for each applicant and the partnerships or alliances formed. Please use it as a guide for patent analysis and IP landscaping.
In addition, by visually representing the patent data in this manner, you can convincingly show the technical positions of your company and its competitors to your management and business strategists in order to formulate management strategies and business strategies.
In Patent Integration, you can check the specifics of a patent filing by clicking anywhere on the patent landscape screen. You can also quickly check the position of each applicant for each technical field by cross-referencing with other keywords and patent classifications. You can use it as a guide when considering hypotheses about each company's IP strategy on the IP Landscape. You can also use it for higher-grade intellectual property activities. It has reasonable pricing and a simple user interface that is easy for beginners to handle.
The following is a list of words (characteristic terms) often used in エポキシ樹脂技術 patent applications. Characteristic terms with a higher importance are used in more patents/patent applications.
This patent analysis report was created for a patent search set of 6,520 cases retrieved by applying the following search formula and analysis period to the following patent database. Patent information such as a patent analysis result, a patent map, and a patent landscape can be freely used for patent searches, analysis, and work on intellectual property strategies, including IP landscaping.
The patent information of the higher applicant in the technical theme エポキシ樹脂技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
Comparing the number of applications of each company, 住友ベークライト株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 58 cases, followed by DIC株式会社 with 44 cases.
Name | Cases |
---|---|
住友ベークライト株式会社 | 58 cases |
DIC株式会社 | 44 cases |
株式会社レゾナック | 23 cases |
日本化薬株式会社 | 21 cases |
東レ株式会社 | 21 cases |
積水化学工業株式会社 | 17 cases |
信越化学工業株式会社 | 15 cases |
日東電工株式会社 | 3 cases |
三井化学株式会社 | 2 cases |
Comparing the number of applications of each company, 株式会社レゾナック has the highest number of joint applications in the last for the target period (2014 to 2024) with 485 cases, followed by DIC株式会社 with 309 cases.
Name | Cases |
---|---|
株式会社レゾナック | 485 cases |
DIC株式会社 | 309 cases |
住友ベークライト株式会社 | 256 cases |
積水化学工業株式会社 | 252 cases |
日本化薬株式会社 | 232 cases |
東レ株式会社 | 188 cases |
信越化学工業株式会社 | 173 cases |
日東電工株式会社 | 43 cases |
三井化学株式会社 | 34 cases |
Below is a patent map showing changes in the number of applications for JP patents of 11 companies in the same industry over the past 20 years.
The patent information of the higher applicant in the technical theme エポキシ樹脂技術 is shown below. By comparing the number of patents of each company, you can check the research and development status of each company's past and present technical themes and the position of each company in the technical theme.
among the top coapplicants, 住友ベークライト株式会社 has the highest number of joint applications in the last in the last 3 years (2022 to 2024) with 58 cases, followed by DIC株式会社 with 44 cases.
among the top coapplicants, 株式会社レゾナック has the highest number of joint applications in the last for the target period (2014 to 2024) with 485 cases, followed by DIC株式会社 with 309 cases.
Below is a ranking of the number of JP patent applications by エポキシ樹脂技術’s top 7 coapplicants over the last 20 years.
Below is a patent map showing the changes in the numbers of JP patent filings by エポキシ樹脂技術’s top 7 coapplicants over the last 20 years.
エポキシ樹脂技術 filed 256 joint applications with 住友ベークライト株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 164 cases in total) is 27.3, and the median is 25.5. The coefficient of variation (standard deviation/mean) is 0.30, and there have been small fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2022 with 39 cases, and their lowest number in 2015 with 13 cases.
Index | Value |
---|---|
Average | 27.3 patents |
Std Dev | 8.2 |
COV | 0.30 |
Year | Cases | YOY |
---|---|---|
2022 year | 39 cases | +95.0 % |
2021 year | 20 cases | -45.9 % |
2020 year | 37 cases | +37.0 % |
エポキシ樹脂技術 filed 485 joint applications with 株式会社レゾナック for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 212 cases in total) is 35.3, and the median is 26.5. The coefficient of variation (standard deviation/mean) is 0.7, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2016 with 91 cases, and their lowest number in 2022 with 16 cases.
Index | Value |
---|---|
Average | 35.3 patents |
Std Dev | 26.1 |
COV | 0.7 |
Year | Cases | YOY |
---|---|---|
2022 year | 16 cases | -5.88 % |
2021 year | 17 cases | -52.8 % |
2020 year | 36 cases | -32.1 % |
エポキシ樹脂技術 filed 309 joint applications with DIC株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 183 cases in total) is 30.5, and the median is 30.5. The coefficient of variation (standard deviation/mean) is 0.3, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2018 with 46 cases, and their lowest number in 2016 with 21 cases.
Index | Value |
---|---|
Average | 30.5 patents |
Std Dev | 9.2 |
COV | 0.3 |
Year | Cases | YOY |
---|---|---|
2022 year | 28 cases | -15.15 % |
2021 year | 33 cases | 0 |
2020 year | 33 cases | +17.86 % |
エポキシ樹脂技術 filed 232 joint applications with 日本化薬株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 79 cases in total) is 13.2, and the median is 11.0. The coefficient of variation (standard deviation/mean) is 0.5, and there have been big fluctuations in the number of filings from year to year.
The number of filings has been decreasing for the last 3 years (2020 to 2023). The highest number of filings in 2014 with 59 cases, and their lowest number in 2021 with 6 cases.
Index | Value |
---|---|
Average | 13.2 patents |
Std Dev | 7.1 |
COV | 0.5 |
Year | Cases | YOY |
---|---|---|
2022 year | 11 cases | +83.3 % |
2021 year | 6 cases | -45.5 % |
2020 year | 11 cases | -21.43 % |
エポキシ樹脂技術 filed 43 joint applications with 日東電工株式会社 for the analysis period (2014 to 2024).
The mean of the number of filings over the last 5 years (2018 to 2023, 17 cases in total) is 2.8, and the median is 2.5. The coefficient of variation (standard deviation/mean) is 0.7, and there have been relatively large fluctuations in the number of filings from year to year.
The highest number of filings in 2014 with 14 cases, and their lowest number in 2019 with 1 cases.
Index | Value |
---|---|
Average | 2.8 patents |
Std Dev | 2.0 |
COV | 0.7 |
Year | Cases | YOY |
---|---|---|
2022 year | 2 cases | -33.3 % |
2021 year | 3 cases | -57.1 % |
2020 year | 7 cases | +600 % |
The following shows JP patents held by エポキシ樹脂技術 that have had an invalidation trial against them demanded or an opposition filed against them by a third party, and エポキシ樹脂技術’s JP patents/patent applications of high importance cited by Examiners in patent examination processes.
By noting the most important patents, you can obtain knowledge of the competitive business environment in which エポキシ樹脂技術 is placed (e.g., whether it is a fiercely competitive environment or an oligopolistic market and the like). In general, it can be understood that a company with a large number of demands for invalidation trials is developing their business in a business environment where IP disputes are common.
If you want to search for more detailed information, you can use Patent Integration to retrieve and download by company cited patents/patent applications or patents undergoing invalidation trials. You can quickly extract important patents from a patent set that includes multiple competitors by cross-referencing with other keywords and patent classifications. Please consider using it for searches for important patents/patent applications.
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 26 patents Opposition from third parties. The average number of Opposition is 1.0 times. The most recently Opposition patent is 特許7437695 "熱硬化性組成物、硬化物、機器、及び機器の製造方法" (Opposition day 2024-08-13) , next is 特許7404127 "エポキシ樹脂組成物" (Opposition day 2024-06-21) .
- | No. | Title | Opposition days |
---|---|---|---|
1 | 特許7437695 | 熱硬化性組成物、硬化物、機器、及び機器の製造方法 | 2024-08-13 |
2 | 特許7404127 | エポキシ樹脂組成物 | 2024-06-21 |
3 | 特許7455017 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-05-20 |
4 | 特許7454906 | アンダーフィル材、電子部品装置及び電子部品装置の製造方法 | 2024-05-20 |
5 | 特許7367891 | 樹脂シート | 2024-04-18 |
6 | 特許7337462 | エポキシ樹脂組成物 | 2024-02-21 |
7 | 特許7294146 | 着色感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明 | 2023-12-20 |
8 | 特許7243091 | エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料 | 2023-09-15 |
9 | 特許7243164 | VaRTM成形用樹脂組成物、成形材料、成形品及び成形品の製造方法 | 2023-08-31 |
10 | 特許7203577 | 硬化性樹脂組成物 | 2023-07-12 |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 109 patents Protest from third parties. The average number of Protest is 1.5 times. The most recently Protest patent is 特開2023-139012 "樹脂組成物、及び、これを用いたカバーレイフィルム、接着剤シート、樹脂付き金属箔、金属張積層板またはプリント配線板" (Protest day 2024-11-20) , next is 特開2022-168750 "エポキシ樹脂組成物、エポキシ樹脂硬化物、エポキシ樹脂分解性組成物、リサイクル硬化物、エポキシ樹脂硬化物の分解方法、リサイクル方法、単量体化合物、二量体化合物および三量体化合物とその硬化物" (Protest day 2024-11-01) .
- | No. | Title | Protest days |
---|---|---|---|
1 | 特開2023-139012 | 樹脂組成物、及び、これを用いたカバーレイフィルム、接着剤シート、樹脂付き金属箔、金属張積層板またはプリント配線板 | 2024-11-20 |
2 | 特開2022-168750 | エポキシ樹脂組成物、エポキシ樹脂硬化物、エポキシ樹脂分解性組成物、リサイクル硬化物、エポキシ樹脂硬化物の分解方法、リサイクル方法、単量体化合物、二量体化合物および三量体化合物とその硬化物 | 2024-11-01 |
3 | 特開2022-124461 | 電磁波シールドフィルム、及び電磁波シールドフィルム付きプリント配線板 | 2024-10-31 |
4 | 特表2024-524951 | 生分解性高吸水性樹脂およびその製造方法 | 2024-10-21 |
5 | 特開2022-064864 | 磁性ペースト | 2024-10-18 |
6 | 特開2023-096749 | エポキシ樹脂組成物、フィルム材、及び硬化物 | 2024-10-18 |
7 | 特開2022-060063 | エポキシ樹脂組成物及び電子部品装置 | 2024-10-09 |
8 | 再公表2019/198242 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-10-04 |
9 | 特開2023-035684 | 熱硬化性組成物 | 2024-09-11 |
10 | 特許7589435 | 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-09-04 |
11 | 特許7593042 | 硬化性組成物 | 2024-08-23 |
12 | 特開2022-083401 | 発泡シート、製造物、成形体及び発泡シートの製造方法 | 2024-07-19 |
13 | 特許7601143 | 樹脂組成物 | 2024-06-17 |
14 | 特許7571407 | 封止用樹脂組成物及び電子部品装置 | 2024-06-14 |
15 | 特開2023-023598 | アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-06-14 |
16 | 特開2022-070657 | 樹脂組成物 | 2024-06-12 |
17 | 特開2022-178390 | エポキシ樹脂組成物、エポキシ樹脂接着剤、及びエポキシ樹脂硬化物 | 2024-06-03 |
18 | 特開2023-008549 | エポキシ樹脂組成物 | 2024-06-03 |
19 | 特表2023-502717 | 積層品のための高いガラス転移温度を有する組成物 | 2024-05-29 |
20 | 特許7596118 | エポキシ樹脂組成物の製造方法、そのエポキシ樹脂組成物を用いた液体吐出ヘッド、及びその液体吐出ヘッドの製造方法 | 2024-05-28 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 199 patents/patent applications were protest more than once in the examination process of other patent applications. The mean of the number of protest is 1.4. The most protest patent is 特開2021-119239 "アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法" (5 times) , and the next most protest patent is 特許7241695 "感光性樹脂組成物、ドライフィルムレジスト及びそれらの硬化物" (4 times) .
- | No. | Title | |
---|---|---|---|
1 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 5 times |
2 | 特許7241695 | 感光性樹脂組成物、ドライフィルムレジスト及びそれらの硬化物 | 4 times |
3 | 特開2019-183048 | 光熱併用硬化型樹脂組成物、接着剤及びその硬化物 | 4 times |
4 | 特許7302331 | 樹脂組成物 | 4 times |
5 | 特許7285619 | 剥離シートおよび剥離シートの製造方法 | 4 times |
In the last 3 years (2021-12-01 ~ 2024-11-30), there were 116 patents Inspection from third parties. The average number of Inspection is 1.7 times. The most recently Inspection patent is 特開2023-139012 "樹脂組成物、及び、これを用いたカバーレイフィルム、接着剤シート、樹脂付き金属箔、金属張積層板またはプリント配線板" (Inspection day 2024-11-21) , next is 特開2022-060063 "エポキシ樹脂組成物及び電子部品装置" (Inspection day 2024-11-20) .
- | No. | Title | Inspection days |
---|---|---|---|
1 | 特開2023-139012 | 樹脂組成物、及び、これを用いたカバーレイフィルム、接着剤シート、樹脂付き金属箔、金属張積層板またはプリント配線板 | 2024-11-21 |
2 | 特開2022-060063 | エポキシ樹脂組成物及び電子部品装置 | 2024-11-20 |
3 | 特開2022-064864 | 磁性ペースト | 2024-11-19 |
4 | 特開2022-168750 | エポキシ樹脂組成物、エポキシ樹脂硬化物、エポキシ樹脂分解性組成物、リサイクル硬化物、エポキシ樹脂硬化物の分解方法、リサイクル方法、単量体化合物、二量体化合物および三量体化合物とその硬化物 | 2024-11-12 |
5 | 特開2022-124461 | 電磁波シールドフィルム、及び電磁波シールドフィルム付きプリント配線板 | 2024-11-06 |
6 | 特開2023-096749 | エポキシ樹脂組成物、フィルム材、及び硬化物 | 2024-10-22 |
7 | 再公表2019/198242 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 | 2024-10-17 |
8 | 特許7589435 | 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-10-09 |
9 | 特開2023-035684 | 熱硬化性組成物 | 2024-09-27 |
10 | 特許7593042 | 硬化性組成物 | 2024-08-29 |
11 | 特許7596118 | エポキシ樹脂組成物の製造方法、そのエポキシ樹脂組成物を用いた液体吐出ヘッド、及びその液体吐出ヘッドの製造方法 | 2024-08-07 |
12 | 特開2022-083401 | 発泡シート、製造物、成形体及び発泡シートの製造方法 | 2024-07-23 |
13 | 特許7571407 | 封止用樹脂組成物及び電子部品装置 | 2024-07-18 |
14 | 特開2023-023598 | アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法 | 2024-07-18 |
15 | 特許7601143 | 樹脂組成物 | 2024-07-01 |
16 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 2024-06-26 |
17 | 特開2022-070657 | 樹脂組成物 | 2024-06-24 |
18 | 特開2022-178390 | エポキシ樹脂組成物、エポキシ樹脂接着剤、及びエポキシ樹脂硬化物 | 2024-06-05 |
19 | 特開2023-008549 | エポキシ樹脂組成物 | 2024-06-05 |
20 | 特開2022-142673 | 光硬化性樹脂組成物、光学部品、光学部品の製造方法、発光装置、及び発光装置の製造方法 | 2024-06-04 |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 206 patents/patent applications were inspection more than once in the examination process of other patent applications. The mean of the number of inspection is 1.5. The most inspection patent is 特開2021-119239 "アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法" (9 times) , and the next most inspection patent is 特許7018168 "感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法" (9 times) .
- | No. | Title | |
---|---|---|---|
1 | 特開2021-119239 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 | 9 times |
2 | 特許7018168 | 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法 | 9 times |
3 | 特許7302331 | 樹脂組成物 | 6 times |
4 | 特許6887687 | 樹脂組成物、接着剤、封止材、ダム剤、半導体装置、およびイメージセンサーモジュール | 5 times |
5 | 特開2019-183048 | 光熱併用硬化型樹脂組成物、接着剤及びその硬化物 | 4 times |
Of the patent applications filed in the last 10 years (2014-12-01 to 2024-11-30), 1,686 patents/patent applications were cited more than once in the examination process of other patent applications. The mean of the number of cited is 2.8. The most cited patent is 特許6672616 "樹脂組成物、接着フィルム、プリント配線板及び半導体装置" (34 times) , and the next most cited patent is 特許6503725 "エポキシ樹脂組成物、樹脂シート、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物及び金属基板" (26 times) .
- | No. | Title | |
---|---|---|---|
1 | 特許6672616 | 樹脂組成物、接着フィルム、プリント配線板及び半導体装置 | 34 times |
2 | 特許6503725 | エポキシ樹脂組成物、樹脂シート、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物及び金属基板 | 26 times |
3 | 特許6074698 | 熱硬化性接着シート、およびその利用 | 21 times |
4 | 特許6903897 | エポキシ樹脂組成物、並びにこれを用いた成形品、プリプレグ及び繊維強化プラスチック | 20 times |
5 | 特許6304271 | 封止用エポキシ樹脂成形材料及び電子部品装置 | 19 times |
"Patent Integration Report" is a web service provided by "Patent Integration Co., Ltd." operated by patent attorneys who are experts in intellectual property rights. Based on the latest patent data, this is one of the largest patent report services in Japan that provides information on technology trends in various companies and technology fields.
The purpose of this web service is to make intellectual property information familiar to many people, regardless of whether they have an interest in intellectual property rights, and to make use of it.
We actively provide various types of patent information that can be used in various media articles such as newspapers, magazines, and web media. Please feel free to contact us from "Inquiry form for details on the content of patent information that can be provided, conditions for provision, etc. Please contact us.
All rights related to the data, documents and charts belong to "an integrated patent search/analysis service provider, Patent Integration". Please specify the source “Patent Integration Report, URL: https://patent-i.com/report/en/" when inserting them into in-house materials, external report materials, etc., regardless of whether they are paid or free of charge.
Patent data is obtained by aggregating and analyzing the latest patent data issued by the Patent Offices of respective countries and jurisdictions and by WIPO. Although we take great care in publishing and analyzing the results, we do not guarantee the correctness of the data. We appreciate your understanding.
If you have any concerns about this service, please feel free to contact us.
All rights to the data, documents, figures and tables are reserved by e-Patent. When publishing internal documents, external reports, etc. (whether paid or free of charge), please use the following URL: https://e-patent.co.jp/.
e-Patent will not be liable for any damages or losses arising from the use of the global patent application status, ranking information, or population search formula in the "SDGs Global Company Ranking from a Patent Perspective". Items with ● in front of the target are not supported at this time (judged to be difficult to approach from the patent information analysis).
There is no problem to cite patent application status and ranking information, but please clearly indicate "Source: e-Patent Co.
Credit notation
・MeCab user dictionary for science technology term © National Bioscience Database Center licensed under CC Attribution-Share Alike 4.0 International